Kyaw Oo Aung

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit through-substrate via system with a buffer layer...
- Patent number 9,281,274
- Issue date Mar 8, 2016
- Stats Chippac Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for different bond pads in an integrated circuit package
- Patent number 7,443,039
- Issue date Oct 28, 2008
- ST Assembly Test Services Ltd.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing different bond pads on the same substrate o...
- Patent number 7,005,370
- Issue date Feb 28, 2006
- ST Assembly Test Services Ltd.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING
- Publication number 20230005896
- Publication date Jan 5, 2023
- ams Sensors Asia Pte. Ltd.
- Kam Wah Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20060197223
- Publication date Sep 7, 2006
- ST ASSEMBLY TEST SERVICES LTD.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy in integrated circuits
- Publication number 20060160267
- Publication date Jul 20, 2006
- STATS ChipPAC Ltd.
- Hyeong Ryeol Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE O...
- Publication number 20050253262
- Publication date Nov 17, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS