Madhava Rao Yalamanchili

Person

Morgan Hill, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma etching of mask materials
- Patent number 11,915,932
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Toi Yue Becky Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 11,621,194
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,910,271
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,714,390
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,566,238
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,163,713
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer mask including non-photodefinable laser energy absorbin...
- Patent number 9,620,379
- Issue date Apr 11, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water soluble mask for substrate dicing by laser and plasma etch
- Patent number 9,263,308
- Issue date Feb 16, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing with partial pre-curing of UV re...
- Patent number 9,252,057
- Issue date Feb 2, 2016
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 9,245,802
- Issue date Jan 26, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing using water-soluble die attach film
- Patent number 9,224,625
- Issue date Dec 29, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid laser and plasma etch wafer dicing using substrate carrier
- Patent number 9,218,992
- Issue date Dec 22, 2015
- Applied Materials, Inc.
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of coating water soluble mask for laser scribing and plasma...
- Patent number 9,177,864
- Issue date Nov 3, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using pulse train laser with multiple-pulse bursts and...
- Patent number 9,129,904
- Issue date Sep 8, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing using physically-removable mask
- Patent number 9,126,285
- Issue date Sep 8, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing method for improving die packaging quality
- Patent number 9,105,710
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-step and asymmetrically shaped laser beam scribing
- Patent number 9,054,176
- Issue date Jun 9, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uniform masking for wafer dicing using laser and plasma etch
- Patent number 9,048,309
- Issue date Jun 2, 2015
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased deposition efficiency and higher chamber conductance with...
- Patent number 9,023,227
- Issue date May 5, 2015
- Applied Materials, Inc.
- Jivko Dinev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using hybrid laser scribing and plasma etch approach w...
- Patent number 9,018,079
- Issue date Apr 28, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser scribing and plasma etch for high die break strength and clea...
- Patent number 8,993,414
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Brad Eaton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing by laser ablation and plasma etch damage removal f...
- Patent number 8,980,726
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing from wafer backside
- Patent number 8,975,162
- Issue date Mar 10, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser and plasma etch wafer dicing with a double sided UV-curable a...
- Patent number 8,969,177
- Issue date Mar 3, 2015
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using hybrid split-beam laser scribing process with pl...
- Patent number 8,951,819
- Issue date Feb 10, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing using UV-curable adhesive film
- Patent number 8,946,057
- Issue date Feb 3, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid laser and plasma etch wafer dicing using substrate carrier
- Patent number 8,912,077
- Issue date Dec 16, 2014
- Applied Materials, Inc.
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing with wide kerf by laser scribing and plasma etching hy...
- Patent number 8,883,614
- Issue date Nov 11, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of coating water soluble mask for laser scribing and plasma...
- Patent number 8,859,397
- Issue date Oct 14, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20230207393
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING OF MASK MATERIALS
- Publication number 20220351972
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Toi Yue Becky Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20210134676
- Publication date May 6, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200286787
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200118880
- Publication date Apr 16, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20190088549
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20160141210
- Publication date May 19, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...
- Publication number 20160035577
- Publication date Feb 4, 2016
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND CLEA...
- Publication number 20150200119
- Publication date Jul 16, 2015
- Brad EATON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...
- Publication number 20150122419
- Publication date May 7, 2015
- Mohammad Kamruzzaman CHOWDHURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY
- Publication number 20150064878
- Publication date Mar 5, 2015
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR LASER FOCUS PLANE DETERMINATION IN A LASER SC...
- Publication number 20150037915
- Publication date Feb 5, 2015
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...
- Publication number 20150028446
- Publication date Jan 29, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOO...
- Publication number 20150011073
- Publication date Jan 8, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...
- Publication number 20140377937
- Publication date Dec 25, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20140367041
- Publication date Dec 18, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER, PLASMA ETCH, AND BACKSIDE GRIND PROCESS FOR WAFER DICING
- Publication number 20140363952
- Publication date Dec 11, 2014
- Wei-Sheng LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...
- Publication number 20140346641
- Publication date Nov 27, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING A SUBSTRATE
- Publication number 20140335679
- Publication date Nov 13, 2014
- TONG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-...
- Publication number 20140273401
- Publication date Sep 18, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE CONTROL FOR THROUGH SILICON VIA TILT IN ICP CHAMBER
- Publication number 20140273460
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- David REYLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING BY LASER ABLATION & PLASMA ETCH DAMAGE REMOVAL FOR...
- Publication number 20140213042
- Publication date Jul 31, 2014
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PERFORMING A VIA REVEAL ETCHING PROCESS FOR FORMING THR...
- Publication number 20140199833
- Publication date Jul 17, 2014
- Applied Materials, Inc.
- Rohit MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING FROM WAFER BACKSIDE
- Publication number 20140179084
- Publication date Jun 26, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER SOLUBLE MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH
- Publication number 20140174659
- Publication date Jun 26, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Edge Protection and Efficiency Using Inert Gas and Ring
- Publication number 20140179108
- Publication date Jun 26, 2014
- Dung Huu Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER
- Publication number 20140144585
- Publication date May 29, 2014
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20140120697
- Publication date May 1, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING HYBRID MULTI-STEP LASER SCRIBING PROCESS WITH PL...
- Publication number 20140120698
- Publication date May 1, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Madhava Rao Yalamanchili

