Marcel BROEKAART

Person

Theys, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 12,143,093
- Issue date Nov 12, 2024
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a substrate
- Patent number 11,837,463
- Issue date Dec 5, 2023
- Soitec
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid structure for a surface acoustic wave device
- Patent number 11,800,803
- Issue date Oct 24, 2023
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 11,742,233
- Issue date Aug 29, 2023
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 11,711,065
- Issue date Jul 25, 2023
- Soitec
- Marcel Broekaart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for manufacturing a semiconductor on insulator type structur...
- Patent number 11,373,898
- Issue date Jun 28, 2022
- Soitec
- Daniel Delprat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support for a semiconductor structure
- Patent number 11,373,856
- Issue date Jun 28, 2022
- Soitec
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for locating devices
- Patent number 11,088,016
- Issue date Aug 10, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate
- Patent number 10,943,778
- Issue date Mar 9, 2021
- Soitec
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 10,924,081
- Issue date Feb 16, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 10,910,250
- Issue date Feb 2, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing distortion of a signal in a radiofrequency ci...
- Patent number 10,819,282
- Issue date Oct 27, 2020
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 10,608,610
- Issue date Mar 31, 2020
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of a semiconductor element comprising a highl...
- Patent number 10,510,531
- Issue date Dec 17, 2019
- Soitec
- Oleg Kononchuk
- C30 - CRYSTAL GROWTH
Information Patent Grant
Process for the manufacture of a semiconductor element comprising a...
- Patent number 10,297,464
- Issue date May 21, 2019
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring layers
- Patent number 9,953,855
- Issue date Apr 24, 2018
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring circuit layer
- Patent number 9,583,531
- Issue date Feb 28, 2017
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding by means of molecular adhesion
- Patent number 9,548,202
- Issue date Jan 17, 2017
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor devices
- Patent number 9,138,980
- Issue date Sep 22, 2015
- Soitec
- Marcel Broekaart
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for bonding together two wafers by molecular a...
- Patent number 9,004,135
- Issue date Apr 14, 2015
- Soitec
- Arnaud Castex
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating a multilayer structure with circuit layer tra...
- Patent number 8,932,938
- Issue date Jan 13, 2015
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding by molecular bonding
- Patent number 8,927,320
- Issue date Jan 6, 2015
- Soitec
- Chrystelle Lagahe Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molecular adhesion bonding at low pressure
- Patent number 8,871,611
- Issue date Oct 28, 2014
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Progressive trimming method
- Patent number 8,679,944
- Issue date Mar 25, 2014
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding method with reduction in overlay misalignment
- Patent number 8,575,002
- Issue date Nov 5, 2013
- Soitec
- Marcel Broekaart
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of thinning a structure
- Patent number 8,357,589
- Issue date Jan 22, 2013
- Soitec
- Marcel Broekaart
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for molecular adhesion bonding at low pressure
- Patent number 8,338,266
- Issue date Dec 25, 2012
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for assembling wafers by means of molecular adhesion
- Patent number 8,232,130
- Issue date Jul 31, 2012
- S.O.I. Tec Silicon on Insulator Technologies
- Marcel Broekaart
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Surface treatment for molecular bonding
- Patent number 8,202,785
- Issue date Jun 19, 2012
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID STRUCTURE FOR A SURFACE ACOUSTIC WAVE DEVICE
- Publication number 20240040930
- Publication date Feb 1, 2024
- SOITEC
- Marcel BROEKAART
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE
- Publication number 20240014027
- Publication date Jan 11, 2024
- SOITEC
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20230378931
- Publication date Nov 23, 2023
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR TRANSFERRING A THIN LAYER ONTO A SUPPORT SUBSTRATE PROVI...
- Publication number 20230230874
- Publication date Jul 20, 2023
- SOITEC
- Bruno Clemenceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FOR A SEMICONDUCTOR STRUCTURE
- Publication number 20220301847
- Publication date Sep 22, 2022
- SOITEC
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20220139768
- Publication date May 5, 2022
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING A RECEIVER SUBSTRATE FOR A SEMICONDUCTOR-ON-I...
- Publication number 20210407849
- Publication date Dec 30, 2021
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20210121103
- Publication date Apr 29, 2021
- SOITEC
- Marcel Broekaart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20210118717
- Publication date Apr 22, 2021
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE
- Publication number 20210066063
- Publication date Mar 4, 2021
- SOITEC
- Pascal Guenard
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR ON INSULATOR TYPE STRUCTUR...
- Publication number 20210050250
- Publication date Feb 18, 2021
- Daniel Delprat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20200228088
- Publication date Jul 16, 2020
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MINIMIZING DISTORTION OF A SIGNAL IN A RADIOFREQUENCY CI...
- Publication number 20200169222
- Publication date May 28, 2020
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR LOCATING DEVICES
- Publication number 20200161172
- Publication date May 21, 2020
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FOR A SEMICONDUCTOR STRUCTURE
- Publication number 20200020520
- Publication date Jan 16, 2020
- SOITEC
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STRUCTURE FOR A SUFACE ACOUSTIC WAVE DEVICE
- Publication number 20190165252
- Publication date May 30, 2019
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE
- Publication number 20190088462
- Publication date Mar 21, 2019
- SOITEC
- Pascal Guenard
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20190007024
- Publication date Jan 3, 2019
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PROCESS FOR THE MANUFACTURE OF A SEMICONDUCTOR ELEMENT COMPRISING A...
- Publication number 20180182640
- Publication date Jun 28, 2018
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATION OF A SEMICONDUCTOR ELEMENT COMPRISING A HIGHL...
- Publication number 20180130698
- Publication date May 10, 2018
- SOITEC
- Oleg Kononchuk
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20160358805
- Publication date Dec 8, 2016
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOCATING DEVICES
- Publication number 20160197006
- Publication date Jul 7, 2016
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A LAYER OF CIRCUITS
- Publication number 20160148971
- Publication date May 26, 2016
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TRANSFERRING LAYERS
- Publication number 20160141198
- Publication date May 19, 2016
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR WAFERS USING A MOLECULAR BONDING A...
- Publication number 20150279830
- Publication date Oct 1, 2015
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION
- Publication number 20150235851
- Publication date Aug 20, 2015
- SOITEC
- Marcel Broekaart
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Publication number 20140065759
- Publication date Mar 6, 2014
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Publication number 20130105932
- Publication date May 2, 2013
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS

Marcel BROEKAART

Person

Patents Grantslast 30 patents

Substrate for a temperature-compensated surface acoustic wave devic...

Method for manufacturing a substrate

Hybrid structure for a surface acoustic wave device

Method of mechanical separation for a double layer transfer

Substrate for a temperature-compensated surface acoustic wave devic...

Method for manufacturing a semiconductor on insulator type structur...

Support for a semiconductor structure

Method for locating devices

Method for manufacturing a substrate

Substrate for a temperature-compensated surface acoustic wave devic...

Method of mechanical separation for a double layer transfer

Method for minimizing distortion of a signal in a radiofrequency ci...

Substrate for a temperature-compensated surface acoustic wave devic...

Method of fabrication of a semiconductor element comprising a highl...

Process for the manufacture of a semiconductor element comprising a...

Process for transferring layers

Method for producing composite structure with metal/metal bonding

Process for transferring circuit layer

Method for bonding by means of molecular adhesion

Apparatus for manufacturing semiconductor devices

Method and apparatus for bonding together two wafers by molecular a...

Method of fabricating a multilayer structure with circuit layer tra...

Method of bonding by molecular bonding

Method for molecular adhesion bonding at low pressure

Progressive trimming method

Direct bonding method with reduction in overlay misalignment

Method of thinning a structure

Method for molecular adhesion bonding at low pressure

Process for assembling wafers by means of molecular adhesion

Surface treatment for molecular bonding

Patents Applicationslast 30 patents

HYBRID STRUCTURE FOR A SURFACE ACOUSTIC WAVE DEVICE

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD FOR MANUFACTURING A SUBSTRATE

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD FOR TRANSFERRING A THIN LAYER ONTO A SUPPORT SUBSTRATE PROVI...

SUPPORT FOR A SEMICONDUCTOR STRUCTURE

METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

PROCESS FOR PRODUCING A RECEIVER SUBSTRATE FOR A SEMICONDUCTOR-ON-I...

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD FOR MANUFACTURING A SUBSTRATE

METHOD FOR MANUFACTURING A SEMICONDUCTOR ON INSULATOR TYPE STRUCTUR...

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD FOR MINIMIZING DISTORTION OF A SIGNAL IN A RADIOFREQUENCY CI...

METHOD FOR LOCATING DEVICES

SUPPORT FOR A SEMICONDUCTOR STRUCTURE

HYBRID STRUCTURE FOR A SUFACE ACOUSTIC WAVE DEVICE

METHOD FOR MANUFACTURING A SUBSTRATE

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

PROCESS FOR THE MANUFACTURE OF A SEMICONDUCTOR ELEMENT COMPRISING A...

METHOD OF FABRICATION OF A SEMICONDUCTOR ELEMENT COMPRISING A HIGHL...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD FOR LOCATING DEVICES

METHOD FOR TRANSFERRING A LAYER OF CIRCUITS

PROCESS FOR TRANSFERRING LAYERS

METHOD FOR BONDING SEMICONDUCTOR WAFERS USING A MOLECULAR BONDING A...

METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE

METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE