Laval Chung-Long-Shan

Person

Balmain, AU

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond encapsulant control method
- Patent number 8,293,589
- Issue date Oct 23, 2012
- Zamtec Limited
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with wire bonds in low modulus fill encapsulant
- Patent number 8,063,318
- Issue date Nov 22, 2011
- Silverbrook Research Pty Ltd
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of electronic components
- Patent number 8,039,974
- Issue date Oct 18, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bond encapsulation profiling
- Patent number 8,025,204
- Issue date Sep 27, 2011
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing wire bond profile height in integrated circuits...
- Patent number 7,988,033
- Issue date Aug 2, 2011
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonder forming low profile wire bonds between integrated circui...
- Patent number 7,946,465
- Issue date May 24, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of adhering wire bond loops to reduce loop height
- Patent number 7,875,504
- Issue date Jan 25, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printhead with exterior surface profiled for wiping maintenance sta...
- Patent number 7,832,838
- Issue date Nov 16, 2010
- Silverbrook Research Pty Ltd
- Vesa Karppinen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Integrated circuit support for low profile wire bond
- Patent number 7,824,013
- Issue date Nov 2, 2010
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of encapsulating wire bonds
- Patent number 7,803,659
- Issue date Sep 28, 2010
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding an integrated circuit die and a printed circ...
- Patent number 7,802,715
- Issue date Sep 28, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with wire bonds adhered between integrated circui...
- Patent number 7,741,720
- Issue date Jun 22, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low profile wire bonds between integrated circuit...
- Patent number 7,669,751
- Issue date Mar 2, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond encapsulant application control
- Patent number 7,659,141
- Issue date Feb 9, 2010
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying encapsulant to wire bonds
- Patent number 7,618,842
- Issue date Nov 17, 2009
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z-shaped insulation displacement contact
- Patent number 6,702,605
- Issue date Mar 9, 2004
- Krone GbmH
- Laval Chung Long Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi wire insulation displacement contact and a method of making m...
- Patent number 6,406,323
- Issue date Jun 18, 2002
- Krone GmbH
- Laval Chung Long Shan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
- Publication number 20120048185
- Publication date Mar 1, 2012
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
- Publication number 20120018905
- Publication date Jan 26, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTHEAD ASSEMBLY WITH PROFILED EXTERIOR SURFACE
- Publication number 20110025778
- Publication date Feb 3, 2011
- SILVERBROOK RESEARCH PTY LTD
- Vesa Karppinen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ASSEMBLY OF ELECTRONIC COMPONENTS
- Publication number 20100244282
- Publication date Sep 30, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...
- Publication number 20100133323
- Publication date Jun 3, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND ENCAPSULANT CONTROL METHOD
- Publication number 20100124803
- Publication date May 20, 2010
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ENCAPSULATING WIRE BONDS
- Publication number 20100055849
- Publication date Mar 4, 2010
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTHEAD WITH EXTERIOR SURFACE PROFILED FOR WIPING MAINTENANCE STA...
- Publication number 20090179963
- Publication date Jul 16, 2009
- SILVERBROOK RESEARCH PTY LTD
- Vesa Karppinen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090135569
- Publication date May 28, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING ENCAPSULANT TO WIRE BONDS
- Publication number 20090081834
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WIRE BONDS ADHERED BETWEEN INTEGRATED CIRCUI...
- Publication number 20090079081
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUIT...
- Publication number 20090078744
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND ENCAPSULANT APPLICATION CONTROL
- Publication number 20090081833
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT
- Publication number 20090081829
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090079097
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDER FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUI...
- Publication number 20090078740
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF WIRE BOND ENCAPSULATION PROFILING
- Publication number 20090081818
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING WIRE BOND PROFILE HEIGHT IN INTEGRATED CIRCUITS...
- Publication number 20090081832
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUPPORT FOR LOW PROFILE WIRE BOND
- Publication number 20090079793
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi wire insulation displacement contact and a method of making m...
- Publication number 20060030199
- Publication date Feb 9, 2006
- ADC GmbH
- Laval Chung Long Shan
- H01 - BASIC ELECTRIC ELEMENTS

Laval Chung-Long-Shan

Person

Patents Grantslast 30 patents

Wire bond encapsulant control method

Electronic component with wire bonds in low modulus fill encapsulant

Assembly of electronic components

Method of wire bond encapsulation profiling

Method of reducing wire bond profile height in integrated circuits...

Wirebonder forming low profile wire bonds between integrated circui...

Method of adhering wire bond loops to reduce loop height

Printhead with exterior surface profiled for wiping maintenance sta...

Integrated circuit support for low profile wire bond

Method of encapsulating wire bonds

Method of wire bonding an integrated circuit die and a printed circ...

Electronic device with wire bonds adhered between integrated circui...

Method of forming low profile wire bonds between integrated circuit...

Wire bond encapsulant application control

Method of applying encapsulant to wire bonds

Z-shaped insulation displacement contact

Multi wire insulation displacement contact and a method of making m...

Patents Applicationslast 30 patents

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

PRINTHEAD ASSEMBLY WITH PROFILED EXTERIOR SURFACE

ASSEMBLY OF ELECTRONIC COMPONENTS

METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...

WIRE BOND ENCAPSULANT CONTROL METHOD

METHOD OF ENCAPSULATING WIRE BONDS

PRINTHEAD WITH EXTERIOR SURFACE PROFILED FOR WIPING MAINTENANCE STA...

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

METHOD OF APPLYING ENCAPSULANT TO WIRE BONDS

ELECTRONIC DEVICE WITH WIRE BONDS ADHERED BETWEEN INTEGRATED CIRCUI...

METHOD OF FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUIT...

WIRE BOND ENCAPSULANT APPLICATION CONTROL

METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

WIREBONDER FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUI...

METHOD OF WIRE BOND ENCAPSULATION PROFILING

METHOD OF REDUCING WIRE BOND PROFILE HEIGHT IN INTEGRATED CIRCUITS...

INTEGRATED CIRCUIT SUPPORT FOR LOW PROFILE WIRE BOND

Multi wire insulation displacement contact and a method of making m...