Lawrence E. Felton

Person

Hopkinton, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a MEMS device
- Patent number 8,343,369
- Issue date Jan 1, 2013
- Analog Devices, Inc.
- Manolo G. Mena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capped sensor
- Patent number 7,795,723
- Issue date Sep 14, 2010
- Analog Devices, Inc.
- Kevin H.-L. Chau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with non-standard profile
- Patent number 7,521,363
- Issue date Apr 21, 2009
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level capped sensor
- Patent number 7,357,017
- Issue date Apr 15, 2008
- Analog Devices, Inc.
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Static dissipation treatments for optical package windows
- Patent number 7,338,705
- Issue date Mar 4, 2008
- Analog Devices, Inc.
- John R. Martin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Wafer level capped sensor
- Patent number 7,275,424
- Issue date Oct 2, 2007
- Analog Devices, Inc.
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged microchip with premolded-type package
- Patent number 7,166,911
- Issue date Jan 23, 2007
- Analog Devices, Inc.
- Maurice S. Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-surface mounting member and electronic device
- Patent number 7,040,922
- Issue date May 9, 2006
- Analog Devices, Inc.
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Static dissipation treatments for optical package windows
- Patent number 7,033,672
- Issue date Apr 25, 2006
- Analog Devices, Inc.
- John R. Martin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Fabricating complex micro-electromechanical systems using a flip bo...
- Patent number 6,964,882
- Issue date Nov 15, 2005
- Analog Devices, Inc.
- Chang-Han Yun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical switching apparatus and method of assembling same
- Patent number 6,940,636
- Issue date Sep 6, 2005
- Analog Devices, Inc.
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with conductive path through substrate
- Patent number 6,936,918
- Issue date Aug 30, 2005
- Analog Devices, Inc.
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabricating integrated micro-electromechanical systems using an int...
- Patent number 6,933,163
- Issue date Aug 23, 2005
- Analog Devices, Inc.
- Chang-Han Yun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fiber-attached optical devices with in-plane micromachined mirrors
- Patent number 6,931,170
- Issue date Aug 16, 2005
- Analog Devices, Inc.
- Chang-Han Yun
- G02 - OPTICS
Information Patent Grant
MEMS capping method and apparatus
- Patent number 6,893,574
- Issue date May 17, 2005
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for protecting micro electromechanical systems st...
- Patent number 6,759,273
- Issue date Jul 6, 2004
- Analog Devices, Inc.
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a cover cap for semiconductor wafer devices
- Patent number 6,352,935
- Issue date Mar 5, 2002
- Analog Devices, Inc.
- David J. Collins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Producing a MEMS Device
- Publication number 20110266639
- Publication date Nov 3, 2011
- Analog Devices, Inc.
- Manolo G. Mena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
String With Refractory Metal Core For String Ribbon Crystal Growth
- Publication number 20100055412
- Publication date Mar 4, 2010
- Evergreen Solar, Inc
- Christine Richardson
- C30 - CRYSTAL GROWTH
Information Patent Application
Ribbon Crystal String with Extruded Refractory Material
- Publication number 20090061224
- Publication date Mar 5, 2009
- Evergreen Solar, Inc
- Christine Richardson
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of producing a MEMS device
- Publication number 20080225505
- Publication date Sep 18, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE
- Publication number 20080150104
- Publication date Jun 26, 2008
- Michael A. Zimmerman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Level Capped Sensor
- Publication number 20080009091
- Publication date Jan 10, 2008
- Analog Devices, Inc.
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged microphone with electrically coupled lid
- Publication number 20070071268
- Publication date Mar 29, 2007
- Analog Devices, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Partially etched leadframe packages having different top and bottom...
- Publication number 20070040231
- Publication date Feb 22, 2007
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Static dissipation treatments for optical package windows
- Publication number 20060159911
- Publication date Jul 20, 2006
- Analog Devices, Inc.
- John R. Martin
- G02 - OPTICS
Information Patent Application
MEMS device with non-standard profile
- Publication number 20060027885
- Publication date Feb 9, 2006
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of producing a MEMS device
- Publication number 20060027522
- Publication date Feb 9, 2006
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level capped sensor
- Publication number 20050262929
- Publication date Dec 1, 2005
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capped sensor
- Publication number 20050205959
- Publication date Sep 22, 2005
- Kevin H.-L. Chau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Conductive bond for through-wafer interconnect
- Publication number 20050170609
- Publication date Aug 4, 2005
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE
- Publication number 20050127499
- Publication date Jun 16, 2005
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stress sensitive microchip with premolded-type package
- Publication number 20050056870
- Publication date Mar 17, 2005
- Maurice S. Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level capped sensor
- Publication number 20050054133
- Publication date Mar 10, 2005
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged microchip with premolded-type package
- Publication number 20050035446
- Publication date Feb 17, 2005
- Maurice S. Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-surface mounting member and electronic device
- Publication number 20040244510
- Publication date Dec 9, 2004
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fiber-attached optical devices with in-plane micromachined mirrors
- Publication number 20040076366
- Publication date Apr 22, 2004
- Chang-Han Yun
- G02 - OPTICS
Information Patent Application
Fabricating complex micro-electromechanical systems using a flip bo...
- Publication number 20040061192
- Publication date Apr 1, 2004
- Chang-Han Yun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabricating complex micro-electromechanical systems using a dummy h...
- Publication number 20040063237
- Publication date Apr 1, 2004
- Chang-Han Yun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabricating complex micro-electromechanical systems using an interm...
- Publication number 20040063239
- Publication date Apr 1, 2004
- Chang-Han Yun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Static dissipation treatments for optical package windows
- Publication number 20030179986
- Publication date Sep 25, 2003
- John R. Martin
- G02 - OPTICS
Information Patent Application
MEMS capping method and apparatus
- Publication number 20030075794
- Publication date Apr 24, 2003
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optical switching apparatus and method for assembling same
- Publication number 20030053233
- Publication date Mar 20, 2003
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for protecting micro electromechanical systems st...
- Publication number 20020094662
- Publication date Jul 18, 2002
- Lawrence E. Felton
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Lawrence E. Felton