Person

Patents Grantslast 30 patents

Wafer dicing using femtosecond-based laser and plasma etch

Plasma etching of mask materials

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Multi-layer mask including non-photodefinable laser energy absorbin...

Water soluble mask for substrate dicing by laser and plasma etch

Laser and plasma etch wafer dicing with partial pre-curing of UV re...

Wafer dicing using femtosecond-based laser and plasma etch

Laser and plasma etch wafer dicing using water-soluble die attach film

Hybrid laser and plasma etch wafer dicing using substrate carrier

Method of coating water soluble mask for laser scribing and plasma...

Wafer dicing using pulse train laser with multiple-pulse bursts and...

Laser and plasma etch wafer dicing using physically-removable mask

Wafer dicing method for improving die packaging quality

Multi-step and asymmetrically shaped laser beam scribing

Uniform masking for wafer dicing using laser and plasma etch

Increased deposition efficiency and higher chamber conductance with...

Wafer dicing using hybrid laser scribing and plasma etch approach w...

Laser scribing and plasma etch for high die break strength and clea...

Substrate dicing by laser ablation and plasma etch damage removal f...

Wafer dicing from wafer backside

Laser and plasma etch wafer dicing with a double sided UV-curable a...

Wafer dicing using hybrid split-beam laser scribing process with pl...

Laser and plasma etch wafer dicing using UV-curable adhesive film

Hybrid laser and plasma etch wafer dicing using substrate carrier

Wafer dicing with wide kerf by laser scribing and plasma etching hy...

Method of coating water soluble mask for laser scribing and plasma...

Patents Applicationslast 30 patents

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

PLASMA ETCHING OF MASK MATERIALS

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...

LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND CLEA...

LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...

WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY

METHOD AND SYSTEM FOR LASER FOCUS PLANE DETERMINATION IN A LASER SC...

WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...

LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOO...

METHOD OF COATING WATER SOLUBLE MASK FOR LASER SCRIBING AND PLASMA...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

LASER, PLASMA ETCH, AND BACKSIDE GRIND PROCESS FOR WAFER DICING

WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HY...

METHODS FOR ETCHING A SUBSTRATE

SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-...

PASSIVE CONTROL FOR THROUGH SILICON VIA TILT IN ICP CHAMBER

SUBSTRATE DICING BY LASER ABLATION & PLASMA ETCH DAMAGE REMOVAL FOR...

METHODS FOR PERFORMING A VIA REVEAL ETCHING PROCESS FOR FORMING THR...

WAFER DICING FROM WAFER BACKSIDE

WATER SOLUBLE MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

Wafer Edge Protection and Efficiency Using Inert Gas and Ring

HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING HYBRID MULTI-STEP LASER SCRIBING PROCESS WITH PL...