Kyujin Jung

Person

Kyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,861,295
- Issue date Mar 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,528,893
- Issue date Mar 4, 2003
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,495,909
- Issue date Dec 17, 2002
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro-mechanical system sensor with selective encapsulation...
- Patent number 6,401,545
- Issue date Jun 11, 2002
- Motorola, Inc.
- David J. Monk
- G01 - MEASURING TESTING
Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,342,730
- Issue date Jan 29, 2002
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,333,252
- Issue date Dec 25, 2001
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pin-count chip package and manufacturing method thereof
- Patent number 6,261,864
- Issue date Jul 17, 2001
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a semiconductor chip
- Patent number 6,242,284
- Issue date Jun 5, 2001
- Advanced Semiconductor Engineering, Inc.
- Kun-A Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Low-pin-count chip package and manufacturing method thereof
- Publication number 20020056926
- Publication date May 16, 2002
- Advanced Semiconductor Engineering, Inc. Taiwan, R.O.C.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-pin-count chip package and manufacturing method thereof
- Publication number 20020024147
- Publication date Feb 28, 2002
- Advanced Semiconductor Engineering, Inc.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-pin-count chip package and manufacturing method thereof
- Publication number 20010049156
- Publication date Dec 6, 2001
- ADVANCED SEMICONDUCTO ENGINEERING, INC.
- Kyujin Jung
- H01 - BASIC ELECTRIC ELEMENTS

Kyujin Jung

Person

Patents Grantslast 30 patents

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof

Micro electro-mechanical system sensor with selective encapsulation...

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof

Method for packaging a semiconductor chip

Patents Applicationslast 30 patents

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof

Low-pin-count chip package and manufacturing method thereof