Leif Bergstedt

Person

Sjomarken, SE

People

Patents Grantslast 30 patents

Information Patent Grant
Component for electromagnetic waves and a method for manufacturing...
- Patent number 7,192,882
- Issue date Mar 20, 2007
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board integrated switch
- Patent number 7,102,480
- Issue date Sep 5, 2006
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed board assembly
- Patent number 7,051,430
- Issue date May 30, 2006
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method relating to anodic bonding
- Patent number 6,951,797
- Issue date Oct 4, 2005
- Imego AB
- Leif Bergstedt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Arrangement mounted on a printed circuit board and method of produc...
- Patent number 6,724,283
- Issue date Apr 20, 2004
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with supporting layers of different mater...
- Patent number 6,717,063
- Issue date Apr 6, 2004
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for electronic components
- Patent number 6,690,583
- Issue date Feb 10, 2004
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement relating to conductor carriers and methods for the manu...
- Patent number 6,617,509
- Issue date Sep 9, 2003
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board assembly and method of its manufacture
- Patent number 6,552,265
- Issue date Apr 22, 2003
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for vertical connection of conductors in a device in the mic...
- Patent number 6,459,347
- Issue date Oct 1, 2002
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing printed circuit boards and a heat sink arrangem...
- Patent number 6,459,585
- Issue date Oct 1, 2002
- Telefonaktiebolaget L.M. Ericsson
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an arrangement relating to chip carriers
- Patent number 6,433,423
- Issue date Aug 13, 2002
- Telefonaktiebolaget L M Ericsson (Publ)
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and arrangement pertaining to microwave lenses
- Patent number 6,424,318
- Issue date Jul 23, 2002
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component
- Patent number 6,421,225
- Issue date Jul 16, 2002
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB and method for making PCB with thin copper layer
- Patent number 6,395,378
- Issue date May 28, 2002
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for more even current distribution in a transmission line
- Patent number 6,369,677
- Issue date Apr 9, 2002
- Telefonaktiebolaget LM Ericsson (publ)
- Spartak Gevorgian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method in electronics systems
- Patent number 6,370,030
- Issue date Apr 9, 2002
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Roland Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microstrip arrangement
- Patent number 6,266,016
- Issue date Jul 24, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a multi-layer circuit board with supporti...
- Patent number 6,249,962
- Issue date Jun 26, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an arrangement in an electronics system
- Patent number 6,230,401
- Issue date May 15, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device on printed boards
- Patent number 6,174,562
- Issue date Jan 16, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Leif Roland Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna arrangement
- Patent number 6,150,982
- Issue date Nov 21, 2000
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Means and method for mounting electronics
- Patent number 6,108,205
- Issue date Aug 22, 2000
- Telefonaktiebolaget LM Ericsson
- Leif R. Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor
- Patent number 6,038,122
- Issue date Mar 14, 2000
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip supporting element
- Patent number 6,011,692
- Issue date Jan 4, 2000
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstrip structure
- Patent number 5,977,915
- Issue date Nov 2, 1999
- Telefonaktiebolaget LM Ericsson
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARRANGEMENT WITH CHIP AND CARRIER
- Publication number 20120224346
- Publication date Sep 6, 2012
- Leif BERGSTEDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component for electromagnetic waves and a method for manufacturing...
- Publication number 20050215020
- Publication date Sep 29, 2005
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board intergrated switch
- Publication number 20040112732
- Publication date Jun 17, 2004
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed board assembly and method of its manufacture
- Publication number 20030221864
- Publication date Dec 4, 2003
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical element and method for manufacturing the same
- Publication number 20030152694
- Publication date Aug 14, 2003
- Leif Bergstedt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Antenna arrangement
- Publication number 20020140611
- Publication date Oct 3, 2002
- TELEFONAKTIEBOLAGET L M ERICSSON (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna arrangement and a communication arrangement comprising the...
- Publication number 20020080089
- Publication date Jun 27, 2002
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric spacing layer
- Publication number 20020058137
- Publication date May 16, 2002
- Leif Roland Bergstedt
- B32 - LAYERED PRODUCTS
Information Patent Application
Arrangement mounted on a printed circuit board and method of produc...
- Publication number 20020055199
- Publication date May 9, 2002
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sequentially processed circuitry
- Publication number 20020023775
- Publication date Feb 28, 2002
- Per Ligander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microwave dielectric material
- Publication number 20010050603
- Publication date Dec 13, 2001
- LEIF BERGSTEDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENT
- Publication number 20010011606
- Publication date Aug 9, 2001
- LEIF BERGSTEDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB and method for making PCB with thin copper layer
- Publication number 20010008680
- Publication date Jul 19, 2001
- Leif Bergstedt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and an arrangement relating to chip carriers
- Publication number 20010004132
- Publication date Jun 21, 2001
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS

Leif Bergstedt

Person

Patents Grantslast 30 patents

Component for electromagnetic waves and a method for manufacturing...

Printed circuit board integrated switch

Method of manufacturing a printed board assembly

Method relating to anodic bonding

Arrangement mounted on a printed circuit board and method of produc...

Multi-layer circuit board with supporting layers of different mater...

Carrier for electronic components

Arrangement relating to conductor carriers and methods for the manu...

Printed board assembly and method of its manufacture

Method for vertical connection of conductors in a device in the mic...

Method of producing printed circuit boards and a heat sink arrangem...

Method and an arrangement relating to chip carriers

Method and arrangement pertaining to microwave lenses

Electric component

PCB and method for making PCB with thin copper layer

Arrangement for more even current distribution in a transmission line

Device and method in electronics systems

Microstrip arrangement

Process for manufacturing a multi-layer circuit board with supporti...

Method and an arrangement in an electronics system

Method and device on printed boards

Antenna arrangement

Means and method for mounting electronics

Decoupling capacitor

Chip supporting element

Microstrip structure

Patents Applicationslast 30 patents

ARRANGEMENT WITH CHIP AND CARRIER

Component for electromagnetic waves and a method for manufacturing...

Printed circuit board intergrated switch

Printed board assembly and method of its manufacture

Optical element and method for manufacturing the same

Antenna arrangement

Antenna arrangement and a communication arrangement comprising the...

Dielectric spacing layer

Arrangement mounted on a printed circuit board and method of produc...

Sequentially processed circuitry

Microwave dielectric material

ELECTRIC COMPONENT

PCB and method for making PCB with thin copper layer

Method and an arrangement relating to chip carriers