Ling Pan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal distribution network for semiconductor devices and associat...
- Patent number 11,688,662
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...
- Publication number 20240332216
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...
- Publication number 20240304598
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH DOWNSET
- Publication number 20240282751
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...
- Publication number 20240234390
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...
- Publication number 20240234403
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
- Publication number 20240203842
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
- Publication number 20240194547
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Ling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
- Publication number 20240162207
- Publication date May 16, 2024
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240162206
- Publication date May 16, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240071869
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240071881
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE
- Publication number 20240063201
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES
- Publication number 20240063135
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Hong Wan NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR STACKED MEMORY DIES
- Publication number 20240063168
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
- Publication number 20240057265
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION DESIGNS FOR MEMORY SYSTEMS
- Publication number 20240039185
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...
- Publication number 20230207488
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISTRIBUTION NETWORK FOR SEMICONDUCTOR DEVICES AND ASSOCIAT...
- Publication number 20230061803
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal distribution network for semiconductor devices and associat...

Patents Applicationslast 30 patents

MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...

SUBSTRATES WITH DOWNSET

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...

STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...

SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE

SUBSTRATES FOR SEMICONDUCTOR PACKAGES

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE

LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE

FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES

WIRE BONDING FOR STACKED MEMORY DIES

STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...

CONNECTION DESIGNS FOR MEMORY SYSTEMS

METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...

THERMAL DISTRIBUTION NETWORK FOR SEMICONDUCTOR DEVICES AND ASSOCIAT...