Lei SHI

Person

Nantong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated mult-device chip and package
- Patent number 12,224,279
- Issue date Feb 11, 2025
- Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Tsung-Wen Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 12,205,828
- Issue date Jan 21, 2025
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized link adaption
- Patent number 11,902,019
- Issue date Feb 13, 2024
- Nokia Solutions and Networks Oy
- Mark Marsan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packaging structure
- Patent number 11,791,310
- Issue date Oct 17, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package device
- Patent number 11,670,571
- Issue date Jun 6, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surge protection apparatus having embedded fuse
- Patent number 11,545,827
- Issue date Jan 3, 2023
- Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Kueir-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure
- Patent number 11,430,706
- Issue date Aug 30, 2022
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient voltage suppression device with thermal cutoff
- Patent number 11,139,287
- Issue date Oct 5, 2021
- Littefluse Semiconductor (WUXI) Co., Ltd.
- Chuanfang Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 11,139,267
- Issue date Oct 5, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package method and semiconductor chip package de...
- Patent number 11,127,661
- Issue date Sep 21, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 10,998,289
- Issue date May 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package array
- Patent number 10,937,745
- Issue date Mar 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improvement layer and fabrication method the...
- Patent number 10,910,343
- Issue date Feb 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structures
- Patent number 10,741,499
- Issue date Aug 11, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system-level packaging methods and structures
- Patent number 10,515,883
- Issue date Dec 24, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 9,761,549
- Issue date Sep 12, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system-level packaging methods and structures
- Patent number 9,595,490
- Issue date Mar 14, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC packaging methods and structures
- Patent number 9,589,815
- Issue date Mar 7, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,548,282
- Issue date Jan 17, 2017
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging methods and structures
- Patent number 9,543,269
- Issue date Jan 10, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on leadframe semiconductor packaging structure and fabric...
- Patent number 9,502,337
- Issue date Nov 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure
- Patent number 9,497,862
- Issue date Nov 15, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chip package
- Patent number 9,362,173
- Issue date Jun 7, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method
- Patent number 9,324,583
- Issue date Apr 26, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for chip packaging structure
- Patent number 9,293,432
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out high-density packaging methods and structures
- Patent number 9,287,205
- Issue date Mar 15, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional system-level packaging methods and structures
- Patent number 9,099,448
- Issue date Aug 4, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out high-density packaging methods and structures
- Patent number 9,040,347
- Issue date May 26, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TVS WITH ENHANCED REPETITIVE SURGE PERFORMANCE
- Publication number 20240096869
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MULT-DEVICE CHIP AND PACKAGE
- Publication number 20220320072
- Publication date Oct 6, 2022
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Tsung-Wen MOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220246446
- Publication date Aug 4, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20220246540
- Publication date Aug 4, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED LINK ADAPTION
- Publication number 20220069939
- Publication date Mar 3, 2022
- Nokia Solutions and Networks Oy
- Mark MARSAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE DEVICE
- Publication number 20210391239
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20210391300
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURGE PROTECTION APPARATUS HAVING EMBEDDED FUSE
- Publication number 20210288491
- Publication date Sep 16, 2021
- Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Kueir-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES
- Publication number 20210233890
- Publication date Jul 29, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Voltage Suppression Device with Thermal Cutoff
- Publication number 20200321327
- Publication date Oct 8, 2020
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Chuanfang CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027857
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027858
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200027859
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20190385921
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ARRAY
- Publication number 20190385955
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE METHOD AND SEMICONDUCTOR CHIP PACKAGE DE...
- Publication number 20190385938
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
- Publication number 20170133305
- Publication date May 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL PACKAGING STRUCTURES
- Publication number 20170077035
- Publication date Mar 16, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20160189983
- Publication date Jun 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20160190028
- Publication date Jun 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRIC...
- Publication number 20160126166
- Publication date May 5, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND PACKAGING METHOD
- Publication number 20150303159
- Publication date Oct 22, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20150294949
- Publication date Oct 15, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150287688
- Publication date Oct 8, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES
- Publication number 20150228568
- Publication date Aug 13, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES
- Publication number 20140124927
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20140124929
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
- Publication number 20130320534
- Publication date Dec 5, 2013
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated mult-device chip and package

Packaging structure and fabrication method thereof

Optimized link adaption

Semiconductor packaging structure

Semiconductor chip package device

Surge protection apparatus having embedded fuse

Packaging structure

Transient voltage suppression device with thermal cutoff

Packaging structure and forming method thereof

Semiconductor chip package method and semiconductor chip package de...

Packaging structure and forming method thereof

Semiconductor chip package array

Package structure with improvement layer and fabrication method the...

Flip-chip method

System-level packaging structures

3D system-level packaging methods and structures

Semiconductor device and fabrication method

3D system-level packaging methods and structures

Semiconductor IC packaging methods and structures

Metal contact for semiconductor device

System-level packaging methods and structures

Flip-chip on leadframe semiconductor packaging structure and fabric...

Packaging structure

Metal contact for semiconductor device

Method for chip package

Packaging method

Metal contact for chip packaging structure

Fan-out high-density packaging methods and structures

Three-dimensional system-level packaging methods and structures

Fan-out high-density packaging methods and structures

Patents Applicationslast 30 patents

TVS WITH ENHANCED REPETITIVE SURGE PERFORMANCE

Two-In-One Lead Frame Package

INTEGRATED MULT-DEVICE CHIP AND PACKAGE

PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGING STRUCTURE AND FORMATION METHOD THEREOF

OPTIMIZED LINK ADAPTION

SEMICONDUCTOR CHIP PACKAGE DEVICE

SEMICONDUCTOR PACKAGING STRUCTURE

SURGE PROTECTION APPARATUS HAVING EMBEDDED FUSE

PACKAGING STRUCTURES

Transient Voltage Suppression Device with Thermal Cutoff

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGING STRUCTURE

SEMICONDUCTOR CHIP PACKAGE ARRAY

FLIP-CHIP METHOD

SEMICONDUCTOR CHIP PACKAGE METHOD AND SEMICONDUCTOR CHIP PACKAGE DE...

3D SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES

SYSTEM-LEVEL PACKAGING STRUCTURES

METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING

METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING

FLIP-CHIP ON LEADFRAME SEMICONDUCTOR PACKAGING STRUCTURE AND FABRIC...

SEMICONDUCTOR DEVICE PACKAGE AND PACKAGING METHOD

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES

SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES