Kyong-Mo Bang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having stacked die and wire bond interconn...
- Patent number 10,566,310
- Issue date Feb 18, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable microelectronic package structures
- Patent number 10,468,380
- Issue date Nov 5, 2019
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-bandwidth memory application with controlled impedance loading
- Patent number 10,026,467
- Issue date Jul 17, 2018
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFD I/O partition for high-speed, high-density applications
- Patent number 9,928,883
- Issue date Mar 27, 2018
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Stackable microelectronic package structures
- Patent number 9,911,717
- Issue date Mar 6, 2018
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,847,238
- Issue date Dec 19, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFD I/O partition for high-speed, high-density applications
- Patent number 9,679,613
- Issue date Jun 13, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,646,946
- Issue date May 9, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages with mechanically decoupled fan-in and fan-out...
- Patent number 9,543,277
- Issue date Jan 10, 2017
- Invensas Corporation
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 9,502,372
- Issue date Nov 22, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable microelectronic package structures
- Patent number 9,496,242
- Issue date Nov 15, 2016
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-bandwidth memory application with controlled impedance loading
- Patent number 9,484,080
- Issue date Nov 1, 2016
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Stackable microelectronic package structures
- Patent number 9,425,167
- Issue date Aug 23, 2016
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA ballout partition techniques for simplified layout in motherboa...
- Patent number 9,343,398
- Issue date May 17, 2016
- Invensas Corporation
- Yong Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact arrangements for stackable microelectronic package structures
- Patent number 9,337,170
- Issue date May 10, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking techniques in BGA memory package for small footprint C...
- Patent number 9,281,296
- Issue date Mar 8, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable microelectronic package structures
- Patent number 8,980,693
- Issue date Mar 17, 2015
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stackable microelectronic package structures
- Patent number 8,680,684
- Issue date Mar 25, 2014
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
- Publication number 20180261571
- Publication date Sep 13, 2018
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TFD I/O Partition for High-Speed, High-Density Applications
- Publication number 20170323667
- Publication date Nov 9, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONN...
- Publication number 20170294410
- Publication date Oct 12, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
- Publication number 20170170031
- Publication date Jun 15, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING
- Publication number 20170133081
- Publication date May 11, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION
- Publication number 20170103957
- Publication date Apr 13, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20170069591
- Publication date Mar 9, 2017
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20160322326
- Publication date Nov 3, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA BALLOUT PARTITION TECHNIQUES FOR SIMPLIFIED LAYOUT IN MOTHERBOA...
- Publication number 20160093563
- Publication date Mar 31, 2016
- Invensas Corporation
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING TECHNIQUES IN BGA MEMORY PACKAGE FOR SMALL FOOTPRINT C...
- Publication number 20160035703
- Publication date Feb 4, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable microelectronic package structures
- Publication number 20150200183
- Publication date Jul 16, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
- Publication number 20150187730
- Publication date Jul 2, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
- Publication number 20140199811
- Publication date Jul 17, 2014
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
- Publication number 20130175699
- Publication date Jul 11, 2013
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kyong-Mo Bang

Person

Patents Grantslast 30 patents

Integrated cooling assemblies for advanced device packaging and met...

Microelectronic packages having stacked die and wire bond interconn...

Stackable microelectronic package structures

High-bandwidth memory application with controlled impedance loading

Wafer-level packaging using wire bond wires in place of a redistrib...

TFD I/O partition for high-speed, high-density applications

Stackable microelectronic package structures

Fan-out wafer-level packaging using metal foil lamination

TFD I/O partition for high-speed, high-density applications

Fan-out wafer-level packaging using metal foil lamination

Wafer level packages with mechanically decoupled fan-in and fan-out...

Wafer-level packaging using wire bond wires in place of a redistrib...

Stackable microelectronic package structures

High-bandwidth memory application with controlled impedance loading

Stackable microelectronic package structures

Contact arrangements for stackable microelectronic package structur...

BGA ballout partition techniques for simplified layout in motherboa...

Contact arrangements for stackable microelectronic package structures

Die stacking techniques in BGA memory package for small footprint C...

Stackable microelectronic package structures

Stackable microelectronic package structures

Patents Applicationslast 30 patents

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

ELECTRONIC DEVICE COOLING STRUCTURES

BONDED STRUCTURES

STACKABLE MICROELECTRONIC PACKAGE STRUCTURES

TFD I/O Partition for High-Speed, High-Density Applications

MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONN...

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination

HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING

FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

BGA BALLOUT PARTITION TECHNIQUES FOR SIMPLIFIED LAYOUT IN MOTHERBOA...

DIE STACKING TECHNIQUES IN BGA MEMORY PACKAGE FOR SMALL FOOTPRINT C...

Stackable microelectronic package structures

STACKABLE MICROELECTRONIC PACKAGE STRUCTURES

STACKABLE MICROELECTRONIC PACKAGE STRUCTURES

STACKABLE MICROELECTRONIC PACKAGE STRUCTURES