Linlin Chen

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature annealing of metallization micro-structu...
- Patent number 7,462,269
- Issue date Dec 9, 2008
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrochemically depositing metal on a se...
- Patent number 7,332,066
- Issue date Feb 19, 2008
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating-rinse-plating process for fabricating copper interconnects
- Patent number 7,198,705
- Issue date Apr 3, 2007
- Texas Instruments Incorporated
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of submicron metallization using electrochemical deposition...
- Patent number 7,144,805
- Issue date Dec 5, 2006
- Semitool, Inc.
- LinLin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying metal features onto barrier layers using electr...
- Patent number 7,135,404
- Issue date Nov 14, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for electrochemically depositing metal on a se...
- Patent number 7,115,196
- Issue date Oct 3, 2006
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified clean chemistry and megasonic nozzle for removing backside...
- Patent number 7,067,015
- Issue date Jun 27, 2006
- Texas Instruments Incorporated
- Changfeng Xia
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Contact assemblies, methods for making contact assemblies, and plat...
- Patent number 7,048,841
- Issue date May 23, 2006
- Semitool, Inc.
- Robert W. Batz, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for low-temperature annealing of metallization...
- Patent number 7,001,471
- Issue date Feb 21, 2006
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
- Patent number 6,998,275
- Issue date Feb 14, 2006
- Texas Instruments Incorporated
- Jin Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for low temperature annealing of metallization...
- Patent number 6,994,776
- Issue date Feb 7, 2006
- Semitool Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact assemblies, methods for making contact assemblies, and plat...
- Patent number 6,939,448
- Issue date Sep 6, 2005
- Semitool, Inc.
- Robert W. Batz, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrolytically depositing copper on a se...
- Patent number 6,932,892
- Issue date Aug 23, 2005
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for electrolytically depositing copper on a wo...
- Patent number 6,919,013
- Issue date Jul 19, 2005
- Semitool, Inc.
- LinLin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact assemblies, methods for making contact assemblies, and plat...
- Patent number 6,911,127
- Issue date Jun 28, 2005
- Semitool, Inc.
- Robert W. Batz, Jr.
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Corrosion resistance for copper interconnects
- Patent number 6,908,851
- Issue date Jun 21, 2005
- Texas Instruments Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated chemical management system executing improved electrolyte...
- Patent number 6,899,805
- Issue date May 31, 2005
- Semitool, Inc.
- LinLin Chen
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for processing the surface of a microelectron...
- Patent number 6,869,510
- Issue date Mar 22, 2005
- Semitool, Inc.
- Daniel J. Woodruff
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Apparatus and method for electrolytically depositing copper on a se...
- Patent number 6,811,675
- Issue date Nov 2, 2004
- Semitool, Inc.
- LinLin Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Submicron metallization using electrochemical deposition
- Patent number 6,806,186
- Issue date Oct 19, 2004
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a conductive copper structure
- Patent number 6,743,719
- Issue date Jun 1, 2004
- Texas Instruments Incorporated
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-ECD wet surface modification to improve wettability and reduced...
- Patent number 6,730,597
- Issue date May 4, 2004
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing the surface of a microelectronic workpiece
- Patent number 6,699,373
- Issue date Mar 2, 2004
- Semitool, Inc.
- Daniel J. Woodruff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing the surface of a microelectron...
- Patent number 6,645,356
- Issue date Nov 11, 2003
- Semitool, Inc.
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for electrolytically depositing copper on a se...
- Patent number 6,638,410
- Issue date Oct 28, 2003
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for electrolytically depositing a metal on a w...
- Patent number 6,632,345
- Issue date Oct 14, 2003
- Semitool, Inc.
- LinLin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrochemically depositing metal on a semiconductor wo...
- Patent number 6,565,729
- Issue date May 20, 2003
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact assemblies, methods for making contact assemblies, and plat...
- Patent number 6,527,925
- Issue date Mar 4, 2003
- Semitool, Inc.
- Robert W. Batz
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Apparatus for low-temperature annealing of metallization microstruc...
- Patent number 6,508,920
- Issue date Jan 21, 2003
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing the surface of a microelectron...
- Patent number 6,309,524
- Issue date Oct 30, 2001
- Semitool, Inc.
- Daniel J. Woodruff
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20100116671
- Publication date May 13, 2010
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CMP related scratch and defect improvement
- Publication number 20080153393
- Publication date Jun 26, 2008
- Texas Instruments Inc.
- Linlin Chen
- B24 - GRINDING POLISHING
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060084264
- Publication date Apr 20, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079083
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079085
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079084
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20050245083
- Publication date Nov 3, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical methods for the formation of protective features on...
- Publication number 20050230262
- Publication date Oct 20, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for copper plating using electroless plating a...
- Publication number 20050189213
- Publication date Sep 1, 2005
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20050173252
- Publication date Aug 11, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20050150770
- Publication date Jul 14, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20050139478
- Publication date Jun 30, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating compositions and methods for electroplating
- Publication number 20050081744
- Publication date Apr 21, 2005
- Semitool, Inc.
- John L. Klocke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of submicron metallization using electrochemical deposition...
- Publication number 20050051436
- Publication date Mar 10, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Corrosion resistance for copper interconnects
- Publication number 20040259352
- Publication date Dec 23, 2004
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
- Publication number 20040203176
- Publication date Oct 14, 2004
- Jin Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating-rinse-plating process for fabricating copper interconnects
- Publication number 20040118692
- Publication date Jun 24, 2004
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20040092065
- Publication date May 13, 2004
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modified clean chemistry and megasonic nozzle for removing backside...
- Publication number 20040084059
- Publication date May 6, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Changfeng Xia
- B08 - CLEANING
Information Patent Application
Method for applying metal features onto barrier layers using electr...
- Publication number 20040072419
- Publication date Apr 15, 2004
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20040035694
- Publication date Feb 26, 2004
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20040035710
- Publication date Feb 26, 2004
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20040035708
- Publication date Feb 26, 2004
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20040031693
- Publication date Feb 19, 2004
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20030196892
- Publication date Oct 23, 2003
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Pre-ECD wet surface modification to improve wettability and reduce...
- Publication number 20030176064
- Publication date Sep 18, 2003
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact assemblies, methods for making contact assemblies, and plat...
- Publication number 20030173209
- Publication date Sep 18, 2003
- Robert W. Batz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20030155249
- Publication date Aug 21, 2003
- Semitool, Inc.
- Linlin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for electrolytically depositing copper on a se...
- Publication number 20030141194
- Publication date Jul 31, 2003
- LinLin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and apparatus for processing the surface of a microelectron...
- Publication number 20020108851
- Publication date Aug 15, 2002
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Linlin Chen

Person

Patents Grantslast 30 patents

Method for low temperature annealing of metallization micro-structu...

Apparatus and method for electrochemically depositing metal on a se...

Plating-rinse-plating process for fabricating copper interconnects

Method of submicron metallization using electrochemical deposition...

Method for applying metal features onto barrier layers using electr...

Apparatus and method for electrochemically depositing metal on a se...

Modified clean chemistry and megasonic nozzle for removing backside...

Contact assemblies, methods for making contact assemblies, and plat...

Method and apparatus for low-temperature annealing of metallization...

Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application

Method and apparatus for low temperature annealing of metallization...

Contact assemblies, methods for making contact assemblies, and plat...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing copper on a wo...

Contact assemblies, methods for making contact assemblies, and plat...

Corrosion resistance for copper interconnects

Automated chemical management system executing improved electrolyte...

Methods and apparatus for processing the surface of a microelectron...

Apparatus and method for electrolytically depositing copper on a se...

Submicron metallization using electrochemical deposition

Method for forming a conductive copper structure

Pre-ECD wet surface modification to improve wettability and reduced...

Apparatus for processing the surface of a microelectronic workpiece

Methods and apparatus for processing the surface of a microelectron...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing a metal on a w...

Method for electrochemically depositing metal on a semiconductor wo...

Contact assemblies, methods for making contact assemblies, and plat...

Apparatus for low-temperature annealing of metallization microstruc...

Methods and apparatus for processing the surface of a microelectron...

Patents Applicationslast 30 patents

Apparatus and method for electrochemically depositing metal on a se...

CMP related scratch and defect improvement

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Apparatus and method for electrochemically depositing metal on a se...

Electrochemical methods for the formation of protective features on...

Method and apparatus for copper plating using electroless plating a...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing copper on a se...

Electroplating compositions and methods for electroplating

Method of submicron metallization using electrochemical deposition...

Corrosion resistance for copper interconnects

Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application

Plating-rinse-plating process for fabricating copper interconnects

Apparatus and method for electrolytically depositing copper on a se...

Modified clean chemistry and megasonic nozzle for removing backside...

Method for applying metal features onto barrier layers using electr...

Contact assemblies, methods for making contact assemblies, and plat...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrochemically depositing metal on a se...

Contact assemblies, methods for making contact assemblies, and plat...

Pre-ECD wet surface modification to improve wettability and reduce...

Contact assemblies, methods for making contact assemblies, and plat...

Apparatus and method for electrolytically depositing copper on a se...

Apparatus and method for electrolytically depositing copper on a se...

Methods and apparatus for processing the surface of a microelectron...