Person

Patents Grantslast 30 patents

Method of producing a MEMS device

Capped sensor

MEMS device with non-standard profile

Wafer level capped sensor

Static dissipation treatments for optical package windows

Wafer level capped sensor

Packaged microchip with premolded-type package

Multi-surface mounting member and electronic device

Static dissipation treatments for optical package windows

Fabricating complex micro-electromechanical systems using a flip bo...

Optical switching apparatus and method of assembling same

MEMS device with conductive path through substrate

Fabricating integrated micro-electromechanical systems using an int...

Fiber-attached optical devices with in-plane micromachined mirrors

MEMS capping method and apparatus

Method and device for protecting micro electromechanical systems st...

Method of forming a cover cap for semiconductor wafer devices

Patents Applicationslast 30 patents

Method of Producing a MEMS Device

String With Refractory Metal Core For String Ribbon Crystal Growth

Ribbon Crystal String with Extruded Refractory Material

Method of producing a MEMS device

LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE

Wafer Level Capped Sensor

Packaged microphone with electrically coupled lid

Partially etched leadframe packages having different top and bottom...

Static dissipation treatments for optical package windows

MEMS device with non-standard profile

Method of producing a MEMS device

Wafer level capped sensor

Capped sensor

Conductive bond for through-wafer interconnect

MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE

Stress sensitive microchip with premolded-type package

Wafer level capped sensor

Packaged microchip with premolded-type package

Multi-surface mounting member and electronic device

Fiber-attached optical devices with in-plane micromachined mirrors

Fabricating complex micro-electromechanical systems using a flip bo...

Fabricating complex micro-electromechanical systems using a dummy h...

Fabricating complex micro-electromechanical systems using an interm...

Static dissipation treatments for optical package windows

MEMS capping method and apparatus

Optical switching apparatus and method for assembling same

Method and device for protecting micro electromechanical systems st...