Kurt G. Steiner

Person

Orlando, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Acoustic filtering circuitry including capacitor
- Patent number 10,476,481
- Issue date Nov 12, 2019
- Qorvo US, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Guided acoustic wave device
- Patent number 10,469,050
- Issue date Nov 5, 2019
- Qorvo US, Inc.
- Kevin J. Gamble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave filter with a cap layer for improved reliability
- Patent number 9,973,169
- Issue date May 15, 2018
- Qorvo US, Inc.
- Kurt G. Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods, systems, and apparatuses for temperature compensated surfa...
- Patent number 9,331,667
- Issue date May 3, 2016
- TriQuint Semiconductor, Inc.
- Kurt Steiner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Acoustic wave device
- Patent number 9,209,380
- Issue date Dec 8, 2015
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High coupling, low loss saw filter and associated method
- Patent number 8,552,819
- Issue date Oct 8, 2013
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave guide device and method for minimizing trimming effec...
- Patent number 8,294,331
- Issue date Oct 23, 2012
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bond pad support structure for semiconductor device
- Patent number 8,183,698
- Issue date May 22, 2012
- Agere Systems Inc.
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating a semiconductor wafer into individual semicon...
- Patent number 8,119,501
- Issue date Feb 21, 2012
- Agere Systems Inc.
- Edward B. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature compensated surface acoustic wave device and method hav...
- Patent number 8,044,553
- Issue date Oct 25, 2011
- Triquint Semiconductor, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Inductor formed in an integrated circuit
- Patent number 7,678,639
- Issue date Mar 16, 2010
- Agere Systems Inc.
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum pad power bus and signal routing for integrated circuit de...
- Patent number 7,566,964
- Issue date Jul 28, 2009
- Agere Systems Inc.
- Seung H. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor formed in an integrated circuit
- Patent number 7,541,238
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding spacers for self-aligned contacts
- Patent number 7,332,775
- Issue date Feb 19, 2008
- Agere Systems Inc.
- Kurt George Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding spacers for self-aligned contacts
- Patent number 7,126,198
- Issue date Oct 24, 2006
- Agere Systems Inc.
- Kurt George Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate dielectric structure for reducing boron penetration and curren...
- Patent number 7,081,419
- Issue date Jul 25, 2006
- Agere Systems Inc.
- Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask layer and dual damascene interconnect structure in a semicondu...
- Patent number 7,067,419
- Issue date Jun 27, 2006
- Agere Systems, INC
- Robert Y S Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor formed in an integrated circuit
- Patent number 7,068,139
- Issue date Jun 27, 2006
- Agere Systems Inc.
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad
- Patent number 6,960,836
- Issue date Nov 1, 2005
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split barrier layer including nitrogen-containing portion and oxyge...
- Patent number 6,879,046
- Issue date Apr 12, 2005
- Agere Systems Inc.
- Gerald W Gibson, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper silicide passivation for improved reliability
- Patent number 6,869,873
- Issue date Mar 22, 2005
- Agere Systems Inc.
- Robert Wayne Bradshaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolating porous low-k dielectric films
- Patent number 6,798,043
- Issue date Sep 28, 2004
- Agere Systems, INC
- Kurt G. Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment anneal of hydrogenated silicon-oxy-carbide dielec...
- Patent number 6,576,980
- Issue date Jun 10, 2003
- Agere Systems, INC
- Huili Shao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low k dielectric insulator and method of forming semiconductor circ...
- Patent number 6,548,892
- Issue date Apr 15, 2003
- Agere Systems Inc.
- Kurt George Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved encapsulation of thick metal features in integ...
- Patent number 6,472,307
- Issue date Oct 29, 2002
- Agere Systems Guardian Corp.
- Donald C. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an interconnect structure having a passivat...
- Patent number 6,432,814
- Issue date Aug 13, 2002
- Agere Systems Guardian Corp.
- Kurt G. Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogenated silicon carbide as a liner for self-aligning contact vias
- Patent number 6,362,094
- Issue date Mar 26, 2002
- Agere Systems Guardian Corp.
- Gary Dabbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor devices
- Patent number 6,200,734
- Issue date Mar 13, 2001
- Lucent Technologies Inc.
- James W. Blatchford
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device having an anti-reflective layer and a method o...
- Patent number 6,133,618
- Issue date Oct 17, 2000
- Lucent Technologies Inc.
- Kurt G. Steiner
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC WAVE DEVICE WITH AN EFFICIENT STRUCTURE, A RADIO FREQUENCY...
- Publication number 20240275363
- Publication date Aug 15, 2024
- Skyworks Solutions, Inc.
- Kurt George Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE HAVING...
- Publication number 20240258994
- Publication date Aug 1, 2024
- Skyworks Solutions, Inc.
- Kurt George Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
GUIDED ACOUSTIC WAVE DEVICE
- Publication number 20180054179
- Publication date Feb 22, 2018
- Qorvo US, Inc.
- Kevin J. Gamble
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC FILTERING CIRCUITRY INCLUDING CAPACITOR
- Publication number 20180041193
- Publication date Feb 8, 2018
- Qorvo US, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TCSAW WITH IMPROVED RELIABILITY
- Publication number 20170099042
- Publication date Apr 6, 2017
- RF Micro Devices, Inc.
- Kurt G. Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFA...
- Publication number 20160020747
- Publication date Jan 21, 2016
- Kurt Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20140252916
- Publication date Sep 11, 2014
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD
- Publication number 20130106535
- Publication date May 2, 2013
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acoustic Wave Guide Device and Method for Minimizing Trimming Effec...
- Publication number 20120161577
- Publication date Jun 28, 2012
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Temperature Compensated Surface Acoustic Wave Device and Method Hav...
- Publication number 20110204747
- Publication date Aug 25, 2011
- TRIQUINT SEMICONDUCTOR, INC.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR SEPARATING A SEMICONDUCTOR WAFER INTO INDIVIDUAL SEMICON...
- Publication number 20100221893
- Publication date Sep 2, 2010
- Agere Systems Inc.
- Edward B. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20100201000
- Publication date Aug 12, 2010
- Agere Systems Inc.
- Joze F. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR FORMED IN AN INTEGRATED CIRCUIT
- Publication number 20090100668
- Publication date Apr 23, 2009
- Agere Systems Inc.
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20070063352
- Publication date Mar 22, 2007
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protruding spacers for self-aligned contacts
- Publication number 20070023848
- Publication date Feb 1, 2007
- Kurt George Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor formed in an integrated circuit
- Publication number 20060192647
- Publication date Aug 31, 2006
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor formed in an integrated circuit
- Publication number 20050099259
- Publication date May 12, 2005
- Edward Belden Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and system for reinforcing a bond pad
- Publication number 20050067709
- Publication date Mar 31, 2005
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel gate dielectric structure for reducing boron penetration and...
- Publication number 20040238905
- Publication date Dec 2, 2004
- Lucent Technologies Inc.
- Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum pad power bus and signal routing for integrated circuit de...
- Publication number 20040201101
- Publication date Oct 14, 2004
- Seung H. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask layer and dual damascene interconnect structure in a semicondu...
- Publication number 20040121579
- Publication date Jun 24, 2004
- Robert Y. S. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper silicide passivation for improved reliability
- Publication number 20040097075
- Publication date May 20, 2004
- Robert Wayne Bradshaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protruding spacers for self-aligned contacts
- Publication number 20040043574
- Publication date Mar 4, 2004
- Kurt George Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask layer and dual damascene interconnect structure in a semicondu...
- Publication number 20030119305
- Publication date Jun 26, 2003
- Robert Y. S. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split barrier layer including nitrogen-containing portion and oxyge...
- Publication number 20030003765
- Publication date Jan 2, 2003
- Gerald W. Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for isolating porous low-k dielectric films
- Publication number 20030001273
- Publication date Jan 2, 2003
- Kurt G. Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTERCONNECT STRUCTURE HAVING A PASSIVAT...
- Publication number 20020064940
- Publication date May 30, 2002
- Kurt G. Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clustered system and method for formation of integrated circuit dev...
- Publication number 20010012667
- Publication date Aug 9, 2001
- Yi Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kurt G. Steiner

Person

Patents Grantslast 30 patents

Acoustic filtering circuitry including capacitor

Guided acoustic wave device

Surface acoustic wave filter with a cap layer for improved reliability

Methods, systems, and apparatuses for temperature compensated surfa...

Acoustic wave device

High coupling, low loss saw filter and associated method

Routing under bond pad for the replacement of an interconnect layer

Acoustic wave guide device and method for minimizing trimming effec...

Bond pad support structure for semiconductor device

Method for separating a semiconductor wafer into individual semicon...

Temperature compensated surface acoustic wave device and method hav...

Inductor formed in an integrated circuit

Aluminum pad power bus and signal routing for integrated circuit de...

Inductor formed in an integrated circuit

Protruding spacers for self-aligned contacts

Protruding spacers for self-aligned contacts

Gate dielectric structure for reducing boron penetration and curren...

Mask layer and dual damascene interconnect structure in a semicondu...

Inductor formed in an integrated circuit

Reinforced bond pad

Split barrier layer including nitrogen-containing portion and oxyge...

Copper silicide passivation for improved reliability

Structure and method for isolating porous low-k dielectric films

Surface treatment anneal of hydrogenated silicon-oxy-carbide dielec...

Low k dielectric insulator and method of forming semiconductor circ...

Methods for improved encapsulation of thick metal features in integ...

Method of manufacturing an interconnect structure having a passivat...

Hydrogenated silicon carbide as a liner for self-aligning contact vias

Method for fabricating semiconductor devices

Semiconductor device having an anti-reflective layer and a method o...

Patents Applicationslast 30 patents

ACOUSTIC WAVE DEVICE WITH AN EFFICIENT STRUCTURE, A RADIO FREQUENCY...

ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE HAVING...

GUIDED ACOUSTIC WAVE DEVICE

ACOUSTIC FILTERING CIRCUITRY INCLUDING CAPACITOR

TCSAW WITH IMPROVED RELIABILITY

METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFA...

ACOUSTIC WAVE DEVICE

HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Acoustic Wave Guide Device and Method for Minimizing Trimming Effec...

Temperature Compensated Surface Acoustic Wave Device and Method Hav...

METHOD FOR SEPARATING A SEMICONDUCTOR WAFER INTO INDIVIDUAL SEMICON...

BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE

INDUCTOR FORMED IN AN INTEGRATED CIRCUIT

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Protruding spacers for self-aligned contacts

Inductor formed in an integrated circuit

Inductor formed in an integrated circuit

Methods and system for reinforcing a bond pad

Novel gate dielectric structure for reducing boron penetration and...

Aluminum pad power bus and signal routing for integrated circuit de...

Mask layer and dual damascene interconnect structure in a semicondu...

Copper silicide passivation for improved reliability

Protruding spacers for self-aligned contacts

Mask layer and dual damascene interconnect structure in a semicondu...

Split barrier layer including nitrogen-containing portion and oxyge...

Structure and method for isolating porous low-k dielectric films

METHOD OF MANUFACTURING AN INTERCONNECT STRUCTURE HAVING A PASSIVAT...

Clustered system and method for formation of integrated circuit dev...