Masahide Tsukamoto

Person

Nara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing printed wiring boards
- Patent number 7,059,039
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture, circuit board with fixture, and electronic-component mount...
- Patent number 6,888,072
- Issue date May 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,748,652
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,703,565
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board embedded with transmission line conductor
- Patent number 6,683,260
- Issue date Jan 27, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Shimamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,565,954
- Issue date May 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,532,651
- Issue date Mar 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bump-component mounted body and device for...
- Patent number 6,513,236
- Issue date Feb 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relaxation electronic part, stress relaxation wiring board,...
- Patent number 6,465,082
- Issue date Oct 15, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic components
- Patent number 6,281,448
- Issue date Aug 28, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,197,407
- Issue date Mar 6, 2001
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring boards
- Patent number 6,195,882
- Issue date Mar 6, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed circuit board
- Patent number 6,192,581
- Issue date Feb 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern formation method for multi-layered electronic components
- Patent number 6,171,946
- Issue date Jan 9, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonwoven fabric cloth substrate for printed wiring boards, and prep...
- Patent number 6,045,897
- Issue date Apr 4, 2000
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Sakai
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Printed circuit board
- Patent number 5,960,538
- Issue date Oct 5, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonwoven fabric cloth substrate for printed wiring boards, and prep...
- Patent number 5,858,884
- Issue date Jan 12, 1999
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Sakai
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Chip carrier with peripheral stiffener and semiconductor device usi...
- Patent number 5,841,194
- Issue date Nov 24, 1998
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 5,817,404
- Issue date Oct 6, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method and ink compostion
- Patent number 5,635,006
- Issue date Jun 3, 1997
- Matsushita Electric Industrial Co., Ltd.
- Hirotoshi Watanabe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,622,590
- Issue date Apr 22, 1997
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing two-sided and multi-layered printed circuit...
- Patent number 5,588,207
- Issue date Dec 31, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion joining method and a paste used therefor
- Patent number 5,551,626
- Issue date Sep 3, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yo Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 5,550,408
- Issue date Aug 27, 1996
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing organic substrate used for printed circuits
- Patent number 5,481,795
- Issue date Jan 9, 1996
- Matsushita Electric Industrial Co., Ltd.
- Akihito Hatakeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for joining copper or its alloys
- Patent number 5,439,164
- Issue date Aug 8, 1995
- Matsushita Electric Industrial Co., Ltd.
- Yo Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-sided printed circuit board a multi-layered printed circuit board
- Patent number 5,440,075
- Issue date Aug 8, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,436,503
- Issue date Jul 25, 1995
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a sintered conductor circuit board
- Patent number 5,407,511
- Issue date Apr 18, 1995
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Surface mounting module for an electric circuit board
- Patent number 5,406,459
- Issue date Apr 11, 1995
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Display apparatus and its manufacturing method
- Publication number 20050017268
- Publication date Jan 27, 2005
- Masahide Tsukamoto
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Method for producing printed wiring boards
- Publication number 20040148770
- Publication date Aug 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20030180512
- Publication date Sep 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transmission line assembly chip and a manufacturing method thereof...
- Publication number 20020041009
- Publication date Apr 11, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazufumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board embedded with transmission line conductor
- Publication number 20020017963
- Publication date Feb 14, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixture, circuit board with fixture, and electronic-component mount...
- Publication number 20010027876
- Publication date Oct 11, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bump-component mounted body and device for...
- Publication number 20010015010
- Publication date Aug 23, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20010005545
- Publication date Jun 28, 2001
- Daizou Andou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Masahide Tsukamoto

Person

Patents Grantslast 30 patents

Method for producing printed wiring boards

Fixture, circuit board with fixture, and electronic-component mount...

Circuit board and method of manufacturing the same

Printed wiring board

Multilayer wiring board embedded with transmission line conductor

Circuit board and method of manufacturing the same

Circuit board and method of manufacturing the same

Method of manufacturing bump-component mounted body and device for...

Stress relaxation electronic part, stress relaxation wiring board,...

Printed circuit board and electronic components

Circuit board and method of manufacturing the same

Method for producing printed wiring boards

Method of making printed circuit board

Pattern formation method for multi-layered electronic components

Nonwoven fabric cloth substrate for printed wiring boards, and prep...

Printed circuit board

Nonwoven fabric cloth substrate for printed wiring boards, and prep...

Chip carrier with peripheral stiffener and semiconductor device usi...

Printed circuit board

Pattern forming method and ink compostion

Semiconductor device and method of manufacturing the same

Method of manufacturing two-sided and multi-layered printed circuit...

Diffusion joining method and a paste used therefor

Semiconductor device

Method of manufacturing organic substrate used for printed circuits

Methods for joining copper or its alloys

Two-sided printed circuit board a multi-layered printed circuit board

Semiconductor device and method of manufacturing the same

Process for forming a sintered conductor circuit board

Surface mounting module for an electric circuit board

Patents Applicationslast 30 patents

Display apparatus and its manufacturing method

Method for producing printed wiring boards

Circuit board and method of manufacturing the same

Transmission line assembly chip and a manufacturing method thereof...

Multilayer wiring board embedded with transmission line conductor

Fixture, circuit board with fixture, and electronic-component mount...

Method of manufacturing bump-component mounted body and device for...

Circuit board and method of manufacturing the same