Marco GAVAGNIN

Person

Leoben, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Protection layer for panel handling systems
- Patent number 11,682,600
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal body formed on a component carrier by additive manufacturing
- Patent number 11,659,648
- Issue date May 23, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat removal mechanism for stack-based electronic device with proce...
- Patent number 11,450,587
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning component carrier structure with known-good sections and c...
- Patent number 11,430,703
- Issue date Aug 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component carrier with integrated flux gate sensor
- Patent number 11,366,181
- Issue date Jun 21, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Schulz
- G01 - MEASURING TESTING
Information Patent Grant
Component carrier comprising a double layer structure
- Patent number 11,197,367
- Issue date Dec 7, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding known-good component between known-good component carrier...
- Patent number 11,184,983
- Issue date Nov 23, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with two component carrier portions and a compone...
- Patent number 11,058,007
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with integrated inductor and manufacturing method
- Patent number 11,051,406
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding known-good component in known-good cavity of known-good c...
- Patent number 10,790,234
- Issue date Sep 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining a physical quantity with a native component carrier
- Patent number 10,782,259
- Issue date Sep 22, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a component carrier
- Patent number 10,368,448
- Issue date Jul 30, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IC SUBSTRATE HAVING CENTRAL SECTION WITH VERTICALLY STACKED FUNCTIO...
- Publication number 20250070005
- Publication date Feb 27, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Stefano Sergio OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier assembly and method for producing a carrier assembly
- Publication number 20230354529
- Publication date Nov 2, 2023
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20230319989
- Publication date Oct 5, 2023
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection of printed circuit boards with nanowires
- Publication number 20230319976
- Publication date Oct 5, 2023
- Klaus Haimlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Body Formed on a Component Carrier by Additive Manufacturing
- Publication number 20230249252
- Publication date Aug 10, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method of Manufacturing Component Carrier and Component Carrier Int...
- Publication number 20220377911
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20220190464
- Publication date Jun 16, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Photoimageable Dielectric Layer and a Stru...
- Publication number 20220181243
- Publication date Jun 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Removal Mechanism for Stack-based Electronic Device With Proce...
- Publication number 20210280490
- Publication date Sep 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layer for Panel Handling Systems
- Publication number 20210043529
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aligning Component Carrier Structure With Known-Good Sections and C...
- Publication number 20200357706
- Publication date Nov 12, 2020
- Marco Gavagnin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Component Carrier Comprising a Double Layer Structure
- Publication number 20200329555
- Publication date Oct 15, 2020
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Photoimageable Dielectric Layer and a Stru...
- Publication number 20200083154
- Publication date Mar 12, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Component Carrier With Integrated Flux Gate Sensor
- Publication number 20200041582
- Publication date Feb 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Schulz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Integrated Inductor and Manufacturing Method
- Publication number 20190394878
- Publication date Dec 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Known-Good Component Between Known-Good Component Carrier...
- Publication number 20190343008
- Publication date Nov 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Determining a Physical Quantity With a Native Component Carrier
- Publication number 20190154617
- Publication date May 23, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Embedding Known-Good Component in Known-Good Cavity of Known-Good C...
- Publication number 20190148304
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Method of Manufacturing a Component Carrier
- Publication number 20190150295
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Two Component Carrier Portions and a Compone...
- Publication number 20190141836
- Publication date May 9, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Body Formed on a Component Carrier by Additive Manufacturing
- Publication number 20190110357
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20190110366
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having a Three Dimensionally Printed Wiring Struc...
- Publication number 20190110367
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Using a Partially Uncured Component Carrier for Manufacturing Compo...
- Publication number 20180310419
- Publication date Oct 25, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid-State Transition Piece Being Transferable Into an Adhesive St...
- Publication number 20180213647
- Publication date Jul 26, 2018
- Marco GAVAGNIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Marco GAVAGNIN

Person

Patents Grantslast 30 patents

Protection layer for panel handling systems

Metal body formed on a component carrier by additive manufacturing

Heat removal mechanism for stack-based electronic device with proce...

Aligning component carrier structure with known-good sections and c...

Component carrier having a three dimensionally printed wiring struc...

Component carrier with integrated flux gate sensor

Component carrier comprising a double layer structure

Embedding known-good component between known-good component carrier...

Component carrier with two component carrier portions and a compone...

Component carrier with integrated inductor and manufacturing method

Using a partially uncured component carrier body for manufacturing...

Embedding known-good component in known-good cavity of known-good c...

Determining a physical quantity with a native component carrier

Method of manufacturing a component carrier

Patents Applicationslast 30 patents

IC SUBSTRATE HAVING CENTRAL SECTION WITH VERTICALLY STACKED FUNCTIO...

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

Carrier assembly and method for producing a carrier assembly

Component Carrier

Interconnection of printed circuit boards with nanowires

Metal Body Formed on a Component Carrier by Additive Manufacturing

Method of Manufacturing Component Carrier and Component Carrier Int...

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Component Carrier With a Photoimageable Dielectric Layer and a Stru...

Heat Removal Mechanism for Stack-based Electronic Device With Proce...

Protection Layer for Panel Handling Systems

Aligning Component Carrier Structure With Known-Good Sections and C...

Component Carrier Comprising a Double Layer Structure

Component Carrier With a Photoimageable Dielectric Layer and a Stru...

Component Carrier With Integrated Flux Gate Sensor

Component Carrier With Integrated Inductor and Manufacturing Method

Embedding Known-Good Component Between Known-Good Component Carrier...

Determining a Physical Quantity With a Native Component Carrier

Embedding Known-Good Component in Known-Good Cavity of Known-Good C...

A Method of Manufacturing a Component Carrier

Component Carrier With Two Component Carrier Portions and a Compone...

Metal Body Formed on a Component Carrier by Additive Manufacturing

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

Component Carrier Having a Three Dimensionally Printed Wiring Struc...

Using a Partially Uncured Component Carrier for Manufacturing Compo...

Solid-State Transition Piece Being Transferable Into an Adhesive St...