Masahiro Miyata

Person

Urayasu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,704,367
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 8,314,491
- Issue date Nov 20, 2012
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless Ni-B plating liquid, electronic device and method for m...
- Patent number 6,936,302
- Issue date Aug 30, 2005
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having semiconductor element with copper pad m...
- Patent number 6,798,050
- Issue date Sep 28, 2004
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,734,568
- Issue date May 11, 2004
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless Ni—B plating liquid, electronic device and meth...
- Patent number 6,706,422
- Issue date Mar 16, 2004
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a semiconductor device having a protruding...
- Patent number 6,605,522
- Issue date Aug 12, 2003
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and fabricating method thereof
- Patent number 6,569,752
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number RE37882
- Issue date Oct 15, 2002
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Semiconductor device having a protruding bump electrode
- Patent number 6,404,051
- Issue date Jun 11, 2002
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,885,891
- Issue date Mar 23, 1999
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling small holes or covering small recesses in the su...
- Patent number 5,705,230
- Issue date Jan 6, 1998
- Ebara Corporation
- Toru Matanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring in groove
- Patent number 5,656,542
- Issue date Aug 12, 1997
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing semiconductor device
- Patent number 5,529,634
- Issue date Jun 25, 1996
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 5,500,559
- Issue date Mar 19, 1996
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 5,480,839
- Issue date Jan 2, 1996
- Kabushiki Kaisha Toshiba
- Hirokazu Ezawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120056320
- Publication date Mar 8, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110024901
- Publication date Feb 3, 2011
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040238955
- Publication date Dec 2, 2004
- KABUSHIKI KAISHA TOSHIBA
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20040182277
- Publication date Sep 23, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030052409
- Publication date Mar 20, 2003
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20020100391
- Publication date Aug 1, 2002
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Masahiro Miyata

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of semiconductor device

Manufacturing method of semiconductor device and semiconductor device

Electroless Ni-B plating liquid, electronic device and method for m...

Semiconductor device having semiconductor element with copper pad m...

Semiconductor device and method of manufacturing the same

Electroless Ni&#x02014;B plating liquid, electronic device and meth...

Method of manufacturing a semiconductor device having a protruding...

Semiconductor element and fabricating method thereof

Semiconductor device manufacturing method

Semiconductor device having a protruding bump electrode

Method of manufacturing semiconductor device

Method for filling small holes or covering small recesses in the su...

Method for manufacturing wiring in groove

Apparatus and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device and method of fabricating the same

Electroless Ni-B plating liquid, electronic device and method for m...

Semiconductor device and method of manufacturing the same

Electroless Ni-B plating liquid, electronic device and method for m...

Electroless Ni—B plating liquid, electronic device and meth...