KURT P. WACHTLER

Person

RICHARDSON, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 11,538,717
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 10,861,741
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,723,616
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,233,074
- Issue date Mar 19, 2019
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method for packaging stress-sensitive micro-electro-m...
- Patent number 9,896,330
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogeneous integration of memory and split-architecture processor
- Patent number 9,312,253
- Issue date Apr 12, 2016
- Texas Instruments Incorporated
- Kevin Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor interposer for heterogeneous integration of standa...
- Patent number 8,957,525
- Issue date Feb 17, 2015
- Texas Instruments Incorporated
- Kevin Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die underfill structure and method
- Patent number 8,823,168
- Issue date Sep 2, 2014
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching wide bus memory and serial memory to a process...
- Patent number 8,597,978
- Issue date Dec 3, 2013
- Texas Instruments Incorporated
- Kurt Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for exposing and cleaning insulating coats from metal contac...
- Patent number 8,430,969
- Issue date Apr 30, 2013
- Texas Instruments Incorporated
- Mark A Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable plasma cleaned via package and method
- Patent number 8,338,229
- Issue date Dec 25, 2012
- Amkor Technology, Inc.
- Ludovico E. Bancod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS package having formed metal lid
- Patent number 8,309,388
- Issue date Nov 13, 2012
- Texas Instruments Incorporated
- Kurt P. Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for attaching wide bus memory and serial memory to a process...
- Patent number 8,288,849
- Issue date Oct 16, 2012
- Texas Instruments Incorporated
- Kurt Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged system of semiconductor chips having a semiconductor inter...
- Patent number 8,133,761
- Issue date Mar 13, 2012
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer for stacking semiconductor chips and connecting...
- Patent number 8,030,137
- Issue date Oct 4, 2011
- Texas Instruments Incorporated
- Kurt P Wachtler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible interposer for stacking semiconductor chips and connecting...
- Patent number 7,928,550
- Issue date Apr 19, 2011
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In package ESD protections of IC using a thin film polymer
- Patent number 7,872,841
- Issue date Jan 18, 2011
- Texas Instruments Incorporated
- Yves Leduc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packed system of semiconductor chips having a semiconductor interposer
- Patent number 7,573,139
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package-on-package system including integrated passiv...
- Patent number 7,569,918
- Issue date Aug 4, 2009
- Texas Instruments Incorporated
- Mark A. Gerber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged system of semiconductor chips having a semiconductor inter...
- Patent number 7,390,700
- Issue date Jun 24, 2008
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HID land grid array packaged device having electrical and optical i...
- Patent number 6,707,124
- Issue date Mar 16, 2004
- Texas Instruments Incorporated
- Kurt P. Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor dies from a wafer
- Patent number 6,686,225
- Issue date Feb 3, 2004
- Texas Instruments Incorporated
- Kurt P. Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microactuator for use in mass data storage devices, or the like, an...
- Patent number 6,655,002
- Issue date Dec 2, 2003
- Texas Instruments Incorporated
- Peter J. Maimone
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die with contoured bottom surface and method for maki...
- Patent number 6,541,352
- Issue date Apr 1, 2003
- Texas Instruments Incorporated
- Kurt P. Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectricalmechanical device immobilization and sealing
- Patent number 6,504,685
- Issue date Jan 7, 2003
- Texas Instruments Incorporated
- Kurt P. Wachtler
- G11 - INFORMATION STORAGE
Information Patent Grant
Symmetrical microactuator structure for use in mass data storage de...
- Patent number 6,473,274
- Issue date Oct 29, 2002
- Texas Instruments Incorporated
- Peter J. Maimone
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for making microactuator for use in mass data storage devices
- Patent number 6,374,481
- Issue date Apr 23, 2002
- Texas Instruments Incorporated
- Kurt P. Wachtler
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20210090940
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sintered Metal Flip Chip Joints
- Publication number 20210005537
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20200354214
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20190169019
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20190164807
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR DEPOSITING A MEASURED AMOUNT OF A SPECIES IN A SEALED C...
- Publication number 20190077656
- Publication date Mar 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen COOK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20180127266
- Publication date May 10, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Floating Die Package
- Publication number 20170330841
- Publication date Nov 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintered Metal Flip Chip Joints
- Publication number 20170309549
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-M...
- Publication number 20170197823
- Publication date Jul 13, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Heterogeneous Integration of Memory and Split-Architecture Processor
- Publication number 20150111318
- Publication date Apr 23, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Kevin Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Semiconductor Interposer for Heterogeneous Integration of Standa...
- Publication number 20140159247
- Publication date Jun 12, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Kevin Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Underfill Structure And Method
- Publication number 20140061896
- Publication date Mar 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Attaching Wide Bus Memory and Serial Memory to a Process...
- Publication number 20120225523
- Publication date Sep 6, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING WIDE BUS MEMORY AND SERIAL MEMORY TO A PROCESS...
- Publication number 20110272814
- Publication date Nov 10, 2011
- Kurt Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Interposer for Stacking Semiconductor Chips and Connecting...
- Publication number 20110165735
- Publication date Jul 7, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCAL INTEGRATION OF NON-LINEAR SHEET I INTEGRATED CIRCUIT PACKAGES...
- Publication number 20110075306
- Publication date Mar 31, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Yves Leduc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Cleaning Insulating Coats from Metal Contact Surfaces
- Publication number 20110011424
- Publication date Jan 20, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Mark Allen GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package System Vertical Interconnect
- Publication number 20100084755
- Publication date Apr 8, 2010
- Mark Allen Gerber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS Package Having Formed Metal Lid
- Publication number 20090267223
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kurt P. WACHTLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged System of Semiconductor Chips Having a Semiconductor Inter...
- Publication number 20090258459
- Publication date Oct 15, 2009
- TEXAS INSTRUMENTS INCORPORATED
- MARK A. GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Interposer for Stacking Semiconductor Chips and Connecting...
- Publication number 20090121346
- Publication date May 14, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package-on-Package System Including Integrated Passiv...
- Publication number 20080315387
- Publication date Dec 25, 2008
- TEXAS INSTRUMENTS INCORPORATED
- MARK A. GERBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN PACKAGE ESD PROTECTIONS OF IC USING A THIN FILM POLYMER
- Publication number 20080278873
- Publication date Nov 13, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Yves Leduc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Simplified Substrates for Semiconductor Devices in Package-on-Packa...
- Publication number 20080258285
- Publication date Oct 23, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Peter R. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Input/Output, Low Profile Package-On-Package Semiconductor System
- Publication number 20080258286
- Publication date Oct 23, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packed System of Semiconductor Chips Having a Semiconductor Interposer
- Publication number 20080246138
- Publication date Oct 9, 2008
- TEXAS INSTRUMENTS INCORPORATED
- MARK A. GERBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package-on-Package System Including Integrated Passiv...
- Publication number 20070254404
- Publication date Nov 1, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged system of semiconductor chips having a semiconductor inter...
- Publication number 20070235850
- Publication date Oct 11, 2007
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

KURT P. WACHTLER

Person

Patents Grantslast 30 patents

Floating die package

Electronic package for integrated circuits and related methods

Structures for packaging stress-sensitive micro-electro-mechanical...

Electronic package for integrated circuits and related methods

Floating die package

Structures for packaging stress-sensitive micro-electro-mechanical...

Structures for packaging stress-sensitive micro-electro-mechanical...

Structure and method for packaging stress-sensitive micro-electro-m...

Heterogeneous integration of memory and split-architecture processor

3D semiconductor interposer for heterogeneous integration of standa...

Die underfill structure and method

Method for attaching wide bus memory and serial memory to a process...

Method for exposing and cleaning insulating coats from metal contac...

Stackable plasma cleaned via package and method

MEMS package having formed metal lid

Method for attaching wide bus memory and serial memory to a process...

Packaged system of semiconductor chips having a semiconductor inter...

Flexible interposer for stacking semiconductor chips and connecting...

Flexible interposer for stacking semiconductor chips and connecting...

In package ESD protections of IC using a thin film polymer

Packed system of semiconductor chips having a semiconductor interposer

Semiconductor package-on-package system including integrated passiv...

Packaged system of semiconductor chips having a semiconductor inter...

HID land grid array packaged device having electrical and optical i...

Method of separating semiconductor dies from a wafer

Microactuator for use in mass data storage devices, or the like, an...

Semiconductor die with contoured bottom surface and method for maki...

Microelectricalmechanical device immobilization and sealing

Symmetrical microactuator structure for use in mass data storage de...

Method for making microactuator for use in mass data storage devices

Patents Applicationslast 30 patents

FLOATING DIE PACKAGE

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

Sintered Metal Flip Chip Joints

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

METHODS FOR DEPOSITING A MEASURED AMOUNT OF A SPECIES IN A SEALED C...

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

Floating Die Package

Sintered Metal Flip Chip Joints

STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-M...

Heterogeneous Integration of Memory and Split-Architecture Processor

3D Semiconductor Interposer for Heterogeneous Integration of Standa...

Die Underfill Structure And Method

Method for Attaching Wide Bus Memory and Serial Memory to a Process...

METHOD FOR ATTACHING WIDE BUS MEMORY AND SERIAL MEMORY TO A PROCESS...

Flexible Interposer for Stacking Semiconductor Chips and Connecting...

LOCAL INTEGRATION OF NON-LINEAR SHEET I INTEGRATED CIRCUIT PACKAGES...

Method for Cleaning Insulating Coats from Metal Contact Surfaces

Semiconductor Chip Package System Vertical Interconnect

MEMS Package Having Formed Metal Lid

Packaged System of Semiconductor Chips Having a Semiconductor Inter...

Flexible Interposer for Stacking Semiconductor Chips and Connecting...

Semiconductor Package-on-Package System Including Integrated Passiv...

IN PACKAGE ESD PROTECTIONS OF IC USING A THIN FILM POLYMER

Simplified Substrates for Semiconductor Devices in Package-on-Packa...

High Input/Output, Low Profile Package-On-Package Semiconductor System

Packed System of Semiconductor Chips Having a Semiconductor Interposer

Semiconductor Package-on-Package System Including Integrated Passiv...

Packaged system of semiconductor chips having a semiconductor inter...