MASAHARU MINAMIZAWA

Person

KAWASAKI-SHI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,754,534
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat spreader exposed from a seal resin
- Patent number 7,193,320
- Issue date Mar 20, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device incorporating a pass...
- Patent number 6,995,044
- Issue date Feb 7, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a device substrate and semiconductor package incl...
- Patent number 6,905,951
- Issue date Jun 14, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device incorporating a pass...
- Patent number 6,875,638
- Issue date Apr 5, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,273
- Issue date Sep 21, 2004
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package including forming pyramid mount pr...
- Patent number 6,781,224
- Issue date Aug 24, 2004
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor device having an improved reliability
- Patent number 6,566,748
- Issue date May 20, 2003
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 6,347,037
- Issue date Feb 12, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly board with insulator filled through h...
- Patent number 6,184,133
- Issue date Feb 6, 2001
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 6,088,233
- Issue date Jul 11, 2000
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,978,222
- Issue date Nov 2, 1999
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reliable electrodes of projecting shape a...
- Patent number 5,937,277
- Issue date Aug 10, 1999
- Fujitsu Limited
- Tatsuharu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,729,435
- Issue date Mar 17, 1998
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, semiconductor integrated circuit device using the s...
- Patent number 5,666,270
- Issue date Sep 9, 1997
- Fujitsu Limited
- Tatsuharu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reliable electrodes of projecting shape a...
- Patent number 5,637,535
- Issue date Jun 10, 1997
- Fujitsu Limited
- Tatsuharu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projection-electrode fabrication method
- Patent number 5,607,877
- Issue date Mar 4, 1997
- Fujitsu Limited
- Tatsuharu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080261336
- Publication date Oct 23, 2008
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20070114642
- Publication date May 24, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070004091
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Michiaki Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232549
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20040224499
- Publication date Nov 11, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device incorporating a pass...
- Publication number 20040053444
- Publication date Mar 18, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20030222344
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030219969
- Publication date Nov 27, 2003
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20030160325
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device incorporating a pass...
- Publication number 20030082846
- Publication date May 1, 2003
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
- Publication number 20020001178
- Publication date Jan 3, 2002
- MAKOTO IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS

MASAHARU MINAMIZAWA

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device having a heat spreader exposed from a seal resin

Manufacturing method of a semiconductor device incorporating a pass...

Method of forming a device substrate and semiconductor package incl...

Manufacturing method of a semiconductor device incorporating a pass...

Semiconductor device and manufacturing method thereof

Semiconductor device and package including forming pyramid mount pr...

Flip-chip semiconductor device having an improved reliability

Semiconductor device and method of forming the same

Method of forming an assembly board with insulator filled through h...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device with reliable electrodes of projecting shape a...

Semiconductor device and assembly board having through-holes filled...

Bump electrode, semiconductor integrated circuit device using the s...

Semiconductor device with reliable electrodes of projecting shape a...

Projection-electrode fabrication method

Patents Applicationslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device substrate and manufacturing method thereof and...

Manufacturing method of a semiconductor device incorporating a pass...

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor device and manufacturing method thereof

Semiconductor device substrate and manufacturing method thereof and...

Manufacturing method of a semiconductor device incorporating a pass...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.