Martin SCHREMS

Person

Eggersdorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
System-on-chip camera with integrated light sensor(s) and method of...
- Patent number 11,888,010
- Issue date Jan 30, 2024
- ams AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-on-chip camera with integrated light sensor(s) and method of...
- Patent number 11,411,035
- Issue date Aug 9, 2022
- ams AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor device and method for forming a pressure sensor device
- Patent number 11,313,749
- Issue date Apr 26, 2022
- Sciosense B.V.
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing an optical sensor and optical sensor
- Patent number 11,271,134
- Issue date Mar 8, 2022
- ams AG
- Gregor Toschkoff
- G01 - MEASURING TESTING
Information Patent Grant
RF functionality and electromagnetic radiation shielding in a compo...
- Patent number 11,201,119
- Issue date Dec 14, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding known-good component in known-good cavity of known-good c...
- Patent number 10,790,234
- Issue date Sep 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral single-photon avalanche diode and method of producing a lat...
- Patent number 10,374,114
- Issue date Aug 6, 2019
- AMS AG
- Jordi Teva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an interposer-chip-arrangement for dense packag...
- Patent number 10,340,254
- Issue date Jul 2, 2019
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising an aperture array and method of pro...
- Patent number 10,283,541
- Issue date May 7, 2019
- AMS AG
- Joerg Siegert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method
- Patent number 10,256,147
- Issue date Apr 9, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface integrated focusing element and m...
- Patent number 9,947,711
- Issue date Apr 17, 2018
- AMS AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a removable wafer connection and carrier for wa...
- Patent number 9,929,035
- Issue date Mar 27, 2018
- AMS AG
- Thomas Bodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,870,988
- Issue date Jan 16, 2018
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-chip-arrangement for dense packaging of chips
- Patent number 9,818,724
- Issue date Nov 14, 2017
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,773,729
- Issue date Sep 26, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with protruding contacts
- Patent number 9,768,131
- Issue date Sep 19, 2017
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,735,101
- Issue date Aug 15, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor arrangement and method of producing an optical senso...
- Patent number 9,684,074
- Issue date Jun 20, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated imaging device for infrared radiation and method of prod...
- Patent number 9,577,001
- Issue date Feb 21, 2017
- AMS AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated hot plate and recessed substra...
- Patent number 9,570,390
- Issue date Feb 14, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,553,039
- Issue date Jan 24, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device and method of producing a semiconductor...
- Patent number 9,543,245
- Issue date Jan 10, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device comprising a conductor...
- Patent number 9,443,759
- Issue date Sep 13, 2016
- AMS AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device having an interconnect t...
- Patent number 8,969,193
- Issue date Mar 3, 2015
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a trench isolation and method of manufact...
- Patent number 8,502,308
- Issue date Aug 6, 2013
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component with two trenches
- Patent number 8,383,488
- Issue date Feb 26, 2013
- Austriamicrosystems AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with interlayer connection and method for p...
- Patent number 8,378,496
- Issue date Feb 19, 2013
- Austriamicrosystems AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical hall sensor and method for manufacturing a vertical hall s...
- Patent number 8,368,390
- Issue date Feb 5, 2013
- Austriamicrosystems AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package with Components Mounted at Two Sides of a Layer...
- Publication number 20230092954
- Publication date Mar 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus LEITGEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP CAMERA WITH INTEGRATED LIGHT SENSOR(S) AND METHOD OF...
- Publication number 20220328551
- Publication date Oct 13, 2022
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module With Single or Multiple Components Partially Surr...
- Publication number 20210084747
- Publication date Mar 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
- Publication number 20200313031
- Publication date Oct 1, 2020
- ams AG
- Gregor TOSCHKOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF Functionality and Electromagnetic Radiation Shielding in a Compo...
- Publication number 20190378801
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP CAMERA WITH INTEGRATED LIGHT SENSOR(S) AND METHOD OF...
- Publication number 20190312076
- Publication date Oct 10, 2019
- ams AG
- Martin SCHREMS
- G02 - OPTICS
Information Patent Application
PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE
- Publication number 20190265119
- Publication date Aug 29, 2019
- ams International AG
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Application
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATE...
- Publication number 20190237500
- Publication date Aug 1, 2019
- ams AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Known-Good Component in Known-Good Cavity of Known-Good C...
- Publication number 20190148304
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...
- Publication number 20180096969
- Publication date Apr 5, 2018
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY AND METHOD OF PRO...
- Publication number 20170309665
- Publication date Oct 26, 2017
- ams AG
- Joerg SIEGERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVI...
- Publication number 20170179056
- Publication date Jun 22, 2017
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD
- Publication number 20170062277
- Publication date Mar 2, 2017
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SURFACE INTEGRATED FOCUSING ELEMENT AND M...
- Publication number 20170062504
- Publication date Mar 2, 2017
- ams AG
- Rainer MINIXHOFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20170025351
- Publication date Jan 26, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170018518
- Publication date Jan 19, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS
- Publication number 20160351515
- Publication date Dec 1, 2016
- ams AG
- Jochen Kraft
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL SENSOR ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL SENSO...
- Publication number 20160306042
- Publication date Oct 20, 2016
- ams AG
- Franz SCHRANK
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED IMAGING DEVICE FOR INFRARED RADIATION AND METHOD OF PROD...
- Publication number 20160104741
- Publication date Apr 14, 2016
- ams AG
- Hubert ENICHLMAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL SINGLE-PHOTON AVALANCHE DIODE AND METHOD OF PRODUCING A LAT...
- Publication number 20160035929
- Publication date Feb 4, 2016
- ams AG
- Jordi TEVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A REMOVABLE WAFER CONNECTION AND CARRIER FOR WA...
- Publication number 20150348817
- Publication date Dec 3, 2015
- ams AG
- Thomas BODNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLICATION OF A CARRIER TO A DEVICE WAFER
- Publication number 20150340264
- Publication date Nov 26, 2015
- ams AG
- Joerg SIEGERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HOT PLATE AND RECESSED SUBSTRA...
- Publication number 20150303141
- Publication date Oct 22, 2015
- ams AG
- Franz Schrank
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PRODUCING A SEMICONDUCTOR...
- Publication number 20150287674
- Publication date Oct 8, 2015
- ams AG
- Franz Schrank
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAGING OF CHIPS
- Publication number 20150162308
- Publication date Jun 11, 2015
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20140339698
- Publication date Nov 20, 2014
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE COMPRISING A CONDUCTOR...
- Publication number 20140191413
- Publication date Jul 10, 2014
- ams AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT T...
- Publication number 20140038410
- Publication date Feb 6, 2014
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Hall Sensor and Method for Manufacturing a Vertical Hall S...
- Publication number 20110050210
- Publication date Mar 3, 2011
- AUSTRIAMICROSYSTEMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS

Martin SCHREMS

Person

Patents Grantslast 30 patents

System-on-chip camera with integrated light sensor(s) and method of...

Electronic module with single or multiple components partially surr...

System-on-chip camera with integrated light sensor(s) and method of...

Pressure sensor device and method for forming a pressure sensor device

Method for manufacturing an optical sensor and optical sensor

RF functionality and electromagnetic radiation shielding in a compo...

Embedding known-good component in known-good cavity of known-good c...

Lateral single-photon avalanche diode and method of producing a lat...

Method of producing an interposer-chip-arrangement for dense packag...

Semiconductor device comprising an aperture array and method of pro...

Dicing method

Semiconductor device with a bump contact on a TSV comprising a cavi...

Semiconductor device with surface integrated focusing element and m...

Method of producing a removable wafer connection and carrier for wa...

Method of producing a semiconductor device with through-substrate v...

Interposer-chip-arrangement for dense packaging of chips

Method of producing a semiconductor device with through-substrate v...

Method of producing a semiconductor device with protruding contacts

Semiconductor device with through-substrate via covered by a solder...

Optical sensor arrangement and method of producing an optical senso...

Integrated imaging device for infrared radiation and method of prod...

Semiconductor device with integrated hot plate and recessed substra...

Semiconductor device with through-substrate via covered by a solder...

Semiconductor sensor device and method of producing a semiconductor...

Method for producing a semiconductor device comprising a conductor...

Method of producing a semiconductor device having an interconnect t...

Semiconductor device with a trench isolation and method of manufact...

Method for producing a semiconductor component with two trenches

Semiconductor substrate with interlayer connection and method for p...

Vertical hall sensor and method for manufacturing a vertical hall s...

Patents Applicationslast 30 patents

Electronic Package with Components Mounted at Two Sides of a Layer...

SYSTEM-ON-CHIP CAMERA WITH INTEGRATED LIGHT SENSOR(S) AND METHOD OF...

Electronic Module With Single or Multiple Components Partially Surr...

METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR

RF Functionality and Electromagnetic Radiation Shielding in a Compo...

SYSTEM-ON-CHIP CAMERA WITH INTEGRATED LIGHT SENSOR(S) AND METHOD OF...

PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE

3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATE...

Embedding Known-Good Component in Known-Good Cavity of Known-Good C...

METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY AND METHOD OF PRO...

SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVI...

DICING METHOD

SEMICONDUCTOR DEVICE WITH SURFACE INTEGRATED FOCUSING ELEMENT AND M...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS

OPTICAL SENSOR ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL SENSO...

INTEGRATED IMAGING DEVICE FOR INFRARED RADIATION AND METHOD OF PROD...

LATERAL SINGLE-PHOTON AVALANCHE DIODE AND METHOD OF PRODUCING A LAT...

METHOD OF PRODUCING A REMOVABLE WAFER CONNECTION AND CARRIER FOR WA...

METHOD OF APPLICATION OF A CARRIER TO A DEVICE WAFER

SEMICONDUCTOR DEVICE WITH INTEGRATED HOT PLATE AND RECESSED SUBSTRA...

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PRODUCING A SEMICONDUCTOR...

INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAGING OF CHIPS

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE COMPRISING A CONDUCTOR...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT T...

Vertical Hall Sensor and Method for Manufacturing a Vertical Hall S...