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Vestal, NY, US
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last 30 patents
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Patent Grant
Nanoparticle sensor having a nanofibrous membrane scaffold
Patent number
11,331,019
Issue date
May 17, 2022
The Research Foundation for the State University of New York
Chuan-Jian Zhong
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Embedded thin films
Patent number
10,064,283
Issue date
Aug 28, 2018
The Research Foundation for the State University of New York
Junghyun Cho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Autonomous gamma, X-ray, and particle detector
Patent number
9,835,737
Issue date
Dec 5, 2017
The Research Foundation for the State University of New York
Steve Czarnecki
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Autonomous gamma, X-ray, and particle detector
Patent number
9,606,245
Issue date
Mar 28, 2017
THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
Steve Czarnecki
G01 - MEASURING TESTING
Information
Patent Grant
Embedded thin films
Patent number
8,882,983
Issue date
Nov 11, 2014
The Research Foundation for the State University of New York
Junghyun Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conducting paste for device level interconnects
Patent number
8,685,284
Issue date
Apr 1, 2014
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Anti-tamper microchip package based on thermal nanofluids or fluids
Patent number
8,288,857
Issue date
Oct 16, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayered circuitized substrate with P-aramid dielectric layers...
Patent number
8,211,790
Issue date
Jul 3, 2012
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate with continuous thermoplastic support film di...
Patent number
8,084,863
Issue date
Dec 27, 2011
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
Patent number
7,981,245
Issue date
Jul 19, 2011
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
Patent number
7,777,136
Issue date
Aug 17, 2010
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with internal optical pathwa...
Patent number
7,713,767
Issue date
May 11, 2010
Endicott Interconnect Technologies, Inc.
Benson Chan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered circuitized substrate with p-aramid dielectric layers...
Patent number
7,646,098
Issue date
Jan 12, 2010
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitor material for use in circuitized substrates, circuitized s...
Patent number
7,541,265
Issue date
Jun 2, 2009
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with internal optical pathway
Patent number
7,541,058
Issue date
Jun 2, 2009
Endicott Interconnect Technologies, Inc.
Benson Chan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
7,402,254
Issue date
Jul 22, 2008
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
Patent number
7,301,108
Issue date
Nov 27, 2007
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitor material with metal component for use in circuitized subs...
Patent number
7,025,607
Issue date
Apr 11, 2006
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device having a thermoset-containing dielectric mater...
Patent number
7,014,731
Issue date
Mar 21, 2006
International Business Machines Corporation
Donald S. Farquhar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lamination of liquid crystal polymer dielectric films
Patent number
6,967,705
Issue date
Nov 22, 2005
International Business Machines Corporation
Donald S. Farquhar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Porous power and ground planes for reduced PCB delamination and bet...
Patent number
6,944,946
Issue date
Sep 20, 2005
International Business Machines Corporation
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
Patent number
6,929,900
Issue date
Aug 16, 2005
International Business Machines Corporation
Donald S. Farquhar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
Patent number
6,826,830
Issue date
Dec 7, 2004
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lamination of liquid crystal polymer dielectric films
Patent number
6,819,373
Issue date
Nov 16, 2004
International Business Machines Corporation
Donald S. Farquhar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for making printed circuit board having low coefficient of t...
Patent number
6,722,031
Issue date
Apr 20, 2004
International Business Machines Corporation
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
Patent number
6,686,539
Issue date
Feb 3, 2004
International Business Machines Corporation
Donald S. Farquhar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
6,645,607
Issue date
Nov 11, 2003
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Porous power and ground planes for reduced PCB delamination and bet...
Patent number
6,613,413
Issue date
Sep 2, 2003
International Business Machines Corporation
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin film attachment to laminate using a dendritic interconnection
Patent number
6,600,224
Issue date
Jul 29, 2003
International Business Machines Corporation
Donald S. Farquhar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
Patent number
6,581,280
Issue date
Jun 24, 2003
International Business Machines Corporation
Brian Eugene Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
NANOPARTICLE SENSOR HAVING A NANOFIBROUS MEMBRANE SCAFFOLD
Publication number
20220265173
Publication date
Aug 25, 2022
The Research Foundation for The State University of New York
Chuan-Jian Zhong
B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information
Patent Application
NANOPARTICLE SENSOR HAVING A NANOFIBROUS MEMBRANE SCAFFOLD
Publication number
20190038190
Publication date
Feb 7, 2019
The Research Foundation for The State University of New York
Chuan-Jian Zhong
B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information
Patent Application
EMBEDDED THIN FILMS
Publication number
20170013721
Publication date
Jan 12, 2017
The Research Foundation for The State University of New York
Junghyun Cho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
EMBEDDED THIN FILMS
Publication number
20160135303
Publication date
May 12, 2016
The Research Foundation for The State University of New York
Junghyun Cho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
Publication number
20120257343
Publication date
Oct 11, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD...
Publication number
20120228014
Publication date
Sep 13, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS
Publication number
20120069531
Publication date
Mar 22, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
Publication number
20120068326
Publication date
Mar 22, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
Publication number
20100218891
Publication date
Sep 2, 2010
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED THIN FILMS
Publication number
20090301770
Publication date
Dec 10, 2009
Junghyun Cho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Circuitized substrate with P-aramid dielectric layers and method of...
Publication number
20090258161
Publication date
Oct 15, 2009
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered circuitized substrate with p-aramid dielectric layers...
Publication number
20090173426
Publication date
Jul 9, 2009
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrate with internal optical pathwa...
Publication number
20090093073
Publication date
Apr 9, 2009
Endicott Interconnect Technologies, Inc.
Benson Chan
G02 - OPTICS
Information
Patent Application
Method of making circuitized substrate with internal optical pathway
Publication number
20090092353
Publication date
Apr 9, 2009
Endicott Interconnect Technologies, Inc.
Benson Chan
G02 - OPTICS
Information
Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
Publication number
20080217050
Publication date
Sep 11, 2008
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered circuitized substrate with p-aramid dielectric layers...
Publication number
20080191353
Publication date
Aug 14, 2008
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate with p-aramid dielectric layers and method of...
Publication number
20080191354
Publication date
Aug 14, 2008
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
Publication number
20080178999
Publication date
Jul 31, 2008
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Capacitor material with metal component for use in circuitized subs...
Publication number
20060154501
Publication date
Jul 13, 2006
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Capacitor material for use in circuitized substrates, circuitized s...
Publication number
20060151863
Publication date
Jul 13, 2006
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layered interconnect structure using liquid crystalline polym...
Publication number
20050057908
Publication date
Mar 17, 2005
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Lamination of liquid crystal polymer dielectric films
Publication number
20050019527
Publication date
Jan 27, 2005
Donald S. Farquhar
B32 - LAYERED PRODUCTS
Information
Patent Application
Tamper-responding encapsulated enclosure having flexible protective...
Publication number
20040195001
Publication date
Oct 7, 2004
Donald S. Farquhar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Lamination of liquid crystal polymer dielectric films
Publication number
20040066478
Publication date
Apr 8, 2004
International Business Machines Corporation
Donald S. Farquhar
B32 - LAYERED PRODUCTS
Information
Patent Application
Method and structure for producing Z-axis interconnection assembly...
Publication number
20040052945
Publication date
Mar 18, 2004
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Porous power and ground planes for reduced PCB delamination and bet...
Publication number
20030196749
Publication date
Oct 23, 2003
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layered interconnect structure using liquid crystalline polym...
Publication number
20030147227
Publication date
Aug 7, 2003
International Business Machines Corporation
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of joining laminates for z-axis interconnection
Publication number
20030041966
Publication date
Mar 6, 2003
International Business Machines Corporation
Jon A. Casey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made...
Publication number
20030003305
Publication date
Jan 2, 2003
International Business Machines Corporation
Robert Maynard Japp
B32 - LAYERED PRODUCTS
Information
Patent Application
Method and structure for producing Z-axis interconnection assembly...
Publication number
20020192444
Publication date
Dec 19, 2002
International Business Machines Corporation
Brian E. Curcio
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC