Makoto Imanishi

Person

Hirakata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin sealing structure for electronic component and resin sealing...
- Patent number 8,358,018
- Issue date Jan 22, 2013
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 7,387,229
- Issue date Jun 17, 2008
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,246,430
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 6,787,391
- Issue date Sep 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Working method for holding a work object by suction
- Patent number 6,619,535
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,568,580
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components and apparatus and dispens...
- Patent number 6,527,905
- Issue date Mar 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,494,358
- Issue date Dec 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,481,616
- Issue date Nov 19, 2002
- Matsushita Electric Industrial Co. Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,392,202
- Issue date May 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging IC chip, and tape-shaped carrier...
- Patent number 6,332,268
- Issue date Dec 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,328,196
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Patent number 6,329,640
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding apparatus and method
- Patent number 6,302,317
- Issue date Oct 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting an electronic component
- Patent number 6,206,066
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method and bump bonding apparatus
- Patent number 6,017,812
- Issue date Jan 25, 2000
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump levelling method and bump levelling apparatus
- Patent number 5,899,140
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonder with a discard bonding area
- Patent number 5,899,375
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Koichi Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Linear actuating apparatus
- Patent number 5,783,915
- Issue date Jul 21, 1998
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Shida
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ultrasonic wire bonding apparatus and method
- Patent number 5,667,130
- Issue date Sep 16, 1997
- Matsushita Electric Industrial Co., Ltd.
- Makoto Morita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...
- Publication number 20090278265
- Publication date Nov 12, 2009
- Panasonic Corporation
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20080179378
- Publication date Jul 31, 2008
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20050071991
- Publication date Apr 7, 2005
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20040149803
- Publication date Aug 5, 2004
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding device and bump bonding method
- Publication number 20020030087
- Publication date Mar 14, 2002
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heating apparatus for bump bonding, bump bonding method and bump fo...
- Publication number 20020011479
- Publication date Jan 31, 2002
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042771
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding apparatus and method
- Publication number 20010042772
- Publication date Nov 22, 2001
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Imanishi

Person

Patents Grantslast 30 patents

Resin sealing structure for electronic component and resin sealing...

Method of forming bumps on a wafer utilizing a post-heating operati...

Apparatus and method for forming bump

Electronic component mounting apparatus and electronic component mo...

Device and method for forming bump

Method of forming bumps on a wafer utilizing a post-heating operati...

Working method for holding a work object by suction

Bump bonding apparatus and method

Method for mounting electronic components and apparatus and dispens...

Bump bonding apparatus and method

Bump bonding device and bump bonding method

Heating apparatus for bump bonding, bump bonding method and bump fo...

Method and apparatus for packaging IC chip, and tape-shaped carrier...

Bump bonding device and bump bonding method

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Apparatus for mounting an electronic component

Bump bonding method and bump bonding apparatus

Bump levelling method and bump levelling apparatus

Bump bonder with a discard bonding area

Linear actuating apparatus

Ultrasonic wire bonding apparatus and method

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMP...

Method of forming bumps on a wafer utilizing a post-heating operati...

Apparatus and method for forming bump

Electronic component mounting apparatus and electronic component mo...

Method of forming bumps on a wafer utilizing a post-heating operati...

Device and method for forming bump

Bump bonding device and bump bonding method

Heating apparatus for bump bonding, bump bonding method and bump fo...

Bump bonding apparatus and method

Bump bonding apparatus and method