MASASHI TAKENAKA

Person

KAWASAKI-SHI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Imaging apparatus
- Patent number 7,564,111
- Issue date Jul 21, 2009
- Fujitsu Microelectronics Limited
- Koji Sawahata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having a heat spreader exposed from a seal resin
- Patent number 7,193,320
- Issue date Mar 20, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and mold for manufacturing semiconductor device, semiconduct...
- Patent number 6,881,611
- Issue date Apr 19, 2005
- Fujitsu Limited
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 6,347,037
- Issue date Feb 12, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier package
- Patent number 6,342,729
- Issue date Jan 29, 2002
- Fujitsu Limited
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,268,645
- Issue date Jul 31, 2001
- Fujitsu Limited
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly board with insulator filled through h...
- Patent number 6,184,133
- Issue date Feb 6, 2001
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 6,088,233
- Issue date Jul 11, 2000
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,978,222
- Issue date Nov 2, 1999
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the device
- Patent number 5,920,117
- Issue date Jul 6, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing such
- Patent number 5,889,333
- Issue date Mar 30, 1999
- Fujitsu Limited
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test board for testing a semiconductor device, method of testing th...
- Patent number 5,831,441
- Issue date Nov 3, 1998
- Fujitsu Limited
- Toshiyuki Motooka
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device, carrier for carrying semiconductor device, an...
- Patent number 5,750,421
- Issue date May 12, 1998
- Fujitsu Limited
- Junichi Kasai
- G01 - MEASURING TESTING
Information Patent Grant
Process for manufacturing a semiconductor device having a stepped e...
- Patent number 5,736,428
- Issue date Apr 7, 1998
- Fujitsu Limited
- Junichi Kasai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,729,435
- Issue date Mar 17, 1998
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit having ball-grid...
- Patent number 5,726,493
- Issue date Mar 10, 1998
- Fujitsu Limited
- Taturou Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, carrier for carrying semiconductor device, an...
- Patent number 5,666,064
- Issue date Sep 9, 1997
- Fujitsu Limited
- Junichi Kasai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having radiator structure
- Patent number 5,659,200
- Issue date Aug 19, 1997
- Fujitsu, Ltd.
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having upper and lower package bodies and manu...
- Patent number 5,656,864
- Issue date Aug 12, 1997
- Fujitsu Limited
- Hiroyuki Mitsue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and carrier for carrying semiconductor device
- Patent number 5,475,259
- Issue date Dec 12, 1995
- Fujitsu Limited
- Junichi Kasai
- G01 - MEASURING TESTING
Information Patent Grant
Process for encapsulating a semiconductor package having a heat sin...
- Patent number 5,444,025
- Issue date Aug 22, 1995
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Imaging apparatus
- Publication number 20070120050
- Publication date May 31, 2007
- FUJITSU LIMITED
- Koji Sawahata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20070114642
- Publication date May 24, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20030222344
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and mold for manufacturing semiconductor device, semiconduct...
- Publication number 20020030258
- Publication date Mar 14, 2002
- FUJITSU LIMITED
- Norio Fukasawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
- Publication number 20020001178
- Publication date Jan 3, 2002
- MAKOTO IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...
- Publication number 20010003049
- Publication date Jun 7, 2001
- NORIO FUKASAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

MASASHI TAKENAKA

Person

Patents Grantslast 30 patents

Imaging apparatus

Semiconductor device having a heat spreader exposed from a seal resin

Method and mold for manufacturing semiconductor device, semiconduct...

Semiconductor device and method of forming the same

Tape carrier package

Semiconductor device

Method of forming an assembly board with insulator filled through h...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and method of forming the device

Semiconductor device and method for manufacturing such

Test board for testing a semiconductor device, method of testing th...

Semiconductor device, carrier for carrying semiconductor device, an...

Process for manufacturing a semiconductor device having a stepped e...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and semiconductor device unit having ball-grid...

Semiconductor device, carrier for carrying semiconductor device, an...

Semiconductor device having radiator structure

Semiconductor device having upper and lower package bodies and manu...

Semiconductor device and carrier for carrying semiconductor device

Process for encapsulating a semiconductor package having a heat sin...

Patents Applicationslast 30 patents

Imaging apparatus

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor device having a heat spreader exposed from a seal resin

Method and mold for manufacturing semiconductor device, semiconduct...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.

METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCT...