Masachika Masuda

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,870,983
- Issue date Jan 16, 2018
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,543,169
- Issue date Jan 10, 2017
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device and associated wiring and support...
- Patent number 9,324,636
- Issue date Apr 26, 2016
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,263,374
- Issue date Feb 16, 2016
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,257,306
- Issue date Feb 9, 2016
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring device for semiconductor device, composite wiring device for...
- Patent number 8,796,832
- Issue date Aug 5, 2014
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,739,401
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,742,554
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plastic package and method of fabricating the same
- Patent number 8,653,647
- Issue date Feb 18, 2014
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wiring assembly, semiconductor composite wiring assem...
- Patent number 8,471,371
- Issue date Jun 25, 2013
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit member, manufacturing method of the circuit member, and sem...
- Patent number 8,420,446
- Issue date Apr 16, 2013
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method for manufacturing metallic shieldin...
- Patent number 8,247,888
- Issue date Aug 21, 2012
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring device for semiconductor device, composite wiring device for...
- Patent number 8,148,804
- Issue date Apr 3, 2012
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device, manufacturing method thereof, ba...
- Patent number 7,851,902
- Issue date Dec 14, 2010
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic package and method of fabricating the same
- Patent number 7,405,468
- Issue date Jul 29, 2008
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,365,441
- Issue date Apr 29, 2008
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrate apparatus, method of manufacturing an IC card modul...
- Patent number 7,271,471
- Issue date Sep 18, 2007
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,064,011
- Issue date Jun 20, 2006
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a lead-on-chip (LOC) semiconductor device
- Patent number 6,335,227
- Issue date Jan 1, 2002
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device having a particular mountin...
- Patent number 5,150,193
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of producing semiconductor device
- Patent number 4,994,411
- Issue date Feb 19, 1991
- Hitachi, Ltd.
- Takahiro Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,989,068
- Issue date Jan 29, 1991
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,987,474
- Issue date Jan 22, 1991
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the same
- Patent number 4,951,120
- Issue date Aug 21, 1990
- Hitachi, Ltd.
- Yashuhisa Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device lead frame with etched through holes
- Patent number 4,862,246
- Issue date Aug 29, 1989
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 4,706,105
- Issue date Nov 10, 1987
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20170077011
- Publication date Mar 16, 2017
- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20160189978
- Publication date Jun 30, 2016
- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20140319663
- Publication date Oct 30, 2014
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...
- Publication number 20140299995
- Publication date Oct 9, 2014
- DAI NIPPON PRINTING CO., LTD.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...
- Publication number 20120175759
- Publication date Jul 12, 2012
- DAI NIPPON PRINTING CO., LTD.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120074544
- Publication date Mar 29, 2012
- DAI NIPPON PRINTING CO., LTD.
- Masachika MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...
- Publication number 20110117704
- Publication date May 19, 2011
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor wiring assembly, semiconductor composite wiring assem...
- Publication number 20110006410
- Publication date Jan 13, 2011
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...
- Publication number 20100325885
- Publication date Dec 30, 2010
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic package and method of fabricating the same
- Publication number 20100276806
- Publication date Nov 4, 2010
- DAI NIPPON PRINTING CO., LTD.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing metallic shieldin...
- Publication number 20100270660
- Publication date Oct 28, 2010
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring device for semiconductor device, composite wiring device for...
- Publication number 20090189263
- Publication date Jul 30, 2009
- DAI NIPPON PRINTING CO., LTD.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...
- Publication number 20090146280
- Publication date Jun 11, 2009
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BA...
- Publication number 20090140411
- Publication date Jun 4, 2009
- Dai Nappon Printing Co., Ltd
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...
- Publication number 20090039486
- Publication date Feb 12, 2009
- Yo Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic package and method of fabricating the same
- Publication number 20080251902
- Publication date Oct 16, 2008
- DAI NIPPON PRINTING CO., LTD.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20060145363
- Publication date Jul 6, 2006
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal substrate apparatus, method of manufacturing an IC card modul...
- Publication number 20050275071
- Publication date Dec 15, 2005
- DAI NIPPON PRINTING CO., LTD.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic package and method of fabricating the same
- Publication number 20050093117
- Publication date May 5, 2005
- Dai Nippon Printing Co., Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device including improved lead frame arrangement
- Publication number 20050094433
- Publication date May 5, 2005
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20040164387
- Publication date Aug 26, 2004
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device including improved lead frame arrangement
- Publication number 20030164542
- Publication date Sep 4, 2003
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device including improved lead frame arrangement
- Publication number 20020102763
- Publication date Aug 1, 2002
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device including improved lead frame arrangement
- Publication number 20010023088
- Publication date Sep 20, 2001
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a semiconductor device
- Publication number 20010016371
- Publication date Aug 23, 2001
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20010001504
- Publication date May 24, 2001
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS

Masachika Masuda

Person

Patents Grantslast 30 patents

Lead frame, method for manufacturing lead frame, semiconductor devi...

Lead frame, method for manufacturing lead frame, semiconductor devi...

Resin-sealed semiconductor device and associated wiring and support...

Semiconductor device and manufacturing method therefor

Lead frame, method for manufacturing lead frame, semiconductor devi...

Wiring device for semiconductor device, composite wiring device for...

Circuit member, manufacturing method for circuit members, semicondu...

Circuit member, manufacturing method for circuit members, semicondu...

Plastic package and method of fabricating the same

Semiconductor wiring assembly, semiconductor composite wiring assem...

Circuit member, manufacturing method of the circuit member, and sem...

Semiconductor device and method for manufacturing metallic shieldin...

Wiring device for semiconductor device, composite wiring device for...

Resin-sealed semiconductor device, manufacturing method thereof, ba...

Plastic package and method of fabricating the same

Semiconductor device fabricating apparatus and semiconductor device...

Metal substrate apparatus, method of manufacturing an IC card modul...

Semiconductor device fabricating apparatus and semiconductor device...

Method of fabricating a lead-on-chip (LOC) semiconductor device

Resin-encapsulated semiconductor device having a particular mountin...

Process of producing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Lead frame and semiconductor device using the same

Semiconductor device lead frame with etched through holes

Semiconductor device and method of producing the same

Patents Applicationslast 30 patents

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...

WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...

Semiconductor wiring assembly, semiconductor composite wiring assem...

CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...

Plastic package and method of fabricating the same

Semiconductor device and method for manufacturing metallic shieldin...

Wiring device for semiconductor device, composite wiring device for...

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...

RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BA...

CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...

Plastic package and method of fabricating the same

Semiconductor device fabricating apparatus and semiconductor device...

Metal substrate apparatus, method of manufacturing an IC card modul...

Plastic package and method of fabricating the same

Stacked semiconductor device including improved lead frame arrangement

Semiconductor device fabricating apparatus and semiconductor device...

Stacked semiconductor device including improved lead frame arrangement

Stacked semiconductor device including improved lead frame arrangement

Stacked semiconductor device including improved lead frame arrangement

Method of fabricating a semiconductor device

Semiconductor device