KyoungHee Park

Person

Icheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,990,424
- Issue date May 21, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,862,478
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based redistribution and multi-stacked packages
- Patent number 11,862,572
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emi shielding for flip chip package with exposed die backside
- Patent number 11,688,697
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,664,327
- Issue date May 30, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask with fang design
- Patent number 11,616,025
- Issue date Mar 28, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based redistribution and multi-stacked packages
- Patent number 11,610,847
- Issue date Mar 21, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing device to securely hold semiconductor p...
- Patent number 11,594,438
- Issue date Feb 28, 2023
- STATS ChipPAC Pte. Ltd.
- Hyeonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,393,698
- Issue date Jul 19, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,355,452
- Issue date Jun 7, 2022
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,342,278
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 11,088,082
- Issue date Aug 10, 2021
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 10,804,217
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded pad on layered su...
- Patent number 10,134,664
- Issue date Nov 20, 2018
- STATS ChipPAC Pte. Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 9,997,468
- Issue date Jun 12, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded pad on layered su...
- Patent number 9,607,938
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of support system with fine pitch
- Patent number 9,210,816
- Issue date Dec 8, 2015
- Stats Chippac Ltd.
- YoungDal Roh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with embedded component and met...
- Patent number 9,171,795
- Issue date Oct 27, 2015
- Stats Chippac Ltd.
- Dong Ju Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with coreless substrate and met...
- Patent number 8,975,665
- Issue date Mar 10, 2015
- Stats Chippac Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...
- Publication number 20240347509
- Publication date Oct 17, 2024
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20240113038
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR...
- Publication number 20230411305
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SeongHwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask
- Publication number 20230275034
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20230207485
- Publication date Jun 29, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20230170311
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20230140748
- Publication date May 4, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Device to Securely Hold Reconstituted P...
- Publication number 20220392795
- Publication date Dec 8, 2022
- STATS ChipPAC Pte Ltd.
- Hyeonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20220359420
- Publication date Nov 10, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220310408
- Publication date Sep 29, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220270983
- Publication date Aug 25, 2022
- STATS ChipPAC Pte Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220246541
- Publication date Aug 4, 2022
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220199423
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20220199545
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask
- Publication number 20220157739
- Publication date May 19, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding and Method of Makin...
- Publication number 20210335724
- Publication date Oct 28, 2021
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20210028122
- Publication date Jan 28, 2021
- STATS ChipPAC Pte Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200395312
- Publication date Dec 17, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding and Method of Makin...
- Publication number 20200075502
- Publication date Mar 5, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200051926
- Publication date Feb 13, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294236
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294235
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SU...
- Publication number 20170162495
- Publication date Jun 8, 2017
- STATS ChipPAC Pte Ltd.
- MinKyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20160300799
- Publication date Oct 13, 2016
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND MET...
- Publication number 20150171002
- Publication date Jun 18, 2015
- Dong Ju Jeon
- H01 - BASIC ELECTRIC ELEMENTS

KyoungHee Park

Person

Patents Grantslast 30 patents

Antenna-in-package devices and methods of making

Selective EMI shielding using preformed mask

Mask design for improved attach position

Laser-based redistribution and multi-stacked packages

EMI shielding for flip chip package with exposed die backside

Emi shielding for flip chip package with exposed die backside

Selective EMI shielding using preformed mask

Selective EMI shielding using preformed mask with fang design

Laser-based redistribution and multi-stacked packages

Semiconductor manufacturing device to securely hold semiconductor p...

Mask design for improved attach position

EMI shielding for flip chip package with exposed die backside

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device with partial EMI shielding and method of makin...

Integrated circuit packaging system with shielding and method of ma...

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with embedded pad on layered su...

Integrated circuit packaging system with shielding and method of ma...

Integrated circuit packaging system with embedded pad on layered su...

Method of manufacture of support system with fine pitch

Integrated circuit packaging system with embedded component and met...

Integrated circuit packaging system with coreless substrate and met...

Patents Applicationslast 30 patents

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

Antenna-in-Package Devices and Methods of Making

SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Laser-Based Redistribution and Multi-Stacked Packages

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR MAKING ELECTRONIC PACKAGE

METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR...

Selective EMI Shielding Using Preformed Mask

Selective EMI Shielding Using Preformed Mask with Fang Design

Laser-Based Redistribution and Multi-Stacked Packages

Antenna-in-Package Devices and Methods of Making

Semiconductor Manufacturing Device to Securely Hold Reconstituted P...

Laser-Based Redistribution and Multi-Stacked Packages

Mask Design for Improved Attach Position

EMI Shielding for Flip Chip Package with Exposed Die Backside

EMI Shielding for Flip Chip Package with Exposed Die Backside

Mask Design for Improved Attach Position

Selective EMI Shielding Using Preformed Mask with Fang Design

Selective EMI Shielding Using Preformed Mask

Semiconductor Device with Partial EMI Shielding and Method of Makin...

EMI Shielding for Flip Chip Package with Exposed Die Backside

EMI Shielding for Flip Chip Package with Exposed Die Backside

Semiconductor Device with Partial EMI Shielding and Method of Makin...

EMI Shielding for Flip Chip Package with Exposed Die Backside

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SU...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND MET...