Martin Scott

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San Francisco, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Fabricating a semiconductor device with strained Si.sub.1-x Ge.sub....
- Patent number 5,256,550
- Issue date Oct 26, 1993
- Hewlett-Packard Company
- Stephen Laderman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and non-selective deposition of Si.sub.1-x Ge.sub.x on a...
- Patent number 5,202,284
- Issue date Apr 13, 1993
- Hewlett-Packard Company
- Theodore I. Kamins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an ultra-thin active region for high speed se...
- Patent number 5,177,025
- Issue date Jan 5, 1993
- Hewlett-Packard Company
- John E. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing with silicon cap over Si.sub.1-x Ge.sub.x...
- Patent number 5,084,411
- Issue date Jan 28, 1992
- Hewlett-Packard Company
- Stephen Laderman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE
- Publication number 20250118720
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS