Martin Reiss

Person

Medingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for applying solder to redistribution lines
- Patent number 7,906,421
- Issue date Mar 15, 2011
- Qimonda AG
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor components and method for producing the same
- Patent number 7,384,822
- Issue date Jun 10, 2008
- Infineon Technologies AG
- Juergen Zacherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a chip on a base and arrangement produced by th...
- Patent number 7,368,322
- Issue date May 6, 2008
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for producing a soldering connection
- Patent number 7,271,484
- Issue date Sep 18, 2007
- Infineon Technologies AG
- Martin Reiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate-based housing component with a semiconductor chip
- Patent number 7,256,070
- Issue date Aug 14, 2007
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate based IC-package
- Patent number 7,245,013
- Issue date Jul 17, 2007
- Infineon Technologies AG
- Martin Reiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a protection for chip edges and system for the...
- Patent number 7,229,857
- Issue date Jun 12, 2007
- Infineon Technologies AG
- Juergen Zacherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an electronic component and a panel with a plur...
- Patent number 7,223,639
- Issue date May 29, 2007
- Infineon Technologies AG
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for reducing stress in substrate-based chip packages
- Patent number 7,180,162
- Issue date Feb 20, 2007
- Infineon Technologies AG
- Jens Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for connecting at least one chip to an externa...
- Patent number 7,036,216
- Issue date May 2, 2006
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and panel and method for producing the same
- Patent number 7,034,383
- Issue date Apr 25, 2006
- Infineon Technologies AG
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-based IC package
- Patent number 7,030,473
- Issue date Apr 18, 2006
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a semiconductor chip to a carrier element
- Patent number 7,008,493
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for its production
- Patent number 6,998,296
- Issue date Feb 14, 2006
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-based chip package
- Patent number 6,949,820
- Issue date Sep 27, 2005
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and leadframe and methods for producing the elect...
- Patent number 6,933,595
- Issue date Aug 23, 2005
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a semiconductor chip, and method of produ...
- Patent number 6,906,928
- Issue date Jun 14, 2005
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a semiconductor chip, method of producing...
- Patent number 6,873,060
- Issue date Mar 29, 2005
- Infineon Technologies AG
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying a semiconductor chip to a carrier element wi...
- Patent number 6,664,648
- Issue date Dec 16, 2003
- Infineon Technologies AG
- Johann Winderl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and a sheet strip for packaging bonding wire con...
- Patent number 6,525,416
- Issue date Feb 25, 2003
- Infineon Technologies AG
- Christian Hauser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip carrier having ventilation channels
- Patent number 6,486,538
- Issue date Nov 26, 2002
- Infineon Technologies AG
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with method for manufacturing
- Patent number 6,429,537
- Issue date Aug 6, 2002
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit and Memory Module
- Publication number 20090194890
- Publication date Aug 6, 2009
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Semiconductor Module and Method for Manufacturi...
- Publication number 20090189292
- Publication date Jul 30, 2009
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Applying Solder to Redistribution Lines
- Publication number 20070298602
- Publication date Dec 27, 2007
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion tape and method for mounting a chip onto a substrate
- Publication number 20070221318
- Publication date Sep 27, 2007
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Accelerated B-Stage curing process for thermosetting resins and FBG...
- Publication number 20070221325
- Publication date Sep 27, 2007
- Andre Cardoso
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for manufacturing a flip-chip package, substrate for manufac...
- Publication number 20070224729
- Publication date Sep 27, 2007
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate based IC-package
- Publication number 20070023891
- Publication date Feb 1, 2007
- Martin Reiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for an electronic component assembly and corre...
- Publication number 20060270109
- Publication date Nov 30, 2006
- Stephan Blaszczak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate for producing a soldering connection to a second substrate
- Publication number 20060237855
- Publication date Oct 26, 2006
- Steffen Kroehnert
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package for semiconductor components and method for producing the same
- Publication number 20060138632
- Publication date Jun 29, 2006
- Juergen Zacherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based housing component with a semiconductor chip
- Publication number 20060049503
- Publication date Mar 9, 2006
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based BGA package, in particular FBGA package
- Publication number 20060017149
- Publication date Jan 26, 2006
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for mounting a chip on a base and arrangement produced by th...
- Publication number 20060017156
- Publication date Jan 26, 2006
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based die package with BGA or BGA-like components
- Publication number 20050285247
- Publication date Dec 29, 2005
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for increasing the reliability of substrate-based BGA p...
- Publication number 20050285266
- Publication date Dec 29, 2005
- Martin Reiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Viscous adhesive material for fastening electronic components
- Publication number 20050252598
- Publication date Nov 17, 2005
- Martin Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangement of a chip package constructed on a substrate and substr...
- Publication number 20050121807
- Publication date Jun 9, 2005
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based package for integrated circuits
- Publication number 20050104227
- Publication date May 19, 2005
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an adhesive bond and adhesive bond between a c...
- Publication number 20050098890
- Publication date May 12, 2005
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for producing a soldering connection
- Publication number 20050098611
- Publication date May 12, 2005
- Martin Reiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for improving the reliability of semiconductor modules
- Publication number 20050093175
- Publication date May 5, 2005
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and panel and method for the production thereof
- Publication number 20050087889
- Publication date Apr 28, 2005
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing an electronic component and a panel with a plur...
- Publication number 20050067721
- Publication date Mar 31, 2005
- Infineon Technologies AG
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a protection for chip edges and system for the...
- Publication number 20050064630
- Publication date Mar 24, 2005
- Juergen Zacherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for improving module reliability
- Publication number 20050051896
- Publication date Mar 10, 2005
- Martin Reiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for reducing stress in substrate-based chip packages
- Publication number 20050017354
- Publication date Jan 27, 2005
- Jens Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based chip package
- Publication number 20050006741
- Publication date Jan 13, 2005
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method for its production
- Publication number 20040262780
- Publication date Dec 30, 2004
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based IC package
- Publication number 20040256705
- Publication date Dec 23, 2004
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Supporting structure for a chip and method for producing the same
- Publication number 20040159928
- Publication date Aug 19, 2004
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS

Martin Reiss

Person

Patents Grantslast 30 patents

Method for applying solder to redistribution lines

Package for semiconductor components and method for producing the same

Method for mounting a chip on a base and arrangement produced by th...

Substrate for producing a soldering connection

Substrate-based housing component with a semiconductor chip

Substrate based IC-package

Method for producing a protection for chip edges and system for the...

Method of producing an electronic component and a panel with a plur...

Arrangement for reducing stress in substrate-based chip packages

Method and apparatus for connecting at least one chip to an externa...

Electronic component and panel and method for producing the same

Substrate-based IC package

Method for applying a semiconductor chip to a carrier element

Electronic component and method for its production

Substrate-based chip package

Electronic device and leadframe and methods for producing the elect...

Electronic component with a semiconductor chip, and method of produ...

Electronic component with a semiconductor chip, method of producing...

Apparatus for applying a semiconductor chip to a carrier element wi...

Electronic devices and a sheet strip for packaging bonding wire con...

Chip carrier having ventilation channels

Semiconductor component with method for manufacturing

Patents Applicationslast 30 patents

Integrated Circuit and Memory Module

Integrated Circuit, Semiconductor Module and Method for Manufacturi...

Method for Applying Solder to Redistribution Lines

Adhesion tape and method for mounting a chip onto a substrate

Accelerated B-Stage curing process for thermosetting resins and FBG...

Method for manufacturing a flip-chip package, substrate for manufac...

Substrate based IC-package

Manufacturing method for an electronic component assembly and corre...

Substrate for producing a soldering connection to a second substrate

Package for semiconductor components and method for producing the same

Substrate-based housing component with a semiconductor chip

Substrate-based BGA package, in particular FBGA package

Method for mounting a chip on a base and arrangement produced by th...

Substrate-based die package with BGA or BGA-like components

Arrangement for increasing the reliability of substrate-based BGA p...

Viscous adhesive material for fastening electronic components

Arrangement of a chip package constructed on a substrate and substr...

Substrate-based package for integrated circuits

Method for producing an adhesive bond and adhesive bond between a c...

Substrate for producing a soldering connection

Arrangement for improving the reliability of semiconductor modules

Electronic component and panel and method for the production thereof

Method of producing an electronic component and a panel with a plur...

Method for producing a protection for chip edges and system for the...

Arrangement for improving module reliability

Arrangement for reducing stress in substrate-based chip packages

Substrate-based chip package

Electronic component and method for its production

Substrate-based IC package

Supporting structure for a chip and method for producing the same