Masaaki Hagihara

Person

Peabody, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduced contaminant gas injection system and method of using
- Patent number 7,743,731
- Issue date Jun 29, 2010
- Tokyo Electron Limited
- Takashi Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for etching a high-k dielectric material
- Patent number 7,709,397
- Issue date May 4, 2010
- Tokyo Electron Limited
- Lee Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pressure removal of photoresist and etch residue
- Patent number 7,700,494
- Issue date Apr 20, 2010
- Tokyo Electron Limited, Inc.
- Vaidyanathan Balasubramaniam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 7,582,220
- Issue date Sep 1, 2009
- Tokyo Electron Limited
- Mitsuru Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bilayer photoresist dry development
- Patent number 7,465,673
- Issue date Dec 16, 2008
- Tokyo Electron Limited
- Yoshiki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-pressure removal of photoresist and etch residue
- Patent number 7,344,993
- Issue date Mar 18, 2008
- Tokyo Electron Limited, Inc.
- Vaidyanathan Balasubramaniam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing method
- Patent number 7,211,197
- Issue date May 1, 2007
- Tokyo Electron Limited
- Masaaki Hagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching and method of plasma treatment
- Patent number 6,780,342
- Issue date Aug 24, 2004
- Tokyo Electron Limited
- Masaaki Hagihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Reduced contaminant gas injection system and method of using
- Publication number 20070235136
- Publication date Oct 11, 2007
- Takashi Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for etching silicon oxide and silicon nitride wit...
- Publication number 20070059938
- Publication date Mar 15, 2007
- Hanako Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-pressure removal of photoresist and etch residue
- Publication number 20060154486
- Publication date Jul 13, 2006
- TOKYO ELECTRON LIMITED
- Vaidyanathan Balasubramaniam
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Low-pressure removal of photoresist and etch residue
- Publication number 20060144817
- Publication date Jul 6, 2006
- TOKYO ELECTRON LIMITED
- Vaidyanathan Balasubramaniam
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method and system for etching a high-k dielectric material
- Publication number 20050164511
- Publication date Jul 28, 2005
- TOKYO ELECTRON LIMITED
- Lee Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method and plasma processing method
- Publication number 20050000939
- Publication date Jan 6, 2005
- TOKYO ELECTRON LIMITED
- Masaaki Hagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for bilayer photoresist dry development
- Publication number 20040185380
- Publication date Sep 23, 2004
- TOKYO ELECTRON LIMITED
- Yoshiki Igarashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Masaaki Hagihara

Person

Patents Grantslast 30 patents

Reduced contaminant gas injection system and method of using

Method and system for etching a high-k dielectric material

Low-pressure removal of photoresist and etch residue

Etching method

Method and apparatus for bilayer photoresist dry development

Low-pressure removal of photoresist and etch residue

Etching method and plasma processing method

Method of etching and method of plasma treatment

Patents Applicationslast 30 patents

Reduced contaminant gas injection system and method of using

Method and system for etching silicon oxide and silicon nitride wit...

Low-pressure removal of photoresist and etch residue

Low-pressure removal of photoresist and etch residue

Method and system for etching a high-k dielectric material

Etching method and plasma processing method

Method and apparatus for bilayer photoresist dry development