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Martin P. Goetz
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Discovery Bay, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming a multi-frequency surface acoustic wave device
Patent number
7,665,196
Issue date
Feb 23, 2010
David M. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming a multi-frequency surface acoustic wave device
Patent number
7,299,528
Issue date
Nov 27, 2007
David M. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer-scale package for surface acoustic wave circuit and method of...
Patent number
6,744,336
Issue date
Jun 1, 2004
Clarisay, Incorporated
Martin Goetz
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Hermetic package for multiple contact-sensitive electronic devices...
Patent number
6,649,446
Issue date
Nov 18, 2003
Clarisay, Inc.
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-scale package for surface acoustic wave circuit and method of...
Patent number
6,650,205
Issue date
Nov 18, 2003
Clarisay, Inc.
Martin Goetz
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Hermetic package for surface acoustic wave device having exposed de...
Patent number
6,639,150
Issue date
Oct 28, 2003
Clarisay, Inc.
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetic package for surface acoustic wave device and method of man...
Patent number
6,621,379
Issue date
Sep 16, 2003
Clarisay, Incorporated
Martin P. Goetz
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Hermetic package for pyroelectric-sensitive electronic device and m...
Patent number
6,507,097
Issue date
Jan 14, 2003
Clarisay, Inc.
Martin P. Goetz
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Wafer-scale package for surface acoustic wave circuit and method of...
Patent number
6,495,398
Issue date
Dec 17, 2002
Clarisay, Incorporated
Martin Goetz
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Method for mounting an integrated circuit having reduced thermal st...
Patent number
6,436,735
Issue date
Aug 20, 2002
Alpine Microsystems, Inc.
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level burn-in
Patent number
6,337,576
Issue date
Jan 8, 2002
Alpine Microsystems, Inc.
Andrew K. Wiggin
G01 - MEASURING TESTING
Information
Patent Grant
Module and method for interconnecting integrated circuits that faci...
Patent number
6,300,161
Issue date
Oct 9, 2001
Alpine Microsystems, Inc.
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for packaging integrated circuits
Patent number
6,175,161
Issue date
Jan 16, 2001
Alpine Microsystems, Inc.
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for forming a multi-frequency surface acoustic wave device
Publication number
20080222864
Publication date
Sep 18, 2008
David M. Lee
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Method for forming a multi-frequency surface acoustic wave device
Publication number
20040083590
Publication date
May 6, 2004
CLARISAY, INC.
David M. Lee
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Wafer-scale package for surface acoustic wave circuit and method of...
Publication number
20020140525
Publication date
Oct 3, 2002
Martin Goetz
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Module having integral surface acoustic wave circuits and method of...
Publication number
20020090095
Publication date
Jul 11, 2002
James E. Flowers
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Circuit interconnect providing reduced crosstalk and simultaneous s...
Publication number
20010013650
Publication date
Aug 16, 2001
Martin P. Goetz
H01 - BASIC ELECTRIC ELEMENTS