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Marcel A. Wall
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
Patent number
11,694,898
Issue date
Jul 4, 2023
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective metal deposition by patterning direct electroless metal p...
Patent number
11,501,967
Issue date
Nov 15, 2022
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interfacial layer for high resolution lithography (HRL) and high sp...
Patent number
11,445,616
Issue date
Sep 13, 2022
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus with a substrate provided with plasma treatment
Patent number
11,291,122
Issue date
Mar 29, 2022
Intel Corporation
Darko Grujicic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit device with monolayer bonding between surface structures
Patent number
11,177,232
Issue date
Nov 16, 2021
Intel Corporation
Suddhasattwa Nad
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Package architecture with improved via drill process and method for...
Patent number
11,177,234
Issue date
Nov 16, 2021
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit substrate and method of making
Patent number
10,658,281
Issue date
May 19, 2020
Intel Corporation
Rahul N. Manepalli
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
SINX BASED SURFACE FINISH ARCHITECTURE
Publication number
20240006299
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD
Publication number
20240006291
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20240006380
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...
Publication number
20240006283
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattawa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
Publication number
20240006298
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
Publication number
20240006300
Publication date
Jan 4, 2024
Intel Corporation
Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
Publication number
20240006297
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
Publication number
20230420322
Publication date
Dec 28, 2023
Intel Corporation
Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS
Publication number
20230402368
Publication date
Dec 14, 2023
Intel Corporation
Benjamin T. Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELE...
Publication number
20230317583
Publication date
Oct 5, 2023
Intel Corporation
Rahul N. MANEPALLI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
Publication number
20230317614
Publication date
Oct 5, 2023
Intel Corporation
Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPR...
Publication number
20230317584
Publication date
Oct 5, 2023
Intel Corporation
Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH GLASS VIA WITH A METAL WALL
Publication number
20230107096
Publication date
Apr 6, 2023
Intel Corporation
Darko GRUJICIC
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
Publication number
20230095846
Publication date
Mar 30, 2023
Intel Corporation
Benjamin T. Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITORS IN THROUGH GLASS VIAS
Publication number
20230091666
Publication date
Mar 23, 2023
Intel Corporation
Benjamin DUONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...
Publication number
20230085997
Publication date
Mar 23, 2023
Intel Corporation
Yi Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...
Publication number
20230082385
Publication date
Mar 16, 2023
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC-TO-METAL ADHESION PROMOTION MATERIAL
Publication number
20220293509
Publication date
Sep 15, 2022
Intel Corporation
Rahul Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...
Publication number
20220102259
Publication date
Mar 31, 2022
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20220093316
Publication date
Mar 24, 2022
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROLESS PLATING PROCESS
Publication number
20220010452
Publication date
Jan 13, 2022
Intel Corporation
Chandrasekharan NAIR
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MULTIPLE LAYER COPPER SEEDING
Publication number
20210090946
Publication date
Mar 25, 2021
Intel Corporation
Darko GRUJICIC
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
Publication number
20200315023
Publication date
Oct 1, 2020
Intel Corporation
Suddhasattwa NAD
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID FINE LINE SPACING ARCHITECTURE FOR BUMP PITCH SCALING
Publication number
20200312665
Publication date
Oct 1, 2020
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLED ORGANIC LAYERS TO ENHANCE ADHESION TO ORGANIC DIELECTRIC...
Publication number
20200312768
Publication date
Oct 1, 2020
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE METAL DEPOSITION BY PATTERNING DIRECT ELECTROLESS METAL P...
Publication number
20200251332
Publication date
Aug 6, 2020
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
Publication number
20200245472
Publication date
Jul 30, 2020
Intel Corporation
Darko GRUJICIC
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MAKING
Publication number
20200211952
Publication date
Jul 2, 2020
Intel Corporation
Rahul N. Manepalli
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PACKAGE ARCHITECTURE WITH IMPROVED VIA DRILL PROCESS AND METHOD FOR...
Publication number
20190393183
Publication date
Dec 26, 2019
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERFACIAL LAYER FOR HIGH RESOLUTION LITHOGRAPHY (HRL) AND HIGH SP...
Publication number
20190320537
Publication date
Oct 17, 2019
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS