Markus Nopper

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Microstructure device including a metallization structure with self...
- Patent number 8,883,610
- Issue date Nov 11, 2014
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact elements of semiconductor devices formed on the basis of a...
- Patent number 8,389,401
- Issue date Mar 5, 2013
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic deposition profile targeting
- Patent number 8,323,471
- Issue date Dec 4, 2012
- Advanced Micro Devices, Inc.
- Thomas Ortleb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal cap layer of increased electrode potential for copper-based m...
- Patent number 8,314,494
- Issue date Nov 20, 2012
- Advanced Micro Devices, Inc.
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing bubbles from a process liquid
- Patent number 7,947,158
- Issue date May 24, 2011
- GLOBALFOUNDRIES Inc.
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Advanced automatic deposition profile targeting and control by appl...
- Patent number 7,899,570
- Issue date Mar 1, 2011
- Advanced Micro Devices, Inc.
- Thomas Ortleb
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor substrate having a protection layer at the substrate...
- Patent number 7,781,343
- Issue date Aug 24, 2010
- GLOBALFOUNDRIES Inc.
- Tobias Letz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing leakage in dielectric materials including metal regions in...
- Patent number 7,781,329
- Issue date Aug 24, 2010
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing bubbles from a process liquid
- Patent number 7,615,103
- Issue date Nov 10, 2009
- Advanced Micro Devices, Inc.
- Helge Hartz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for metal deposition by electroless plating using an acti...
- Patent number 7,560,381
- Issue date Jul 14, 2009
- Advanced Micro Devices, Inc.
- Markus Nopper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal layer over a patterned dielectric by wet...
- Patent number 7,517,782
- Issue date Apr 14, 2009
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reworking a semiconductor structure
- Patent number 7,476,552
- Issue date Jan 13, 2009
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing wafer contamination by removing under-metal laye...
- Patent number 7,169,664
- Issue date Jan 30, 2007
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of electroplating copper over a patterned dielectric layer t...
- Patent number 6,958,247
- Issue date Oct 25, 2005
- Advanced Micro Devices, Inc.
- Gerd Marxsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal layer over patterned dielectric by electr...
- Patent number 6,951,816
- Issue date Oct 4, 2005
- Advanced Micro Devices, Inc.
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal lines having improved uniformity on a subst...
- Patent number 6,620,726
- Issue date Sep 16, 2003
- Advanced Micro Devices, Inc.
- Axel Preusse
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A...
- Publication number 20110156270
- Publication date Jun 30, 2011
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF...
- Publication number 20100133648
- Publication date Jun 3, 2010
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING BUBBLES FROM A PROCESS LIQUID
- Publication number 20100024724
- Publication date Feb 4, 2010
- Advanced Micro Devices, Inc.
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...
- Publication number 20090325375
- Publication date Dec 31, 2009
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CAP LAYER OF INCREASED ELECTRODE POTENTIAL FOR COPPER-BASED M...
- Publication number 20090243109
- Publication date Oct 1, 2009
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPL...
- Publication number 20090036029
- Publication date Feb 5, 2009
- Thomas Ortleb
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATIC DEPOSITION PROFILE TARGETING
- Publication number 20090000950
- Publication date Jan 1, 2009
- Thomas Ortleb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING A PROTECTION LAYER AT THE SUBSTRATE...
- Publication number 20080132072
- Publication date Jun 5, 2008
- Tobias Letz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A METALLIZATION LAYER STACK WITH A...
- Publication number 20070178690
- Publication date Aug 2, 2007
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...
- Publication number 20070166982
- Publication date Jul 19, 2007
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TECHNIQUE FOR FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING...
- Publication number 20070077761
- Publication date Apr 5, 2007
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for metal deposition by electroless plating using an acti...
- Publication number 20060194431
- Publication date Aug 31, 2006
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of reworking a semiconductor structure
- Publication number 20060194349
- Publication date Aug 31, 2006
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for controlling a substrate position in an electr...
- Publication number 20060193992
- Publication date Aug 31, 2006
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for removing bubbles from a process liquid
- Publication number 20060169579
- Publication date Aug 3, 2006
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System and method for an increased bath lifetime in a single-use pl...
- Publication number 20050241947
- Publication date Nov 3, 2005
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Storage tank for process liquids with a reduced amount of bubbles
- Publication number 20050067288
- Publication date Mar 31, 2005
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of reducing wafer contamination by removing under-metal laye...
- Publication number 20040251518
- Publication date Dec 16, 2004
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of electroplating copper over a patterned dielectric layer t...
- Publication number 20040214423
- Publication date Oct 28, 2004
- Gerd Marxsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of plating a semiconductor structure
- Publication number 20040188260
- Publication date Sep 30, 2004
- Matthias Bonkabeta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming a metal layer over patterned dielectric by electr...
- Publication number 20040145062
- Publication date Jul 29, 2004
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of electroplating copper over a patterned dielectric layer
- Publication number 20030221966
- Publication date Dec 4, 2003
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING METAL LINES HAVING IMPROVED UNIFORMITY ON A SUBST...
- Publication number 20030162385
- Publication date Aug 28, 2003
- Axel Preusse
- B24 - GRINDING POLISHING

Markus Nopper

Person

Patents Grantslast 30 patents

Microstructure device including a metallization structure with self...

Contact elements of semiconductor devices formed on the basis of a...

Automatic deposition profile targeting

Metal cap layer of increased electrode potential for copper-based m...

Apparatus and method for removing bubbles from a process liquid

Advanced automatic deposition profile targeting and control by appl...

Semiconductor substrate having a protection layer at the substrate...

Reducing leakage in dielectric materials including metal regions in...

Apparatus and method for removing bubbles from a process liquid

Technique for metal deposition by electroless plating using an acti...

Method of forming a metal layer over a patterned dielectric by wet...

Method of reworking a semiconductor structure

Method of reducing wafer contamination by removing under-metal laye...

Method of electroplating copper over a patterned dielectric layer t...

Method of forming a metal layer over patterned dielectric by electr...

Method of forming metal lines having improved uniformity on a subst...

Patents Applicationslast 30 patents

CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A...

MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF...

APPARATUS AND METHOD FOR REMOVING BUBBLES FROM A PROCESS LIQUID

REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...

METAL CAP LAYER OF INCREASED ELECTRODE POTENTIAL FOR COPPER-BASED M...

ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPL...

AUTOMATIC DEPOSITION PROFILE TARGETING

SEMICONDUCTOR SUBSTRATE HAVING A PROTECTION LAYER AT THE SUBSTRATE...

SEMICONDUCTOR DEVICE COMPRISING A METALLIZATION LAYER STACK WITH A...

METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...

TECHNIQUE FOR FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING...

Technique for metal deposition by electroless plating using an acti...

Method of reworking a semiconductor structure

Method and system for controlling a substrate position in an electr...

Apparatus and method for removing bubbles from a process liquid

System and method for an increased bath lifetime in a single-use pl...

Storage tank for process liquids with a reduced amount of bubbles

Method of reducing wafer contamination by removing under-metal laye...

Method of electroplating copper over a patterned dielectric layer t...

Method of plating a semiconductor structure

Method of forming a metal layer over patterned dielectric by electr...

Method of electroplating copper over a patterned dielectric layer

METHOD OF FORMING METAL LINES HAVING IMPROVED UNIFORMITY ON A SUBST...