Mahdi Mohammadighaleni

Person

Phoenix, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250219041
- Publication date Jul 3, 2025
- Intel Corporation
- Whitney M. Bryks
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND SYSTEM FOR COATING OF GLASS SUBSTRATE HAVING A PLURAL...
- Publication number 20250206659
- Publication date Jun 26, 2025
- Intel Corporation
- Joshua STACEY
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...
- Publication number 20250210506
- Publication date Jun 26, 2025
- Intel Corporation
- Kihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS
- Publication number 20250132239
- Publication date Apr 24, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
- Publication number 20240213301
- Publication date Jun 27, 2024
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186229
- Publication date Jun 6, 2024
- Intel Corporation
- Whitney M. Bryks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...
- Publication number 20240186136
- Publication date Jun 6, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED C...
- Publication number 20240107784
- Publication date Mar 28, 2024
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS

Mahdi Mohammadighaleni

Person

Patents Applicationslast 30 patents

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...

TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRAT...

APPARATUS AND SYSTEM FOR COATING OF GLASS SUBSTRATE HAVING A PLURAL...

PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIEL...

METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED C...

THIN FILM CAPACITORS