Claims
- 1. A bump bonding apparatus comprising:
a bonding head for forming bumps on a wafer having an orientation flat on a circumferential edge thereof before the wafer is diced into a plurality of individual IC chips; a bonding stage for supporting and positioning the wafer such that said bonding head is operable to form bumps on the wafer; and a transporting device for transporting the wafer to said bonding stage and placing the wafer on said bonding stage in a prearranged orientation, said transporting device including an integral orientation flat detection component for detecting a position of the orientation flat of the wafer supported by said bonding stage.
- 2. The apparatus of claim 1, wherein said transporting device further includes a chucking component, said orientation flat detection component comprising an optical sensor having a light emitting element and a receptor element and being disposed on said chucking component.
- 3. The apparatus of claim 2, wherein said transporting device includes a plurality of orientation flat detection components arranged so as to be perpendicular to a travel direction of said transporting device.
- 4. The apparatus of claim 3, wherein said bonding stage has a top surface and a top edge around said top surface, said bonding stage including a bevel formed at said top edge and having a predetermined slope.
- 5. The apparatus of claim 1, wherein said transporting device includes a plurality of orientation flat detection components arranged so as to be perpendicular to a travel direction of said transporting device.
- 6. A bump bonding apparatus comprising:
a loading station including a carrier for storing a plurality of wafers in a stack formation so as to have a defined gap between each of the wafers, each of the wafers having an orientation flat on a circumferential edge thereof, said loading station further including a lifter for positioning said carrier at a vertical position, an integral orientation flat detecting device for detecting whether the orientation flat of a wafer in said carrier is in a specified reference position range, and an indicating device for notifying an operator when said detecting device detects the orientation flat of the wafer to be outside the specified reference position range; an extraction device for removing one of the wafers from said carrier; a bonding stage for supporting and positioning the removed wafer; a transporting device for transporting the removed wafer to said bonding stage and placing the wafer on said bonding stage; and a bonding head for forming bumps on the wafer removed by the extraction device and supported on said bonding stage before the wafer is diced into a plurality of individual IC chips.
- 7. The apparatus of claim 6, wherein said orientation flat detecting device comprises a plurality of optical sensors having a light-emitting element and a receptor element arranged perpendicular to a wafer extraction direction.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-173100 |
Jun 1998 |
JP |
|
Parent Case Info
[0001] This application is a Divisional application of application Ser. No. 09/335,779, filed Jun. 18, 1999.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09335779 |
Jun 1999 |
US |
Child |
09911801 |
Jul 2001 |
US |