Makoto Terui

Person

Yamana, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board with cavity for built-in electronic component and meth...
- Patent number 9,832,878
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,723,728
- Issue date Aug 1, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method for manufacturing the same and semicon...
- Patent number 9,706,663
- Issue date Jul 11, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,613,893
- Issue date Apr 4, 2017
- Ibiden Co., Ltd.
- Makoto Terui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,565,756
- Issue date Feb 7, 2017
- Ibiden Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,431,347
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, method for manufacturing the same and method...
- Patent number 9,433,085
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,425,159
- Issue date Aug 23, 2016
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,435
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,759,691
- Issue date Jun 24, 2014
- Ibiden Co., Ltd.
- Shinji Ouchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,755,196
- Issue date Jun 17, 2014
- Ibiden Co., Ltd.
- Shinji Ouchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,409,930
- Issue date Apr 2, 2013
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 8,018,055
- Issue date Sep 13, 2011
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,932,597
- Issue date Apr 26, 2011
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,928,546
- Issue date Apr 19, 2011
- Oki Electric Industry Co., Ltd.
- Morifumi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,714,434
- Issue date May 11, 2010
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor device having a heat radiati...
- Patent number 7,696,009
- Issue date Apr 13, 2010
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,696,630
- Issue date Apr 13, 2010
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device having a magnetic layer...
- Patent number 7,687,283
- Issue date Mar 30, 2010
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for chip size package and non-chip size package...
- Patent number 7,632,711
- Issue date Dec 15, 2009
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that suppresses variations in high frequency c...
- Patent number 7,545,036
- Issue date Jun 9, 2009
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,511,351
- Issue date Mar 31, 2009
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of circuit element chips...
- Patent number 7,482,202
- Issue date Jan 27, 2009
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,459,765
- Issue date Dec 2, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a plurality of circuit element chips...
- Patent number 7,321,163
- Issue date Jan 22, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 7,211,883
- Issue date May 1, 2007
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,173,335
- Issue date Feb 6, 2007
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive element chip and manufacturing method thereof, and highly i...
- Patent number 7,102,227
- Issue date Sep 5, 2006
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device having a heat radiati...
- Patent number 7,078,265
- Issue date Jul 18, 2006
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160073515
- Publication date Mar 10, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...
- Publication number 20160066422
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20160044789
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160037647
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160020164
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Makoto TERUI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150264817
- Publication date Sep 17, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150136459
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060124
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060127
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140360767
- Publication date Dec 11, 2014
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140360759
- Publication date Dec 11, 2014
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347837
- Publication date Nov 27, 2014
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD...
- Publication number 20140311780
- Publication date Oct 23, 2014
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231990
- Publication date Aug 21, 2014
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140102768
- Publication date Apr 17, 2014
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130256000
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130258625
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120006592
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120008295
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110171779
- Publication date Jul 14, 2011
- OKI SEMICONDUCTOR CO., LTD.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20100207244
- Publication date Aug 19, 2010
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20100025710
- Publication date Feb 4, 2010
- Oki Semiconductor Co., Ltd.
- Shigeru Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
- Publication number 20090203171
- Publication date Aug 13, 2009
- Oki Semiconductor Co., Ltd.
- Kengo TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20090096063
- Publication date Apr 16, 2009
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080237846
- Publication date Oct 2, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080099930
- Publication date May 1, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CIRCUIT ELEMENT CHIPS...
- Publication number 20080090330
- Publication date Apr 17, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080054426
- Publication date Mar 6, 2008
- Oki Electric Industry Co., Ltd.
- Morifumi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20070296069
- Publication date Dec 27, 2007
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device that suppresses variations in high frequency c...
- Publication number 20070021089
- Publication date Jan 25, 2007
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS

Makoto Terui

Person

Patents Grantslast 30 patents

Wiring board with cavity for built-in electronic component and meth...

Wiring board with built-in electronic component and method for manu...

Printed wiring board, method for manufacturing the same and semicon...

Wiring substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Wiring board and method for manufacturing the same

Electronic component, method for manufacturing the same and method...

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Semiconductor device manufacturing method

Semiconductor apparatus with decoupling capacitor

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor apparatus with decoupling capacitor

Method for fabricating a semiconductor device having a heat radiati...

Semiconductor device

Method of producing a semiconductor device having a magnetic layer...

Fabrication method for chip size package and non-chip size package...

Semiconductor device that suppresses variations in high frequency c...

Semiconductor device and method for fabricating the same

Semiconductor device including a plurality of circuit element chips...

Semiconductor apparatus with decoupling capacitor

Semiconductor device including a plurality of circuit element chips...

Semiconductor chip package

Semiconductor apparatus with decoupling capacitor

Passive element chip and manufacturing method thereof, and highly i...

Method for fabricating a semiconductor device having a heat radiati...

Patents Applicationslast 30 patents

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...

WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METH...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor apparatus with decoupling capacitor

Semiconductor device and fabrication method thereof

SEMICONDUCTOR DEVICE FABRICATING METHOD

Semiconductor apparatus with decoupling capacitor

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CIRCUIT ELEMENT CHIPS...

Semiconductor device and manufacturing method thereof

Semiconductor apparatus with decoupling capacitor

Semiconductor device that suppresses variations in high frequency c...