Marc D. KNOX

Person

Hinesburg, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compliant organic substrate assembly for rigid probes
- Patent number 11,561,243
- Issue date Jan 24, 2023
- International Business Machines Corporation
- David Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and tuning thereof
- Patent number 11,322,473
- Issue date May 3, 2022
- International Business Machines Corporation
- David Audette
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low force wafer test probe
- Patent number 11,029,334
- Issue date Jun 8, 2021
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,663,487
- Issue date May 26, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe
- Patent number 10,444,260
- Issue date Oct 15, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,261,108
- Issue date Apr 16, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Light activated test connections
- Patent number 9,437,670
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Inc.
- Nathaniel R. Chadwick
- G01 - MEASURING TESTING
Information Patent Grant
Temporary liquid thermal interface material for surface tension adh...
- Patent number 9,269,603
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for margin testing integrated circuits using...
- Patent number 8,854,073
- Issue date Oct 7, 2014
- International Business Machines Corporation
- David A. Grosch
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing methods using well bias modification
- Patent number 7,759,960
- Issue date Jul 20, 2010
- International Business Machines Corporation
- Anne E. Gattiker
- G01 - MEASURING TESTING
Information Patent Grant
Liquid recovery, collection method and apparatus in a non-recircula...
- Patent number 7,567,090
- Issue date Jul 28, 2009
- International Business Machines Corporation
- Normand Cote
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing methods using well bias modification
- Patent number 7,564,256
- Issue date Jul 21, 2009
- International Business Machines Company
- Anne Gattiker
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing method using well bias modification
- Patent number 7,486,098
- Issue date Feb 3, 2009
- International Business Machines Corporation
- Anne Gattiker
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit testing methods using well bias modification
- Patent number 7,400,162
- Issue date Jul 15, 2008
- International Business Machines Corporation
- Anne Gattiker
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for temporary thermal coupling of an electronic device to...
- Patent number 7,332,927
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
Device burn in utilizing voltage control
- Patent number 7,265,561
- Issue date Sep 4, 2007
- International Business Machines Corporation
- Dennis R. Conti
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for temporary thermal coupling of an electroni...
- Patent number 7,259,580
- Issue date Aug 21, 2007
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Grant
Method of burning in an integrated circuit chip package
- Patent number 6,577,146
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Roger G. Gamache
- G01 - MEASURING TESTING
Information Patent Grant
Actively controlled heat sink for convective burn-in oven
- Patent number 6,504,392
- Issue date Jan 7, 2003
- International Business Machines Corporation
- John A. Fredeman
- G01 - MEASURING TESTING
Information Patent Grant
Burn in technique for chips containing different types of IC circuitry
- Patent number 6,122,760
- Issue date Sep 19, 2000
- International Business Machines Corporation
- David Alan Grosch
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COMPLIANT ORGANIC SUBSTRATE ASSEMBLY FOR RIGID PROBES
- Publication number 20210080486
- Publication date Mar 18, 2021
- International Business Machines Corporation
- David Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND TUNING THEREOF
- Publication number 20210082860
- Publication date Mar 18, 2021
- International Business Machines Corporation
- David Audette
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW FORCE WAFER TEST PROBE
- Publication number 20190361048
- Publication date Nov 28, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY
- Publication number 20190195913
- Publication date Jun 27, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358321
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358322
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...
- Publication number 20180358323
- Publication date Dec 13, 2018
- International Business Machines Corporation
- David M. Audette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW FORCE WAFER TEST PROBE
- Publication number 20180017592
- Publication date Jan 18, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY
- Publication number 20180017596
- Publication date Jan 18, 2018
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADH...
- Publication number 20140332810
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Luc GUERIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ACTIVATED TEST CONNECTIONS
- Publication number 20140145747
- Publication date May 29, 2014
- International Business Machines Corporation
- Nathaniel R. CHADWICK
- G01 - MEASURING TESTING
Information Patent Application
EFFICIENT METHODS AND APPARATUS FOR MARGIN TESTING INTEGRATED CIRCUITS
- Publication number 20130069678
- Publication date Mar 21, 2013
- International Business Machines Corporation
- David Grosch
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION
- Publication number 20080211531
- Publication date Sep 4, 2008
- Anne E. Gattiker
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION
- Publication number 20080211530
- Publication date Sep 4, 2008
- Anne E. Gattiker
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION
- Publication number 20080036486
- Publication date Feb 14, 2008
- Anne E. Gattiker
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...
- Publication number 20070285116
- Publication date Dec 13, 2007
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...
- Publication number 20060186909
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Paul J. Aube
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit testing methods using well bias modification
- Publication number 20060071653
- Publication date Apr 6, 2006
- Anne E. Gattiker
- G01 - MEASURING TESTING
Information Patent Application
DEVICE BURN IN UTILIZING VOLTAGE CONTROL
- Publication number 20050068053
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Dennis R. Conti
- G01 - MEASURING TESTING
Information Patent Application
Method of burning in an integrated circuit chip package
- Publication number 20020175694
- Publication date Nov 28, 2002
- Roger G. Gamache
- G01 - MEASURING TESTING
Information Patent Application
ACTIVELY CONTROLLED HEAT SINK FOR CONVECTIVE BURN-IN OVEN
- Publication number 20020075024
- Publication date Jun 20, 2002
- JOHN A. FREDEMAN
- G01 - MEASURING TESTING

Marc D. KNOX

Person

Patents Grantslast 30 patents

Compliant organic substrate assembly for rigid probes

Interconnect and tuning thereof

Low force wafer test probe

Low force wafer test probe with variable geometry

Low force wafer test probe

Low force wafer test probe with variable geometry

Light activated test connections

Temporary liquid thermal interface material for surface tension adh...

Methods and apparatus for margin testing integrated circuits using...

Integrated circuit testing methods using well bias modification

Liquid recovery, collection method and apparatus in a non-recircula...

Integrated circuit testing methods using well bias modification

Integrated circuit testing method using well bias modification

Integrated circuit testing methods using well bias modification

Apparatus for temporary thermal coupling of an electronic device to...

Device burn in utilizing voltage control

Method and apparatus for temporary thermal coupling of an electroni...

Method of burning in an integrated circuit chip package

Actively controlled heat sink for convective burn-in oven

Burn in technique for chips containing different types of IC circuitry

Patents Applicationslast 30 patents

COMPLIANT ORGANIC SUBSTRATE ASSEMBLY FOR RIGID PROBES

INTERCONNECT AND TUNING THEREOF

LOW FORCE WAFER TEST PROBE

LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TES...

LOW FORCE WAFER TEST PROBE

LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY

TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADH...

LIGHT ACTIVATED TEST CONNECTIONS

EFFICIENT METHODS AND APPARATUS FOR MARGIN TESTING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION

INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION

INTEGRATED CIRCUIT TESTING METHODS USING WELL BIAS MODIFICATION

APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO...

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONI...

Integrated circuit testing methods using well bias modification

DEVICE BURN IN UTILIZING VOLTAGE CONTROL

Method of burning in an integrated circuit chip package

ACTIVELY CONTROLLED HEAT SINK FOR CONVECTIVE BURN-IN OVEN