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Masashi Shimoyama

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  • Kanagawa-ken, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF ADJUSTING PLATING MODULE
    • Publication number 20250051955
    • Publication date Feb 13, 2025
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
    • Publication number 20250034744
    • Publication date Jan 30, 2025
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240314936
    • Publication date Sep 19, 2024
    • EBARA CORPORATION
    • Tsubasa ISHII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240301582
    • Publication date Sep 12, 2024
    • EBARA CORPORATION
    • Yohei WAKUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240295045
    • Publication date Sep 5, 2024
    • EBARA CORPORATION
    • Tsubasa ISHII
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    RESISTOR AND PLATING APPARATUS
    • Publication number 20240279837
    • Publication date Aug 22, 2024
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20240247394
    • Publication date Jul 25, 2024
    • EBARA CORPORATION
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240218553
    • Publication date Jul 4, 2024
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ADJUSTING PLATING MODULE
    • Publication number 20240183059
    • Publication date Jun 6, 2024
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURIN...
    • Publication number 20230383431
    • Publication date Nov 30, 2023
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230366120
    • Publication date Nov 16, 2023
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230340688
    • Publication date Oct 26, 2023
    • EBARA CORPORATION
    • Tsubasa ISHII
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS
    • Publication number 20230295829
    • Publication date Sep 21, 2023
    • EBARA CORPORATION
    • Kazuhito Tsuji
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230279579
    • Publication date Sep 7, 2023
    • EBARA CORPORATION
    • Tsubasa ISHII
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20230193501
    • Publication date Jun 22, 2023
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230167574
    • Publication date Jun 1, 2023
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATE, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURING PLATE
    • Publication number 20220356593
    • Publication date Nov 10, 2022
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20220178046
    • Publication date Jun 9, 2022
    • EBARA CORPORATION
    • Masaki Tomita
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20220170175
    • Publication date Jun 2, 2022
    • EBARA CORPORATION
    • Ryuya Koizumi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS AND PLATING APPARATUS
    • Publication number 20220106701
    • Publication date Apr 7, 2022
    • EBARA CORPORATION
    • Kazuhito Tsuji
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS, AIR BUBBLE REMOVING METHOD, AND STORAGE MEDIUM T...
    • Publication number 20220106698
    • Publication date Apr 7, 2022
    • EBARA CORPORATION
    • Kazuhito Tsuji
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATE, PLATING APPARATUS, AND METHOD OF MANUFACTURING PLATE
    • Publication number 20210355596
    • Publication date Nov 18, 2021
    • EBARA CORPORATION
    • Mitsuhiro Shamoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING DEVICE AND RESISTOR
    • Publication number 20210277533
    • Publication date Sep 9, 2021
    • EBARA CORPORATION
    • MITSUHIRO SHAMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...
    • Publication number 20210262111
    • Publication date Aug 26, 2021
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    PLATING SUPPORT SYSTEM, PLATING SUPPORT DEVICE, AND RECORDING MEDIUM
    • Publication number 20210222315
    • Publication date Jul 22, 2021
    • EBARA CORPORATION
    • MITSUHIRO SHAMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
    • Publication number 20210154629
    • Publication date May 27, 2021
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20210062354
    • Publication date Mar 4, 2021
    • EBARA CORPORATION
    • Jumpei FUJIKATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20210040641
    • Publication date Feb 11, 2021
    • EBARA CORPORATION
    • Mizuki NAGAI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD, PATING APPARATUS, AND METHOD FOR ESTIMATING LIMITIN...
    • Publication number 20200332433
    • Publication date Oct 22, 2020
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20200232115
    • Publication date Jul 23, 2020
    • EBARA CORPORATION
    • Ryuya Koizumi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR