Marcel A. Wall

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-to-metal adhesion promotion material
- Patent number 12,159,825
- Issue date Dec 3, 2024
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
- Patent number 11,694,898
- Issue date Jul 4, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal deposition by patterning direct electroless metal p...
- Patent number 11,501,967
- Issue date Nov 15, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial layer for high resolution lithography (HRL) and high sp...
- Patent number 11,445,616
- Issue date Sep 13, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device with monolayer bonding between surface structures
- Patent number 11,177,232
- Issue date Nov 16, 2021
- Intel Corporation
- Suddhasattwa Nad
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package architecture with improved via drill process and method for...
- Patent number 11,177,234
- Issue date Nov 16, 2021
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method of making
- Patent number 10,658,281
- Issue date May 19, 2020
- Intel Corporation
- Rahul N. Manepalli
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...
- Publication number 20250210506
- Publication date Jun 26, 2025
- Intel Corporation
- Kihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION
- Publication number 20250006614
- Publication date Jan 2, 2025
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...
- Publication number 20250006646
- Publication date Jan 2, 2025
- Intel Corporation
- Xing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20250006616
- Publication date Jan 2, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240332100
- Publication date Oct 3, 2024
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20240331921
- Publication date Oct 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...
- Publication number 20240321657
- Publication date Sep 26, 2024
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING
- Publication number 20240213131
- Publication date Jun 27, 2024
- Intel Corporation
- Yi YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
- Publication number 20240213301
- Publication date Jun 27, 2024
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...
- Publication number 20240186264
- Publication date Jun 6, 2024
- Intel Corporation
- Yi Yang
- B32 - LAYERED PRODUCTS
Information Patent Application
SINX BASED SURFACE FINISH ARCHITECTURE
- Publication number 20240006299
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD
- Publication number 20240006291
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240006380
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...
- Publication number 20240006283
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattawa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
- Publication number 20240006297
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
- Publication number 20230420322
- Publication date Dec 28, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS
- Publication number 20230402368
- Publication date Dec 14, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELE...
- Publication number 20230317583
- Publication date Oct 5, 2023
- Intel Corporation
- Rahul N. MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
- Publication number 20230317614
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPR...
- Publication number 20230317584
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA WITH A METAL WALL
- Publication number 20230107096
- Publication date Apr 6, 2023
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
- Publication number 20230095846
- Publication date Mar 30, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS

Marcel A. Wall

Person

Patents Grantslast 30 patents

Capacitors in through glass vias

Dielectric-to-metal adhesion promotion material

Electronic substrates having embedded inductors

Selectively roughened copper architectures for low insertion loss c...

Hybrid fine line spacing architecture for bump pitch scaling

Selective metal deposition by patterning direct electroless metal p...

Interfacial layer for high resolution lithography (HRL) and high sp...

Apparatus with a substrate provided with plasma treatment

Circuit device with monolayer bonding between surface structures

Package architecture with improved via drill process and method for...

Integrated circuit substrate and method of making

Patents Applicationslast 30 patents

PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES

GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

METHOD OF FORMING A PACKAGE SUBSTRATE

POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLAS...

SINX BASED SURFACE FINISH ARCHITECTURE

POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD

METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES

EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER

ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELE...

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...

PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPR...

THROUGH GLASS VIA WITH A METAL WALL

GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...