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Kwang-Ho Chun
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Asan-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Cooling apparatus for memory module
Patent number
7,705,449
Issue date
Apr 27, 2010
Samsung Electronics Co., Ltd.
Joong Hyun Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and module printed circuit board for mounting...
Patent number
7,675,176
Issue date
Mar 9, 2010
Samsung Electronics Co., Ltd.
Chang-Yong Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat sink and memory module using the same
Patent number
7,606,035
Issue date
Oct 20, 2009
Samsung Electronics Co., Ltd.
Chang-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader, semiconductor package module and memory module havin...
Patent number
7,518,873
Issue date
Apr 14, 2009
Samsung Electronics Co., Ltd.
Chang-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and method of forming a semiconductor module
Patent number
7,215,026
Issue date
May 8, 2007
Samsung Electonics Co., Ltd
Chang-Yong Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Array printed circuit board
Patent number
7,005,735
Issue date
Feb 28, 2006
Samsung Electronics Co., Ltd.
Chang-Yong Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE
Publication number
20110168761
Publication date
Jul 14, 2011
Samsung Electronics Co., Ltd.
Sun-kyu Hwang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package and associated methods
Publication number
20090257209
Publication date
Oct 15, 2009
Seong-Chan Han
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MODULE PRINTED CIRCUIT BOARD FOR MOUNTING...
Publication number
20080157389
Publication date
Jul 3, 2008
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
HEAT SINK AND MEMORY MODULE USING THE SAME
Publication number
20080074848
Publication date
Mar 27, 2008
Samsung Electronics Co., Ltd.
Chang-Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cooling apparatus for memory module
Publication number
20070170580
Publication date
Jul 26, 2007
SAMSUNG ELECTRONICS CO., LTD.
Joong Hyun Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor module and method of forming a semiconductor module
Publication number
20070161224
Publication date
Jul 12, 2007
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor module and method of forming a semiconductor module
Publication number
20070069378
Publication date
Mar 29, 2007
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Heat spreader, semiconductor package module and memory module havin...
Publication number
20070008703
Publication date
Jan 11, 2007
SAMSUNG ELECTRONICS CO., LTD.
Chang-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor module and method of forming a semiconductor module
Publication number
20060231949
Publication date
Oct 19, 2006
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor package repair method
Publication number
20060228878
Publication date
Oct 12, 2006
SAMSUNG ELECTRONICS CO., LTD.
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Array printed circuit board
Publication number
20040238932
Publication date
Dec 2, 2004
Chang-Yong Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...