Laegu Kang

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming a semiconductor device having epitaxially grown source and...
- Patent number 7,795,089
- Issue date Sep 14, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Laegu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming electronic device including a densified nitride...
- Patent number 7,528,078
- Issue date May 5, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area diode formation in SOI application
- Patent number 7,517,742
- Issue date Apr 14, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical diode formation in SOI application
- Patent number 7,186,596
- Issue date Mar 6, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of multiple gate dielectrics by surface protection
- Patent number 7,126,172
- Issue date Oct 24, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Sangwoo Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body-tied silicon on insulator semiconductor device and method ther...
- Patent number 6,724,048
- Issue date Apr 20, 2004
- Motorola, Inc.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming body-tied silicon on insulator semiconductor device
- Patent number 6,620,656
- Issue date Sep 16, 2003
- Motorola, Inc.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING A SEMICONDUCTOR DEVICE HAVING EPITAXIALLY GROWN SOURCE AND...
- Publication number 20080206940
- Publication date Aug 28, 2008
- Laegu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming electronic device including a densified nitride...
- Publication number 20070264839
- Publication date Nov 15, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Toni D. Van Gompel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a stressor structure
- Publication number 20070224772
- Publication date Sep 27, 2007
- Freescale Semiconductor, Inc.
- Mark D. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical diode formation in SOI application
- Publication number 20060284260
- Publication date Dec 21, 2006
- Freescale Semiconductor, Inc.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Area diode formation in SOI application
- Publication number 20060284278
- Publication date Dec 21, 2006
- Freescale Semiconductor, Inc.
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of multiple gate dielectrics by surface protection
- Publication number 20060079047
- Publication date Apr 13, 2006
- Freescale Semiconductor Inc.
- Sangwoo Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body-tied silicon on insulator semiconductor device and method ther...
- Publication number 20030211663
- Publication date Nov 13, 2003
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BODY-TIED SILICON ON INSULATOR SEMICONDUCTOR DEVICE AND METHOD THER...
- Publication number 20030113959
- Publication date Jun 19, 2003
- Byoung W. Min
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Forming a semiconductor device having epitaxially grown source and...

Process of forming electronic device including a densified nitride...

Area diode formation in SOI application

Vertical diode formation in SOI application

Integration of multiple gate dielectrics by surface protection

Body-tied silicon on insulator semiconductor device and method ther...

Method of forming body-tied silicon on insulator semiconductor device

Patents Applicationslast 30 patents

FORMING A SEMICONDUCTOR DEVICE HAVING EPITAXIALLY GROWN SOURCE AND...

Process of forming electronic device including a densified nitride...

Method for forming a stressor structure

Vertical diode formation in SOI application

Area diode formation in SOI application

Integration of multiple gate dielectrics by surface protection

Body-tied silicon on insulator semiconductor device and method ther...

BODY-TIED SILICON ON INSULATOR SEMICONDUCTOR DEVICE AND METHOD THER...