Larry D. Kinsman

Person

Kuna, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor packages formed using temporary protection layers and...
- Patent number 11,728,360
- Issue date Aug 15, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Larry Duane Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages formed using temporary protection layers and...
- Patent number 11,342,369
- Issue date May 24, 2022
- Semiconductor Components Industries, LLC
- Larry Duane Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 10,770,492
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a thermal equalizer in an image sensor
- Patent number 10,490,588
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Larry Duane Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages formed using temporary protection layers and...
- Patent number 10,388,684
- Issue date Aug 20, 2019
- Semiconductor Components Industries, LLC
- Larry Duane Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 10,290,672
- Issue date May 14, 2019
- Semiconductor Components Industries, L.L.C.
- Larry Kinsman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip scale package and related methods
- Patent number 10,079,254
- Issue date Sep 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with infrared-blocking layers
- Patent number 9,947,705
- Issue date Apr 17, 2018
- Semiconductor Components Industries, LLC
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and related methods
- Patent number 9,754,983
- Issue date Sep 5, 2017
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package for imaging systems
- Patent number 8,981,511
- Issue date Mar 17, 2015
- Semiconductor Components Industries, LLC
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked sensor packaging structure and method
- Patent number 8,791,536
- Issue date Jul 29, 2014
- Aptina Imaging Corporation
- Larry Kinsman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device package with an optical device
- Patent number 8,097,895
- Issue date Jan 17, 2012
- Round Rock Research, LLC
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
256 Meg dynamic random access memory
- Patent number 7,969,810
- Issue date Jun 28, 2011
- Round Rock Research, LLC
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaging methods for imager devices
- Patent number 7,919,410
- Issue date Apr 5, 2011
- Aptina Imaging Corporation
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount assembly and methods
- Patent number 7,871,859
- Issue date Jan 18, 2011
- Round Rock Research, LLC
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,829,991
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip scale package using wafer level proce...
- Patent number 7,727,858
- Issue date Jun 1, 2010
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication for flip-chip image sensor packages
- Patent number 7,638,813
- Issue date Dec 29, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped die and wire bonded board-on-chip package
- Patent number 7,629,686
- Issue date Dec 8, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for installing a plurality of circuit devices
- Patent number 7,600,314
- Issue date Oct 13, 2009
- Micron Technology, Inc.
- Larry Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for securing packaged semiconductor devices to carrier subs...
- Patent number 7,569,418
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optically interactive device package array
- Patent number 7,541,658
- Issue date Jun 2, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip image sensor packages
- Patent number 7,443,038
- Issue date Oct 28, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for stacked BGA packages
- Patent number 7,408,255
- Issue date Aug 5, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly for stacked BGA packages
- Patent number 7,400,032
- Issue date Jul 15, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly and method for stacked BGA packages
- Patent number 7,396,702
- Issue date Jul 8, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced-dimension microelectronic component assemblies with wire bo...
- Patent number 7,385,298
- Issue date Jun 10, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer mold semiconductor packaging processes
- Patent number 7,384,805
- Issue date Jun 10, 2008
- Micron Technology, Inc.
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for packaging microelectronic d...
- Patent number 7,321,455
- Issue date Jan 22, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR TRANSPARENT COVER WITH ARRAY CONTACT GRID
- Publication number 20240167873
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Brian Anthony VAARTSTRA
- G01 - MEASURING TESTING
Information Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
- Publication number 20240145515
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR BALL GRID ARRAY PACKAGE
- Publication number 20230064356
- Publication date Mar 2, 2023
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A CAVITY STRUCTURE FOR A LIGHT-TRANSMIT...
- Publication number 20220223641
- Publication date Jul 14, 2022
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
- Publication number 20220139982
- Publication date May 5, 2022
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190229144
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
- Publication number 20190189662
- Publication date Jun 20, 2019
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
- Publication number 20190189663
- Publication date Jun 20, 2019
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180342549
- Publication date Nov 29, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
- Publication number 20180097028
- Publication date Apr 5, 2018
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS WITH INFRARED-BLOCKING LAYERS
- Publication number 20180090532
- Publication date Mar 29, 2018
- Semiconductor Components Industries, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR A THERMAL EQUALIZER IN AN IMAGE SENSOR
- Publication number 20180083058
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Larry Duane KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND RELATED METHODS
- Publication number 20180019275
- Publication date Jan 18, 2018
- Semiconductor Components Industries, LLC
- Bingzhi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERPOSER
- Publication number 20170345862
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20170345864
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE FOR IMAGING SYSTEMS
- Publication number 20130221470
- Publication date Aug 29, 2013
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SENSOR PACKAGING STRUCTURE AND METHOD
- Publication number 20120273908
- Publication date Nov 1, 2012
- APTINA IMAGING CORPORATION
- LARRY KINSMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
256 Meg dynamic random access memory
- Publication number 20110261628
- Publication date Oct 27, 2011
- Round Rock Research, LLC
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS
- Publication number 20110101514
- Publication date May 5, 2011
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGES AND METHODS OF FABRICATING ELECTRONIC DE...
- Publication number 20100052086
- Publication date Mar 4, 2010
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
256 Meg dynamic random access memory
- Publication number 20090245009
- Publication date Oct 1, 2009
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Application
REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...
- Publication number 20080296781
- Publication date Dec 4, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHODS FOR IMAGER DEVICES
- Publication number 20080224192
- Publication date Sep 18, 2008
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS
- Publication number 20080042252
- Publication date Feb 21, 2008
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a chip scale package using wafer level proce...
- Publication number 20070148918
- Publication date Jun 28, 2007
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced-dimension microelectronic component assemblies with wire bo...
- Publication number 20070029681
- Publication date Feb 8, 2007
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumped die and wire bonded board-on-chip package
- Publication number 20070013084
- Publication date Jan 18, 2007
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly method for semiconductor die and lead frame
- Publication number 20070000599
- Publication date Jan 4, 2007
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of flip-chip image sensor package fabrication
- Publication number 20060292732
- Publication date Dec 28, 2006
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Varied-thickness heat sink for integrated circuit (IC) package
- Publication number 20060267184
- Publication date Nov 30, 2006
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS

