Long-Ching Wang

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thin substrate and method of making th...
- Patent number 11,784,141
- Issue date Oct 10, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 11,721,665
- Issue date Aug 8, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flank and method of maki...
- Patent number 11,581,195
- Issue date Feb 14, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thin substrate and method of making th...
- Patent number 11,495,548
- Issue date Nov 8, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for semi-wafer level packaging
- Patent number 11,430,762
- Issue date Aug 30, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having integrated inductor, resistor an...
- Patent number 11,309,233
- Issue date Apr 19, 2022
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super-fast transient response (STR) AC/DC converter for high power...
- Patent number 11,258,270
- Issue date Feb 22, 2022
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package having enlarged gate pad and method of making...
- Patent number 11,222,858
- Issue date Jan 11, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making reverse conducting insulated gate bipolar transistor
- Patent number 11,101,137
- Issue date Aug 24, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 11,069,604
- Issue date Jul 20, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having high mechanical strength
- Patent number 10,991,660
- Issue date Apr 27, 2021
- ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common source land grid array package
- Patent number 10,991,680
- Issue date Apr 27, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super-fast transient response (STR) AC/DC converter for high power...
- Patent number 10,818,568
- Issue date Oct 27, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Super-fast transient response (STR) AC/DC Converter for high power...
- Patent number 10,630,080
- Issue date Apr 21, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging arrangements including high density interconnect bridge
- Patent number 10,438,881
- Issue date Oct 8, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
- Patent number 10,431,515
- Issue date Oct 1, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for interconnecting stacked dies using metal p...
- Patent number 9,972,602
- Issue date May 15, 2018
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving the reliability of a connection...
- Patent number 9,659,851
- Issue date May 23, 2017
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for incorporating passive devices in an integr...
- Patent number 9,444,510
- Issue date Sep 13, 2016
- Marvell World Trade Ltd.
- Poh Boon Leong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 8,846,538
- Issue date Sep 30, 2014
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel based lead frame packaging method and device
- Patent number 8,435,837
- Issue date May 7, 2013
- Silicon Storage Technology, Inc.
- Chen Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 8,258,065
- Issue date Sep 4, 2012
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 7,605,092
- Issue date Oct 20, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an oxide layer
- Patent number 6,407,008
- Issue date Jun 18, 2002
- Integrated Device Technology, Inc.
- Yingbo Jia
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE
- Publication number 20240096768
- Publication date Mar 21, 2024
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20230420340
- Publication date Dec 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20230307325
- Publication date Sep 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE
- Publication number 20230215783
- Publication date Jul 6, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...
- Publication number 20230021687
- Publication date Jan 26, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20220278076
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220278009
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEMI-WAFER LEVEL PACKAGING
- Publication number 20220208724
- Publication date Jun 30, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...
- Publication number 20220199425
- Publication date Jun 23, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...
- Publication number 20210398926
- Publication date Dec 23, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20210175155
- Publication date Jun 10, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...
- Publication number 20210125940
- Publication date Apr 29, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...
- Publication number 20210082793
- Publication date Mar 18, 2021
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON SOURCE LAND GRID ARRAY PACKAGE
- Publication number 20210083088
- Publication date Mar 18, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR AND METHOD O...
- Publication number 20210082790
- Publication date Mar 18, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER-FAST TRANSIENT RESPONSE (STR) AC/DC CONVERTER FOR HIGH POWER...
- Publication number 20200412148
- Publication date Dec 31, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194395
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194347
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH
- Publication number 20190189569
- Publication date Jun 20, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Self-Alignment of Integrated Circuit Dies
- Publication number 20180068921
- Publication date Mar 8, 2018
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING ARRANGEMENTS INCLUDING HIGH DENSITY INTERCONNECT BRIDGE
- Publication number 20170125334
- Publication date May 4, 2017
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INTERCONNECTING STACKED DIES USING METAL P...
- Publication number 20160247784
- Publication date Aug 25, 2016
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INCORPORATING PASSIVE DEVICES IN AN INTEGR...
- Publication number 20150244410
- Publication date Aug 27, 2015
- Marvell World Trade Ltd.
- Poh Boon Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVING THE RELIABILITY OF A CONNECTION...
- Publication number 20150228569
- Publication date Aug 13, 2015
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel Based Lead Frame Packaging Method And Device
- Publication number 20110140254
- Publication date Jun 16, 2011
- Silicon Storage Technology, Inc.
- Chen Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...
- Publication number 20100173468
- Publication date Jul 8, 2010
- Bomy CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...
- Publication number 20090004807
- Publication date Jan 1, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS

Long-Ching Wang

Person

Patents Grantslast 30 patents

Semiconductor package having mold locking feature

Semiconductor package having thin substrate and method of making th...

Wafer level chip scale semiconductor package

DMOS FET chip scale package and method of making the same

Semiconductor package having wettable lead flank and method of maki...

Semiconductor package having thin substrate and method of making th...

Method for semi-wafer level packaging

Power semiconductor package having integrated inductor, resistor an...

Super-fast transient response (STR) AC/DC converter for high power...

Semiconductor package having enlarged gate pad and method of making...

Method of making reverse conducting insulated gate bipolar transistor

Semiconductor package and method of making the same

Semiconductor package having high mechanical strength

Common source land grid array package

Super-fast transient response (STR) AC/DC converter for high power...

Super-fast transient response (STR) AC/DC Converter for high power...

Packaging arrangements including high density interconnect bridge

Methods and apparatus for self-alignment of integrated circuit dies

Method and apparatus for interconnecting stacked dies using metal p...

Method and apparatus for improving the reliability of a connection...

Method and apparatus for incorporating passive devices in an integr...

Passive elements, articles, packages, semiconductor composites, and...

Panel based lead frame packaging method and device

Passive elements, articles, packages, semiconductor composites, and...

Passive elements, articles, packages, semiconductor composites, and...

Method of forming an oxide layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE

SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME

METHOD FOR SEMI-WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...

SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...

COMMON SOURCE LAND GRID ARRAY PACKAGE

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR AND METHOD O...

SUPER-FAST TRANSIENT RESPONSE (STR) AC/DC CONVERTER FOR HIGH POWER...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH

Methods and Apparatus for Self-Alignment of Integrated Circuit Dies

PACKAGING ARRANGEMENTS INCLUDING HIGH DENSITY INTERCONNECT BRIDGE

METHOD AND APPARATUS FOR INTERCONNECTING STACKED DIES USING METAL P...

METHOD AND APPARATUS FOR INCORPORATING PASSIVE DEVICES IN AN INTEGR...

METHOD AND APPARATUS FOR IMPROVING THE RELIABILITY OF A CONNECTION...

Panel Based Lead Frame Packaging Method And Device

PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...

PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...