Lopergolo F. Emanuele

Person

Marlboro, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Land grid array interposer with compressible conductors
- Patent number 8,672,688
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Robert F. Florence
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Delayed contact action connector
- Patent number 8,662,931
- Issue date Mar 4, 2014
- International Business Machines Corporation
- H. John Healey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delayed contact action connector
- Patent number 8,282,420
- Issue date Oct 9, 2012
- International Business Machines Corporation
- H. John Healey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large array surface mount technology connector cradle assembly
- Patent number 7,758,390
- Issue date Jul 20, 2010
- International Business Machines Corporation
- Michael J. Domitrovits
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large array connector for coupling wafers with a printed circuit board
- Patent number 7,547,231
- Issue date Jun 16, 2009
- International Business Machines Corporation
- Michael J. Domitrovits
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuation mechanism for mating electronic card interconnect systems
- Patent number 7,505,251
- Issue date Mar 17, 2009
- International Business Machines Corporation
- Shawn M. Canfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro compliant interconnect apparatus for integrated circuit devices
- Patent number 6,674,297
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Robert F. Florence
- G01 - MEASURING TESTING
Information Patent Grant
Process for electroplating pins of an integrated circuit package
- Patent number 6,527,935
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Emanuele F. Lopergolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shorting pin grid array pins for plating
- Patent number 6,497,805
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Arden S. Lake
- G01 - MEASURING TESTING
Information Patent Grant
Method for shorting pin grid array pins for plating
- Patent number 6,214,180
- Issue date Apr 10, 2001
- International Business Machines Corporation
- Arden S. Lake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pin contact mechanism for plating pin grid arrays
- Patent number 6,197,171
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Emanuele F. Lopergolo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating structure for a pin grid array package
- Patent number 6,051,119
- Issue date Apr 18, 2000
- International Business Machines Corporation
- Paul F. Findeis
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High density electrical interconnect apparatus and method
- Patent number 5,800,184
- Issue date Sep 1, 1998
- International Business Machines Corporation
- Emanuele Frank Lopergolo
- G01 - MEASURING TESTING
Information Patent Grant
Probe assembly
- Patent number 5,729,148
- Issue date Mar 17, 1998
- International Business Machines Corporation
- Joseph M. Sullivan
- G01 - MEASURING TESTING
Information Patent Grant
Method for mapping surfaces adapted for receiving electrical compon...
- Patent number 5,691,467
- Issue date Nov 25, 1997
- International Business Machines Corporation
- Lewis S. Goldmann
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LAND GRID ARRAY INTERPOSER WITH COMPRESSIBLE CONDUCTORS
- Publication number 20130183872
- Publication date Jul 18, 2013
- International Business Machines Corporation
- Robert F. FLORENCE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAYED CONTACT ACTION CONNECTOR
- Publication number 20130023160
- Publication date Jan 24, 2013
- International Business Machines Corporation
- H. John Healey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD
- Publication number 20110067910
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Michael J. Domitrovits
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DELAYED CONTACT ACTION CONNECTOR
- Publication number 20110070775
- Publication date Mar 24, 2011
- International Business Machines Corporation
- H. John Healey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE ARRAY SURFACE MOUNT TECHNOLOGY CONNECTOR CRADLE ASSEMBLY
- Publication number 20090215289
- Publication date Aug 27, 2009
- International Business Machines Corporation
- MICHAEL J. DOMITROVITS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuation mechanism for mating electronic card interconnect systems
- Publication number 20070097605
- Publication date May 3, 2007
- International Business Machines Corporation
- Shawn M. Canfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO COMPLIANT INTERCONNECT APPARATUS FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20040008048
- Publication date Jan 15, 2004
- International Business Machines Corporation
- Robert F. Florence
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR SHORTING PIN GRID ARRAY PINS FOR PLATING
- Publication number 20020125124
- Publication date Sep 12, 2002
- Arden S. Lake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for electroplating pins of an integrated circuit package
- Publication number 20010004965
- Publication date Jun 28, 2001
- Emanuele F. Lopergolo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Lopergolo F. Emanuele

Person

Patents Grantslast 30 patents

Land grid array interposer with compressible conductors

Delayed contact action connector

Delayed contact action connector

Large array surface mount technology connector cradle assembly

Large array connector for coupling wafers with a printed circuit board

Actuation mechanism for mating electronic card interconnect systems

Micro compliant interconnect apparatus for integrated circuit devices

Process for electroplating pins of an integrated circuit package

Method for shorting pin grid array pins for plating

Method for shorting pin grid array pins for plating

Pin contact mechanism for plating pin grid arrays

Plating structure for a pin grid array package

High density electrical interconnect apparatus and method

Probe assembly

Method for mapping surfaces adapted for receiving electrical compon...

Patents Applicationslast 30 patents

LAND GRID ARRAY INTERPOSER WITH COMPRESSIBLE CONDUCTORS

DELAYED CONTACT ACTION CONNECTOR

COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD

DELAYED CONTACT ACTION CONNECTOR

LARGE ARRAY SURFACE MOUNT TECHNOLOGY CONNECTOR CRADLE ASSEMBLY

Actuation mechanism for mating electronic card interconnect systems

MICRO COMPLIANT INTERCONNECT APPARATUS FOR INTEGRATED CIRCUIT DEVICES

METHOD FOR SHORTING PIN GRID ARRAY PINS FOR PLATING

Process for electroplating pins of an integrated circuit package