Larry D. Kinsman

Person

Patents Grantslast 30 patents

Image sensor packages formed using temporary protection layers and...

Image sensor semiconductor packages and related methods

Image sensor packages formed using temporary protection layers and...

Chip scale package and related methods

Methods and apparatus for a thermal equalizer in an image sensor

Image sensor packages formed using temporary protection layers and...

Image sensor semiconductor packages and related methods

Chip scale package and related methods

Image sensors with infrared-blocking layers

Chip scale package and related methods

Multi-chip package for imaging systems

Stacked sensor packaging structure and method

Electronic device package with an optical device

256 Meg dynamic random access memory

Packaging methods for imager devices

Vertical surface mount assembly and methods

Stackable ceramic FBGA for high thermal applications

Method for fabricating a chip scale package using wafer level proce...

Methods of fabrication for flip-chip image sensor packages

Bumped die and wire bonded board-on-chip package

Methods for installing a plurality of circuit devices

Methods for securing packaged semiconductor devices to carrier subs...

Optically interactive device package array

Flip-chip image sensor packages

Assembly for stacked BGA packages

Module assembly for stacked BGA packages

Module assembly and method for stacked BGA packages

Reduced-dimension microelectronic component assemblies with wire bo...

Transfer mold semiconductor packaging processes

Microelectronic devices and methods for packaging microelectronic d...

Patents Applicationslast 30 patents

OPTICAL SENSOR TRANSPARENT COVER WITH ARRAY CONTACT GRID

STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES

IMAGE SENSOR BALL GRID ARRAY PACKAGE

IMAGE SENSOR PACKAGE HAVING A CAVITY STRUCTURE FOR A LIGHT-TRANSMIT...

IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...

IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...

CHIP SCALE PACKAGE AND RELATED METHODS

IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...

IMAGE SENSORS WITH INFRARED-BLOCKING LAYERS

METHODS AND APPARATUS FOR A THERMAL EQUALIZER IN AN IMAGE SENSOR

CHIP SCALE PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH INTERPOSER

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

MULTI-CHIP PACKAGE FOR IMAGING SYSTEMS

STACKED SENSOR PACKAGING STRUCTURE AND METHOD

256 Meg dynamic random access memory

VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS

ELECTRONIC DEVICE PACKAGES AND METHODS OF FABRICATING ELECTRONIC DE...

256 Meg dynamic random access memory

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...

PACKAGING METHODS FOR IMAGER DEVICES

STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS

Method for fabricating a chip scale package using wafer level proce...

Reduced-dimension microelectronic component assemblies with wire bo...

Bumped die and wire bonded board-on-chip package

Assembly method for semiconductor die and lead frame

Methods of flip-chip image sensor package fabrication

Varied-thickness heat sink for integrated circuit (IC) package