Kwon Whan HAN

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating semiconductor packages including reinforceme...
- Patent number 10,770,445
- Issue date Sep 8, 2020
- SK hynix Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional triboelectric energy harvester
- Patent number 10,075,100
- Issue date Sep 11, 2018
- Research & Business Foundation Sungkyunkwan University
- Sang Woo Kim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Passive wavelength division multiplexing device for automatic wavel...
- Patent number 9,106,361
- Issue date Aug 11, 2015
- SOLID, INC.
- Ki-Woon Na
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package of electronic device including connecting bump, system incl...
- Patent number 9,099,456
- Issue date Aug 4, 2015
- SK Hynix Inc.
- Kwon Whan Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carriers, semiconductor devices including the same, semiconduc...
- Patent number 8,922,000
- Issue date Dec 30, 2014
- SK Hynix Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of improving mounting reliability and se...
- Patent number 8,836,054
- Issue date Sep 16, 2014
- SK Hynix Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip embedded with a test circuit
- Patent number 8,586,983
- Issue date Nov 19, 2013
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,441,098
- Issue date May 14, 2013
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 8,399,355
- Issue date Mar 19, 2013
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package having an enhanced heat exchange eff...
- Patent number 8,338,921
- Issue date Dec 25, 2012
- SK Hynix Inc.
- Chang Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with chip selection structure and stacked semico...
- Patent number 7,898,834
- Issue date Mar 1, 2011
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 7,880,311
- Issue date Feb 1, 2011
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer stacked wafer level semiconductor package module
- Patent number 7,859,102
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package having pattern die redistribution
- Patent number 7,834,463
- Issue date Nov 16, 2010
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 7,795,139
- Issue date Sep 14, 2010
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing stack package using through-electrodes
- Patent number 7,795,073
- Issue date Sep 14, 2010
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package and method for manufacturing the...
- Patent number 7,705,457
- Issue date Apr 27, 2010
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via and method for forming the same
- Patent number 7,691,748
- Issue date Apr 6, 2010
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having re-distribution lines for supplying po...
- Patent number 7,595,268
- Issue date Sep 29, 2009
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance semiconductor package
- Patent number 7,468,550
- Issue date Dec 23, 2008
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package (WLCSP) with high reliability agains...
- Patent number 7,446,405
- Issue date Nov 4, 2008
- Hynix Semiconductor Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING REINFORCEME...
- Publication number 20190259743
- Publication date Aug 22, 2019
- SK HYNIX INC.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL TRIBOELECTRIC ENERGY HARVESTER
- Publication number 20160365808
- Publication date Dec 15, 2016
- Research & Business Foundation Sungkyunkwan University
- Sang Woo KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR CHIP MODULE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20140014958
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Tac Keun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE WAVELENGTH DIVISION MULTIPLEXING DEVICE FOR AUTOMATIC WAVEL...
- Publication number 20130315585
- Publication date Nov 28, 2013
- SOLID, INC.
- Ki-Woon Na
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP CARRIERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, SEMICONDUC...
- Publication number 20130099368
- Publication date Apr 25, 2013
- SK HYNIX INC.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING STACK PACKAGE USIN...
- Publication number 20130099235
- Publication date Apr 25, 2013
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF ELECTRONIC DEVICE INCLUDING CONNECTING BUMP, SYSTEM INCL...
- Publication number 20130099374
- Publication date Apr 25, 2013
- SK HYNIX INC.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...
- Publication number 20130078807
- Publication date Mar 28, 2013
- SK HYNIX INC.
- Chang Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20120153410
- Publication date Jun 21, 2012
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...
- Publication number 20120049385
- Publication date Mar 1, 2012
- Hynix Semiconductor Inc.
- Chang Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME
- Publication number 20110309358
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE VARIABLE TYPE SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE USI...
- Publication number 20110272692
- Publication date Nov 10, 2011
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP EMBEDDED WITH A TEST CIRCUIT
- Publication number 20110254000
- Publication date Oct 20, 2011
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110140237
- Publication date Jun 16, 2011
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110092024
- Publication date Apr 21, 2011
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA AND METHOD FOR FORMING THE SAME
- Publication number 20100148370
- Publication date Jun 17, 2010
- Hynix Semiconductor Inc.
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING STACK PACKAGE USING THROUGH-ELECTRODES
- Publication number 20090197372
- Publication date Aug 6, 2009
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20090189281
- Publication date Jul 30, 2009
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICO...
- Publication number 20090189267
- Publication date Jul 30, 2009
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...
- Publication number 20090184414
- Publication date Jul 23, 2009
- Chang Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STACKED WAFER LEVEL SEMICONDUCTOR PACKAGE MODULE
- Publication number 20090166853
- Publication date Jul 2, 2009
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE...
- Publication number 20090140424
- Publication date Jun 4, 2009
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090108468
- Publication date Apr 30, 2009
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20080318361
- Publication date Dec 25, 2008
- Kwon Whan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20080315394
- Publication date Dec 25, 2008
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-silicon via and method for forming the same
- Publication number 20080079121
- Publication date Apr 3, 2008
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack package having pattern die redistribution
- Publication number 20080001304
- Publication date Jan 3, 2008
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-performance semiconductor package
- Publication number 20070228563
- Publication date Oct 4, 2007
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip scale package (WLCSP) with high reliability agains...
- Publication number 20070182022
- Publication date Aug 9, 2007
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Kwon Whan HAN

Person

Patents Grantslast 30 patents

Methods of fabricating semiconductor packages including reinforceme...

Three dimensional triboelectric energy harvester

Passive wavelength division multiplexing device for automatic wavel...

Package of electronic device including connecting bump, system incl...

Chip carriers, semiconductor devices including the same, semiconduc...

Semiconductor chip capable of improving mounting reliability and se...

Semiconductor chip embedded with a test circuit

Semiconductor package

Stacked semiconductor package and method for manufacturing the same

Wafer level chip scale package having an enhanced heat exchange eff...

Semiconductor chip with chip selection structure and stacked semico...

Stacked semiconductor package and method for manufacturing the same

Multi-layer stacked wafer level semiconductor package module

Stack package having pattern die redistribution

Method for manufacturing semiconductor package

Method for manufacturing stack package using through-electrodes

Wafer level semiconductor package and method for manufacturing the...

Through-silicon via and method for forming the same

Semiconductor package having re-distribution lines for supplying po...

High-performance semiconductor package

Wafer level chip scale package (WLCSP) with high reliability agains...

Patents Applicationslast 30 patents

METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING REINFORCEME...

THREE DIMENSIONAL TRIBOELECTRIC ENERGY HARVESTER

SEMICONDUCTOR CHIP MODULE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

PASSIVE WAVELENGTH DIVISION MULTIPLEXING DEVICE FOR AUTOMATIC WAVEL...

CHIP CARRIERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, SEMICONDUC...

SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING STACK PACKAGE USIN...

PACKAGE OF ELECTRONIC DEVICE INCLUDING CONNECTING BUMP, SYSTEM INCL...

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...

SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME

SIZE VARIABLE TYPE SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE USI...

SEMICONDUCTOR CHIP EMBEDDED WITH A TEST CIRCUIT

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

THROUGH-SILICON VIA AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING STACK PACKAGE USING THROUGH-ELECTRODES

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICO...

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFF...

MULTI-LAYER STACKED WAFER LEVEL SEMICONDUCTOR PACKAGE MODULE

WAFER LEVEL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

Through-silicon via and method for forming the same

Stack package having pattern die redistribution

High-performance semiconductor package

Wafer level chip scale package (WLCSP) with high reliability agains...