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Maki HASEGAWA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module and semiconductor device
    • Patent number 11,257,732
    • Issue date Feb 22, 2022
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package and terminal arrangement for semiconductor module
    • Patent number 11,069,602
    • Issue date Jul 20, 2021
    • Mitsubishi Electric Corporation
    • Shuhei Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module
    • Patent number 10,796,979
    • Issue date Oct 6, 2020
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module
    • Patent number 10,741,472
    • Issue date Aug 11, 2020
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device sorting system and semiconductor device
    • Patent number 10,566,222
    • Issue date Feb 18, 2020
    • Mitsubishi Electric Corporation
    • Shuhei Yokoyama
    • B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
  • Information Patent Grant

    Semiconductor device
    • Patent number D864135
    • Issue date Oct 22, 2019
    • Mitsubishi Electric Corporation
    • Shuhei Yokoyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor device
    • Patent number D859334
    • Issue date Sep 10, 2019
    • Mitsubishi Electric Corporation
    • Shuhei Yokoyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Method for manufacturing power module
    • Patent number 10,332,869
    • Issue date Jun 25, 2019
    • Mitsubishi Electric Corporation
    • Naoki Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 10,305,411
    • Issue date May 28, 2019
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module with dummy terminal structure
    • Patent number 10,074,585
    • Issue date Sep 11, 2018
    • Mitsubishi Electric Corporation
    • Shogo Shibata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module and control integrated circuit
    • Patent number 9,716,058
    • Issue date Jul 25, 2017
    • Mitsubishi Electric Corporation
    • Naoki Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor device
    • Patent number D783550
    • Issue date Apr 11, 2017
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Power semiconductor device
    • Patent number D777124
    • Issue date Jan 24, 2017
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Power semiconductor device
    • Patent number D772182
    • Issue date Nov 22, 2016
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Power semiconductor device
    • Patent number D770994
    • Issue date Nov 8, 2016
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Power semiconductor device
    • Patent number 9,041,456
    • Issue date May 26, 2015
    • Mitsubishi Electric Corporation
    • Maki Hasegawa
    • H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20200194353
    • Publication date Jun 18, 2020
    • Mitsubishi Electric Corporation
    • Shuhei YOKOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
    • Publication number 20190259681
    • Publication date Aug 22, 2019
    • Mitsubishi Electric Corporation
    • Maki HASEGAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20190115283
    • Publication date Apr 18, 2019
    • Mitsubishi Electric Corporation
    • Maki HASEGAWA
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    SEMICONDUCTOR DEVICE SORTING SYSTEM AND SEMICONDUCTOR DEVICE
    • Publication number 20190103297
    • Publication date Apr 4, 2019
    • Mitsubishi Electric Corporation
    • Shuhei YOKOYAMA
    • B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
  • Information Patent Application

    Semiconductor Module
    • Publication number 20180019695
    • Publication date Jan 18, 2018
    • Mitsubishi Electric Corporation
    • Maki HASEGAWA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    POWER MODULE
    • Publication number 20170345733
    • Publication date Nov 30, 2017
    • Mitsubishi Electric Corporation
    • Shogo SHIBATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING POWER MODULE
    • Publication number 20170236812
    • Publication date Aug 17, 2017
    • Mitsubishi Electric Corporation
    • Naoki IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20150155228
    • Publication date Jun 4, 2015
    • Mitsubishi Electric Corporation
    • Naoki IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20140184303
    • Publication date Jul 3, 2014
    • Mitsubishi Electric Corporation
    • Maki HASEGAWA
    • H01 - BASIC ELECTRIC ELEMENTS