Li-Chih Fang

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Scalable multi-phase switching converter and converter module and c...
- Patent number 11,929,681
- Issue date Mar 12, 2024
- Richtek Technology Corporation
- Chih-Wen Hsiao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 10,950,557
- Issue date Mar 16, 2021
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package structure comprising encapsula...
- Patent number 10,840,200
- Issue date Nov 17, 2020
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and chip structure
- Patent number 10,607,860
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having conductive shield
- Patent number 10,276,510
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure comprising encapsulant having concave surface
- Patent number 10,163,834
- Issue date Dec 25, 2018
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package having continuous through hole via c...
- Patent number 9,972,554
- Issue date May 15, 2018
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 9,831,219
- Issue date Nov 28, 2017
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 9,825,010
- Issue date Nov 21, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin fan-out multi-chip stacked packages and the method for manufac...
- Patent number 9,761,568
- Issue date Sep 12, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,659,911
- Issue date May 23, 2017
- Powertech Technology Inc.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-voltage protection circuit and over-voltage protection method
- Patent number 9,356,518
- Issue date May 31, 2016
- Richtek Technology Corp.
- An-Tung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Voltage converting controller and method of voltage converting control
- Patent number 9,276,473
- Issue date Mar 1, 2016
- Richtek Technology Corp.
- An-Tung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Switching regulator control circuit with multiple clock frequency s...
- Patent number 9,088,204
- Issue date Jul 21, 2015
- Richtek Technology Corporation
- Li-Wen Fang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fuse circuit for final test trimming of integrated circuit chip
- Patent number 8,878,304
- Issue date Nov 4, 2014
- Richtek Technology Corporation, R.O.C.
- Li-Wen Fang
- G11 - INFORMATION STORAGE
Information Patent Grant
Constant on-time switching regulator, and control method and on-tim...
- Patent number 8,669,747
- Issue date Mar 11, 2014
- Ricktek Technology Corporation, R.O.C.
- Li-Wen Fang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Constant on-time switching regulator, and control method and on-tim...
- Patent number 8,531,166
- Issue date Sep 10, 2013
- Richtek Technology Corporation, R.O.C.
- Li-Wen Fang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-chip stacked package and its mother chip to save interposer
- Patent number 8,304,917
- Issue date Nov 6, 2012
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method to save interposer
- Patent number 7,927,919
- Issue date Apr 19, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level shift circuit
- Patent number 7,839,197
- Issue date Nov 23, 2010
- Richtek Technology Corp.
- An-Tung Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Mold array process for semiconductor packages
- Patent number 7,691,676
- Issue date Apr 6, 2010
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package-on-package (POP) device avoiding crack at sol...
- Patent number 7,619,305
- Issue date Nov 17, 2009
- Powertech Technology Inc.
- Wen-Jeng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SCALABLE MULTI-PHASE SWITCHING CONVERTER AND CONVERTER MODULE AND C...
- Publication number 20220271668
- Publication date Aug 25, 2022
- Richtek Technology Corporation
- Chih-Wen Hsiao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200176395
- Publication date Jun 4, 2020
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20190096821
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20190096699
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20190051626
- Publication date Feb 14, 2019
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180076158
- Publication date Mar 15, 2018
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20170309597
- Publication date Oct 26, 2017
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287874
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287870
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING CONTINUOUS THROUGH HOLE VIA C...
- Publication number 20170256471
- Publication date Sep 7, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FAN-OUT MULTI-CHIP STACKED PACKAGES AND THE METHOD FOR MANUFAC...
- Publication number 20170186737
- Publication date Jun 29, 2017
- Powertech Technology Inc.
- Li-Chih FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FAN-OUT STACKED PACKAGES
- Publication number 20170186711
- Publication date Jun 29, 2017
- Powertech Technology Inc.
- Li-Chih FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER-VOLTAGE PROTECTION CIRCUIT AND OVER-VOLTAGE PROTECTION METHOD
- Publication number 20160043627
- Publication date Feb 11, 2016
- RICHTEK TECHNOLOGY CORP.
- An-Tung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SWITCHING REGULATOR CONTROL CIRCUIT WITH MULTIPLE CLOCK FREQUENCY S...
- Publication number 20130342183
- Publication date Dec 26, 2013
- Li-Wen FANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FUSE CIRCUIT FOR FINAL TEST TRIMMING OF INTEGRATED CIRCUIT CHIP
- Publication number 20130113049
- Publication date May 9, 2013
- Richtek Technology Corporation, R.O.C.
- LI-WEN FANG
- G11 - INFORMATION STORAGE
Information Patent Application
Constant on-time switching regulator, and control method and on-tim...
- Publication number 20120019219
- Publication date Jan 26, 2012
- Richtek Technology Corporation, R.O.C.
- Li-Wen Fang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Constant on-time switching regulator, and control method and on-tim...
- Publication number 20120019218
- Publication date Jan 26, 2012
- Richtek Technology Corporation
- Li-Wen Fang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER
- Publication number 20110133324
- Publication date Jun 9, 2011
- Powertech Technology Inc.
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-mode buck switching regulator and control circuit therefor
- Publication number 20110018514
- Publication date Jan 27, 2011
- Richtek Technology Corporation, R.O.C.
- An-Tung Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for cutting large-size wafer and apparatus for the same
- Publication number 20100000384
- Publication date Jan 7, 2010
- Powertech Technology Inc.
- Li-chih Fang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Electronic packaging method and apparatus
- Publication number 20090200685
- Publication date Aug 13, 2009
- Powertech Technology Inc.
- Li-chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip packaging process including simpification and mergence of burn...
- Publication number 20090137069
- Publication date May 28, 2009
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Level shift circuit
- Publication number 20090066399
- Publication date Mar 12, 2009
- An-Tung Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor package-on-package (POP) device avoiding crack at sol...
- Publication number 20090045523
- Publication date Feb 19, 2009
- Powertech Technology Inc.
- Wen-Jeng Fan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package substrate and its solder pad
- Publication number 20080272489
- Publication date Nov 6, 2008
- Powertech Technology Inc.
- Li-chih Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC chip package with near substrate scale chip attachment
- Publication number 20080169551
- Publication date Jul 17, 2008
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package structure
- Publication number 20080099890
- Publication date May 1, 2008
- Powertech Technology Inc.
- Cheng-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE WITH STRONG ADHESION
- Publication number 20070298225
- Publication date Dec 27, 2007
- Powertech Technology Inc.
- Chi-Jang Lo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure of semiconductor substrate and molding method
- Publication number 20070278692
- Publication date Dec 6, 2007
- Powertech Technology Inc.
- Chi-Jang Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure to reduce warpage
- Publication number 20070257345
- Publication date Nov 8, 2007
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS

Li-Chih Fang

Person

Patents Grantslast 30 patents

Scalable multi-phase switching converter and converter module and c...

Stacked chip package structure and manufacturing method thereof

Manufacturing method of chip package structure comprising encapsula...

Package structure and chip structure

Manufacturing method of package structure having conductive shield

Chip package structure comprising encapsulant having concave surface

Wafer level chip scale package having continuous through hole via c...

Manufacturing method of package structure

Stacked chip package structure and manufacturing method thereof

Thin fan-out multi-chip stacked packages and the method for manufac...

Package structure and manufacturing method thereof

Over-voltage protection circuit and over-voltage protection method

Voltage converting controller and method of voltage converting control

Switching regulator control circuit with multiple clock frequency s...

Fuse circuit for final test trimming of integrated circuit chip

Constant on-time switching regulator, and control method and on-tim...

Constant on-time switching regulator, and control method and on-tim...

Multi-chip stacked package and its mother chip to save interposer

Semiconductor packaging method to save interposer

Level shift circuit

Mold array process for semiconductor packages

Semiconductor package-on-package (POP) device avoiding crack at sol...

Patents Applicationslast 30 patents

SCALABLE MULTI-PHASE SWITCHING CONVERTER AND CONVERTER MODULE AND C...

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND CHIP STRUCTURE

MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE STRUCTURE

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL CHIP SCALE PACKAGE HAVING CONTINUOUS THROUGH HOLE VIA C...

THIN FAN-OUT MULTI-CHIP STACKED PACKAGES AND THE METHOD FOR MANUFAC...

STRUCTURE AND METHOD OF FAN-OUT STACKED PACKAGES

OVER-VOLTAGE PROTECTION CIRCUIT AND OVER-VOLTAGE PROTECTION METHOD

SWITCHING REGULATOR CONTROL CIRCUIT WITH MULTIPLE CLOCK FREQUENCY S...

FUSE CIRCUIT FOR FINAL TEST TRIMMING OF INTEGRATED CIRCUIT CHIP

Constant on-time switching regulator, and control method and on-tim...

Constant on-time switching regulator, and control method and on-tim...

MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER

Dual-mode buck switching regulator and control circuit therefor

Method for cutting large-size wafer and apparatus for the same

Electronic packaging method and apparatus

Chip packaging process including simpification and mergence of burn...

Level shift circuit

Semiconductor package-on-package (POP) device avoiding crack at sol...

Package substrate and its solder pad

IC chip package with near substrate scale chip attachment

Ball grid array package structure

CIRCUIT SUBSTRATE WITH STRONG ADHESION

Structure of semiconductor substrate and molding method

Package structure to reduce warpage