Li-Shu Chen

Person

Ellicott City, MD, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for maximizing breakdown voltage in semiconduct...
- Patent number 8,110,494
- Issue date Feb 7, 2012
- Northrop Grumman Systems Corporation
- John V. Veliadis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for maximizing breakdown voltage in semiconduct...
- Patent number 7,667,242
- Issue date Feb 23, 2010
- Northrop Grumman Systems Corporation
- John V. Veliadis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a self aligned ion implanted gate and guard ring s...
- Patent number 7,547,586
- Issue date Jun 16, 2009
- Northrop Grumman Corp
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for use in a static induction transistor ha...
- Patent number 7,372,087
- Issue date May 13, 2008
- Northrop Grumman Corporation
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale package and method of assembly
- Patent number 6,939,784
- Issue date Sep 6, 2005
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer scale package and method of assembly
- Patent number 6,812,558
- Issue date Nov 2, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive type microelectromechanical RF switch
- Patent number 6,777,765
- Issue date Aug 17, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached process for SiC
- Patent number 5,851,852
- Issue date Dec 22, 1998
- Northrop Grumman Corporation
- John A. Ostop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate fabrication process for silicon carbide static in...
- Patent number 5,807,773
- Issue date Sep 15, 1998
- Northrop Grumman Corporation
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making transparent polysilicon gate for imaging arrays
- Patent number 5,369,040
- Issue date Nov 29, 1994
- Westinghouse Electric Corporation
- James Halvis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a component insulator on a silicon substrate
- Patent number 5,110,755
- Issue date May 5, 1992
- Westinghouse Electric Corp.
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20080128913
- Publication date Jun 5, 2008
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure for use in a static induction transistor ha...
- Publication number 20080006848
- Publication date Jan 10, 2008
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a self aligned ion implanted gate and guard ring s...
- Publication number 20070281406
- Publication date Dec 6, 2007
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20040188821
- Publication date Sep 30, 2004
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer scale package and method of assembly
- Publication number 20040191957
- Publication date Sep 30, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE TYPE MICROELECTROMECHANICAL RF SWITCH
- Publication number 20040119126
- Publication date Jun 24, 2004
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Li-Shu Chen

Person

Patents Grantslast 30 patents

Systems and methods for maximizing breakdown voltage in semiconduct...

Systems and methods for maximizing breakdown voltage in semiconduct...

Method of making a self aligned ion implanted gate and guard ring s...

Semiconductor structure for use in a static induction transistor ha...

Wafer scale package and method of assembly

Wafer scale package and method of assembly

Capacitive type microelectromechanical RF switch

Die attached process for SiC

Self-aligned gate fabrication process for silicon carbide static in...

Method of making transparent polysilicon gate for imaging arrays

Process for forming a component insulator on a silicon substrate

Patents Applicationslast 30 patents

TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES

Semiconductor structure for use in a static induction transistor ha...

Method of making a self aligned ion implanted gate and guard ring s...

WAFER SCALE PACKAGE AND METHOD OF ASSEMBLY

Wafer scale package and method of assembly

CAPACITIVE TYPE MICROELECTROMECHANICAL RF SWITCH