Kunzhong (Kevin) Hu

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very fine pitch and wiring density organic side by side chiplet int...
- Patent number 12,119,304
- Issue date Oct 15, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 11,831,312
- Issue date Nov 28, 2023
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 11,824,015
- Issue date Nov 21, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a hybrid thermal interface material an...
- Patent number 11,749,631
- Issue date Sep 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,735,526
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,735,567
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stitching and harvesting of arrayed structures
- Patent number 11,728,266
- Issue date Aug 15, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module trenched lid and low coefficient of thermal ex...
- Patent number 11,646,302
- Issue date May 9, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 11,594,494
- Issue date Feb 28, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 11,587,909
- Issue date Feb 21, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable extreme large size substrate integration
- Patent number 11,404,337
- Issue date Aug 2, 2022
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 11,309,895
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,309,246
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side mounted large MCM package with memory channel length re...
- Patent number 11,158,621
- Issue date Oct 26, 2021
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,158,607
- Issue date Oct 26, 2021
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D fanout stacking
- Patent number 11,056,373
- Issue date Jul 6, 2021
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 10,943,869
- Issue date Mar 9, 2021
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 10,818,632
- Issue date Oct 27, 2020
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 10,770,433
- Issue date Sep 8, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 10,742,217
- Issue date Aug 11, 2020
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double side mounted large MCM package with memory channel length re...
- Patent number 10,685,948
- Issue date Jun 16, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D thin profile pre-stacking architecture using reconstitution method
- Patent number 10,181,455
- Issue date Jan 15, 2019
- Apple Inc.
- Jun Zhai
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual-sided silicon integrated passive devices
- Patent number 10,103,138
- Issue date Oct 16, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOC with integrated voltage regulator using preformed MIM capacitor...
- Patent number 10,056,327
- Issue date Aug 21, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 9,935,076
- Issue date Apr 3, 2018
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
- Publication number 20250014960
- Publication date Jan 9, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES
- Publication number 20250015027
- Publication date Jan 9, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Redistribution Layer Structures for Stress Mitigation and A...
- Publication number 20240395686
- Publication date Nov 28, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Upside-Down DRAM Package Structure
- Publication number 20240315054
- Publication date Sep 19, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105702
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105704
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20240038689
- Publication date Feb 1, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20240039539
- Publication date Feb 1, 2024
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20230402373
- Publication date Dec 14, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20230335494
- Publication date Oct 19, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...
- Publication number 20230317708
- Publication date Oct 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20230154897
- Publication date May 18, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20230085890
- Publication date Mar 23, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20230040308
- Publication date Feb 9, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20230017445
- Publication date Jan 19, 2023
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20220285273
- Publication date Sep 8, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20220231687
- Publication date Jul 21, 2022
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20220199517
- Publication date Jun 23, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20220102280
- Publication date Mar 31, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20220013504
- Publication date Jan 13, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Thermal Interface Material and Low Temperature Solder Patter...
- Publication number 20210366861
- Publication date Nov 25, 2021
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...
- Publication number 20210305227
- Publication date Sep 30, 2021
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Kunzhong (Kevin) Hu

Person

Patents Grantslast 30 patents

High density 3D interconnect configuration

Very fine pitch and wiring density organic side by side chiplet int...

Selectable monolithic or external scalable die-to-die interconnecti...

Structure and method for fabricating a computing system with an int...

Selectable monolithic or external scalable die-to-die interconnecti...

Systems and methods for implementing a scalable system

Structure and method for sealing a silicon IC

Electronic package including a hybrid thermal interface material an...

High density 3D interconnect configuration

Wafer reconstitution and die-stitching

Die stitching and harvesting of arrayed structures

Structure and method for fabricating a computing system with an int...

Multiple chip module trenched lid and low coefficient of thermal ex...

High density interconnection using fanout interposer chiplet

High bandwidth die to die interconnect with package area reduction

Scalable extreme large size substrate integration

Systems and methods for implementing a scalable system

High density 3D interconnect configuration

Double side mounted large MCM package with memory channel length re...

Wafer reconstitution and die-stitching

3D fanout stacking

High density interconnection using fanout interposer chiplet

Structure and method for fabricating a computing system with an int...

High bandwidth die to die interconnect with package area reduction

Systems and methods for implementing a scalable system

Double side mounted large MCM package with memory channel length re...

3D thin profile pre-stacking architecture using reconstitution method

Dual-sided silicon integrated passive devices

SOC with integrated voltage regulator using preformed MIM capacitor...

Structure and method for fabricating a computing system with an int...

Patents Applicationslast 30 patents

MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES

Package Redistribution Layer Structures for Stress Mitigation and A...

Upside-Down DRAM Package Structure

Structure and Method for Fabricating a Computing System with an Int...

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

Semiconductor Package with Local Interconnect and Chiplet Integration

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

Structure and Method for Sealing a Silicon IC

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

WAFER RECONSTITUTION AND DIE-STITCHING

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

Structure and Method for Fabricating a Computing System with an Int...

High Density 3D Interconnect Configuration

Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...

Harvested Reconstitution Bumping

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

Structure and Method for Sealing a Silicon IC

Scalable Extreme Large Size Substrate Integration

High Density 3D Interconnect Configuration

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

WAFER RECONSTITUTION AND DIE-STITCHING

Hybrid Thermal Interface Material and Low Temperature Solder Patter...

Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...