Manish CHANDHOK

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned gratings for tight pitch interconnects and methods of...
- Patent number 12,131,991
- Issue date Oct 29, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colored gratings in microelectronic structures
- Patent number 12,087,594
- Issue date Sep 10, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide layers to inhi...
- Patent number 12,080,639
- Issue date Sep 3, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,990,403
- Issue date May 21, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor architectures in semiconductor devices
- Patent number 11,901,404
- Issue date Feb 13, 2024
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,894,270
- Issue date Feb 6, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,862,463
- Issue date Jan 2, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having a portion without a liner material and related...
- Patent number 11,837,542
- Issue date Dec 5, 2023
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor architectures in semiconductor devices
- Patent number 11,791,375
- Issue date Oct 17, 2023
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered lines for interconnect performance improvement and proces...
- Patent number 11,664,305
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (IC's) with electro-migration (EM)—resistant se...
- Patent number 11,557,536
- Issue date Jan 17, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive cap-based approaches for conductive via fabrication and...
- Patent number 11,417,567
- Issue date Aug 16, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned repeatedly stackable 3D vertical RRAM
- Patent number 11,404,482
- Issue date Aug 2, 2022
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,335,598
- Issue date May 17, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having a portion without a liner material and related...
- Patent number 11,264,325
- Issue date Mar 1, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor architectures in semiconductor devices
- Patent number 11,264,449
- Issue date Mar 1, 2022
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned gratings for tight pitch interconnects and methods of...
- Patent number 11,251,117
- Issue date Feb 15, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivating silicide-based approaches for conductive via fabricatio...
- Patent number 11,239,112
- Issue date Feb 1, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 11,239,156
- Issue date Feb 1, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,227,766
- Issue date Jan 18, 2022
- Intel Corporation
- Marie Krysak
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 11,158,515
- Issue date Oct 26, 2021
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR WITH CHANNEL-SYMMETRIC GATE
- Publication number 20250006810
- Publication date Jan 2, 2025
- Intel Corporation
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING FIN ISOLATION...
- Publication number 20240395815
- Publication date Nov 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
- Publication number 20240290651
- Publication date Aug 29, 2024
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist developer
- Publication number 20240219842
- Publication date Jul 4, 2024
- Manish Chandhok
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...
- Publication number 20240204083
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...
- Publication number 20240203868
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW
- Publication number 20240194672
- Publication date Jun 13, 2024
- Intel Corporation
- Bharath Bangalore Rajeeva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...
- Publication number 20240170394
- Publication date May 23, 2024
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...
- Publication number 20240114693
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher M. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT
- Publication number 20240088218
- Publication date Mar 14, 2024
- Intel Corporation
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
- Publication number 20240038661
- Publication date Feb 1, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...
- Publication number 20230307298
- Publication date Sep 28, 2023
- Intel Corporation
- Charles H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT FEATURES FOR TRANSISTOR CONTACTS
- Publication number 20230282575
- Publication date Sep 7, 2023
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
- Publication number 20230187395
- Publication date Jun 15, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230095402
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230101212
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...
- Publication number 20220238376
- Publication date Jul 28, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20220223518
- Publication date Jul 14, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING BACKEND DOUBLE-WALLED CAPACITORS
- Publication number 20220199760
- Publication date Jun 23, 2022
- Intel Corporation
- Abhishek A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORED GRATINGS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199420
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...
- Publication number 20220192042
- Publication date Jun 16, 2022
- Intel Corporation
- Mohammad Enamul Kabir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...
- Publication number 20220173034
- Publication date Jun 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
- Publication number 20220148967
- Publication date May 12, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Manish CHANDHOK

Person

Patents Grantslast 30 patents

Selective metal removal for conductive interconnects in integrated...

Self aligned gratings for tight pitch interconnects and methods of...

Contact over active gate structures with metal oxide-caped contacts...

Colored gratings in microelectronic structures

Contact over active gate structures with metal oxide layers to inhi...

Subtractively patterned interconnect structures for integrated circ...

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Capacitor architectures in semiconductor devices

Grating replication using helmets and topographically-selective dep...

Interconnect structures and methods of fabrication

Metal oxide nanoparticles as fillable hardmask materials

Advanced lithography and self-assembled devices

Interconnects having a portion without a liner material and related...

Contact over active gate structures with metal oxide-caped contacts...

Capacitor architectures in semiconductor devices

Staggered lines for interconnect performance improvement and proces...

Integrated circuits (IC's) with electro-migration (EM)—resistant se...

Subtractively patterned interconnect structures for integrated circ...

Conductive cap-based approaches for conductive via fabrication and...

Self-aligned repeatedly stackable 3D vertical RRAM

Interconnect structures and methods of fabrication

Advanced lithography and self-assembled devices

Grating replication using helmets and topographically-selective dep...

Interconnects having a portion without a liner material and related...

Capacitor architectures in semiconductor devices

Self aligned gratings for tight pitch interconnects and methods of...

Passivating silicide-based approaches for conductive via fabricatio...

Planar slab vias for integrated circuit interconnects

Metal oxide nanoparticles as fillable hardmask materials

Selective metal removal for conductive interconnects in integrated...

Patents Applicationslast 30 patents

TRANSISTOR WITH CHANNEL-SYMMETRIC GATE

INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING FIN ISOLATION...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING

Photoresist developer

DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...

SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...

MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...

SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...

GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...

ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...

SELF-ALIGNED INTERCONNECT FEATURES FOR TRANSISTOR CONTACTS

OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...

PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS

INTEGRATED CIRCUIT DEVICE HAVING BACKEND DOUBLE-WALLED CAPACITORS

COLORED GRATINGS IN MICROELECTRONIC STRUCTURES

HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...

SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF...

INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...