Lakshminarayan Viswanathan

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-mount amplifier devices
- Patent number 12,184,237
- Issue date Dec 31, 2024
- NXP USA, INC.
- Lu Ll
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures, electrical systems with thermal inter...
- Patent number 12,014,971
- Issue date Jun 18, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 12,015,004
- Issue date Jun 18, 2024
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including topside cooling interfaces and me...
- Patent number 11,990,872
- Issue date May 21, 2024
- NXP USA, INC.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless power amplifier packages including topside termination int...
- Patent number 11,984,429
- Issue date May 14, 2024
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 11,830,842
- Issue date Nov 28, 2023
- NXP USA., Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages and systems incorporating design-flexible...
- Patent number 11,621,673
- Issue date Apr 4, 2023
- NXP USA, INC.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal vias and sinter-bonded thermal dissipation s...
- Patent number 11,621,228
- Issue date Apr 4, 2023
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating leadless power amplifier packages including...
- Patent number 11,621,231
- Issue date Apr 4, 2023
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless power amplifier packages including topside terminations an...
- Patent number 11,342,275
- Issue date May 24, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier devices containing frontside heat extraction struct...
- Patent number 11,196,390
- Issue date Dec 7, 2021
- NXP USA, INC.
- Edward Christian Mares
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier packages containing peripherally-encapsulated dies...
- Patent number 11,128,268
- Issue date Sep 21, 2021
- NXP USA, INC.
- Sharan Kishore
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,861,774
- Issue date Dec 8, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,806,021
- Issue date Oct 13, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,785,862
- Issue date Sep 22, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
- Patent number 10,741,446
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 10,727,153
- Issue date Jul 28, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,629,518
- Issue date Apr 21, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 10,573,594
- Issue date Feb 25, 2020
- NXP USA, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically-shielded microelectronic assemblies and methods...
- Patent number 10,506,704
- Issue date Dec 10, 2019
- NXP USA, INC.
- Ramanujam Srinidhi Embar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,485,091
- Issue date Nov 19, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20240291439
- Publication date Aug 29, 2024
- NXP USA, Inc.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS THERMAL INTERFACE
- Publication number 20240213114
- Publication date Jun 27, 2024
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20230369272
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES, SYSTEMS, AND SUBSTRATES CONTAINING FIELD T...
- Publication number 20230291369
- Publication date Sep 14, 2023
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...
- Publication number 20230230924
- Publication date Jul 20, 2023
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF...
- Publication number 20230187325
- Publication date Jun 15, 2023
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT AMPLIFIER DEVICES
- Publication number 20230133034
- Publication date May 4, 2023
- NXP USA, Inc.
- Lu LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
- Publication number 20230111320
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...
- Publication number 20230115340
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...
- Publication number 20220384307
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...
- Publication number 20220238450
- Publication date Jul 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...
- Publication number 20220130768
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20220130785
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...
- Publication number 20220068817
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICES CONTAINING FRONTSIDE HEAT EXTRACTION STRUCT...
- Publication number 20210336585
- Publication date Oct 28, 2021
- NXP USA, Inc.
- Edward Christian Mares
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20210328552
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Geoffrey Tucker
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20200335420
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...
- Publication number 20200328721
- Publication date Oct 15, 2020
- NXP USA, Inc.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200211932
- Publication date Jul 2, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200075463
- Publication date Mar 5, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20190342988
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...
- Publication number 20190343005
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
- Publication number 20190148138
- Publication date May 16, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190109060
- Publication date Apr 11, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190098743
- Publication date Mar 28, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190051571
- Publication date Feb 14, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS

Lakshminarayan Viswanathan

Person

Patents Grantslast 30 patents

Surface-mount amplifier devices

Thick-silver layer interface

Radio frequency packages containing multilevel power substrates and...

Thermal interface structures, electrical systems with thermal inter...

Hybrid device assemblies and method of fabrication

Power amplifier modules including topside cooling interfaces and me...

Leadless power amplifier packages including topside termination int...

Radio frequency packages containing substrates with coefficient of...

Hybrid device assemblies and method of fabrication

Die-substrate assemblies having sinter-bonded backside via structur...

Power amplifier packages and systems incorporating design-flexible...

Substrate with thermal vias and sinter-bonded thermal dissipation s...

Methods of fabricating leadless power amplifier packages including...

Packaged dies with metal outer layers extending from die back sides...

Packaged electronic devices with top terminations

Leadless power amplifier packages including topside terminations an...

Power amplifier devices containing frontside heat extraction struct...

Power amplifier packages containing peripherally-encapsulated dies...

Microelectronic components having integrated heat dissipation posts...

Internally-shielded microelectronic packages and methods for the fa...

Semiconductor device package and methods of manufacture thereof

Packaged microelectronic component mounting using sinter attachment

Microelectronic modules with sinter-bonded heat dissipation structu...

Method of wafer dicing for wafers with backside metallization and p...

Thick-silver layer interface

Internally-shielded microelectronic packages and methods for the fa...

Semiconductor package design providing reduced electromagnetic coup...

Molded air cavity packages and methods for the production thereof

Electromagnetically-shielded microelectronic assemblies and methods...

Microelectronic modules with sinter-bonded heat dissipation structu...

Patents Applicationslast 30 patents

THICK-SILVER LAYER INTERFACE

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

LOW-STRESS THERMAL INTERFACE

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

POWER AMPLIFIER MODULES, SYSTEMS, AND SUBSTRATES CONTAINING FIELD T...

METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF...

SURFACE-MOUNT AMPLIFIER DEVICES

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...

THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...

METHODS OF FABRICATING LEADLESS POWER AMPLIFIER PACKAGES INCLUDING...

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATIONS AN...

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...

POWER AMPLIFIER DEVICES CONTAINING FRONTSIDE HEAT EXTRACTION STRUCT...

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

THICK-SILVER LAYER INTERFACE

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF