Mahdi Mohammadighaleni

Person

Phoenix, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
- Publication number 20240213301
- Publication date Jun 27, 2024
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186229
- Publication date Jun 6, 2024
- Intel Corporation
- Whitney M. Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...
- Publication number 20240186136
- Publication date Jun 6, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED C...
- Publication number 20240107784
- Publication date Mar 28, 2024
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS

Mahdi Mohammadighaleni

Person

Patents Applicationslast 30 patents

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...

METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED C...

THIN FILM CAPACITORS