Masayuki Kitajima

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power-demand-value calculating system, power-demand-value calculati...
- Patent number 10,989,743
- Issue date Apr 27, 2021
- Fujitsu Limited
- Masayuki Kitajima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of mounting semiconductor element, and semiconductor device
- Patent number 9,615,464
- Issue date Apr 4, 2017
- Fujitsu Limited
- Takashi Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical unit in which optical element is mounted on base having opt...
- Patent number 9,195,003
- Issue date Nov 24, 2015
- Fujitsu Limited
- Takatoyo Yamakami
- G02 - OPTICS
Information Patent Grant
Method of determining reinforcement position of circuit substrate a...
- Patent number 9,053,262
- Issue date Jun 9, 2015
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board reinforcing structure, board assembly, and electronic device
- Patent number 8,604,347
- Issue date Dec 10, 2013
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with kneaded conductive paste
- Patent number 8,314,339
- Issue date Nov 20, 2012
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave device and method of fabricating the same
- Patent number 7,911,116
- Issue date Mar 22, 2011
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an acoustic wave device
- Patent number 7,841,064
- Issue date Nov 30, 2010
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of making zinc-aluminum alloy connection
- Patent number 7,565,739
- Issue date Jul 28, 2009
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zinc-aluminum solder alloy
- Patent number 7,425,765
- Issue date Sep 16, 2008
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a micro-actuator
- Patent number 7,356,894
- Issue date Apr 15, 2008
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,893,512
- Issue date May 17, 2005
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a micro-actuator
- Patent number 6,848,154
- Issue date Feb 1, 2005
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,786,385
- Issue date Sep 7, 2004
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,744,183
- Issue date Jun 1, 2004
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Micro-actuator and method of producing the same
- Patent number 6,653,761
- Issue date Nov 25, 2003
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder paste and electronic device
- Patent number 6,596,094
- Issue date Jul 22, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,541,898
- Issue date Apr 1, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Lead-free solder alloy and a manufacturing process of electric and...
- Patent number 6,521,176
- Issue date Feb 18, 2003
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,495,441
- Issue date Dec 17, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling micro-actuator
- Patent number 6,467,141
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toru Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,432,806
- Issue date Aug 13, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldered joint
- Patent number 6,428,911
- Issue date Aug 6, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and soldered bond
- Patent number 6,361,626
- Issue date Mar 26, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,344,690
- Issue date Feb 5, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with gold bumps, and method and apparatus of p...
- Patent number 6,333,554
- Issue date Dec 25, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of fabricating perforated plate
- Patent number 6,320,158
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder composition with Bi, In and Sn
- Patent number 6,184,475
- Issue date Feb 6, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,107,181
- Issue date Aug 22, 2000
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER-DEMAND-VALUE CALCULATING SYSTEM, POWER-DEMAND-VALUE CALCULATI...
- Publication number 20180321288
- Publication date Nov 8, 2018
- Fujitsu Limited
- Masayuki Kitajima
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ORDERING PROGRAM, ORDERING DEVICE, AND ORDERING METHOD
- Publication number 20170032448
- Publication date Feb 2, 2017
- Fujitsu Limited
- Masayuki Kitajima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
- Publication number 20140285989
- Publication date Sep 25, 2014
- Fujitsu Limited
- Takashi KUBOTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140086525
- Publication date Mar 27, 2014
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- G02 - OPTICS
Information Patent Application
SUBSTRATE MODULE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD FO...
- Publication number 20140036198
- Publication date Feb 6, 2014
- Masayuki KITAJIMA
- G02 - OPTICS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD
- Publication number 20130233494
- Publication date Sep 12, 2013
- Fujitsu Limited
- Yutaka NODA
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...
- Publication number 20130140069
- Publication date Jun 6, 2013
- Fujitsu Limited
- Masayuki KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...
- Publication number 20130128477
- Publication date May 23, 2013
- Hiroshi KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...
- Publication number 20130087605
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takashi KUBOTA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE
- Publication number 20120248616
- Publication date Oct 4, 2012
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY BONDING DEVICE AND METHOD
- Publication number 20120024475
- Publication date Feb 2, 2012
- Fujitsu Limited
- Masayuki KITAJIMA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...
- Publication number 20110303450
- Publication date Dec 15, 2011
- Fujitsu Limited
- Toru OKADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD
- Publication number 20110303449
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20110303441
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...
- Publication number 20110303443
- Publication date Dec 15, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE
- Publication number 20110304059
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM
- Publication number 20110165319
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FORMING SOLDER DAM
- Publication number 20110165338
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER DAM
- Publication number 20110163152
- Publication date Jul 7, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100006325
- Publication date Jan 14, 2010
- FUJITSU LIMITED
- Masayuki KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20090236934
- Publication date Sep 24, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi AIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090175470
- Publication date Jul 9, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Circuit board, method of forming wiring pattern, and method of manu...
- Publication number 20090044972
- Publication date Feb 19, 2009
- FUJITSU LIMITED OF Kawasaki, Japan
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Acoustic wave device and method of manufacturing the same
- Publication number 20080125662
- Publication date May 29, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electrically conductive paste and method of making the same
- Publication number 20080102294
- Publication date May 1, 2008
- Fujitsu Limited
- Masayuki Kitajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Product including conductor made of zinc or zinc aluminum alloy
- Publication number 20070170593
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Zinc-aluminum solder alloy
- Publication number 20060125105
- Publication date Jun 15, 2006
- FUJITSU LIMITED
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masayuki Kitajima

Person

Patents Grantslast 30 patents

Power-demand-value calculating system, power-demand-value calculati...

Method of mounting semiconductor element, and semiconductor device

Optical unit in which optical element is mounted on base having opt...

Method of determining reinforcement position of circuit substrate a...

Board reinforcing structure, board assembly, and electronic device

Electroconductive bonding material, method for bonding conductor, a...

Circuit board with kneaded conductive paste

Surface acoustic wave device and method of fabricating the same

Method of manufacturing an acoustic wave device

Method of making zinc-aluminum alloy connection

Zinc-aluminum solder alloy

Method of producing a micro-actuator

Solder alloy and soldered bond

Method of producing a micro-actuator

Semiconductor device with gold bumps, and method and apparatus of p...

Method of bonding piezoelectric element and electrode, and piezoele...

Micro-actuator and method of producing the same

Solder paste and electronic device

Method of bonding piezoelectric element and electrode, and piezoele...

Lead-free solder alloy and a manufacturing process of electric and...

Semiconductor device with gold bumps, and method and apparatus of p...

Method of assembling micro-actuator

Method of forming bumps and template used for forming bumps

Soldering method and soldered joint

Solder alloy and soldered bond

Semiconductor device with gold bumps, and method and apparatus of p...

Semiconductor device with gold bumps, and method and apparatus of p...

Method and apparatus of fabricating perforated plate

Lead-free solder composition with Bi, In and Sn

Method of forming bumps and template used for forming bumps

Patents Applicationslast 30 patents

POWER-DEMAND-VALUE CALCULATING SYSTEM, POWER-DEMAND-VALUE CALCULATI...

ORDERING PROGRAM, ORDERING DEVICE, AND ORDERING METHOD

METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE MODULE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD FO...

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...

METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

DISPLAY BONDING DEVICE AND METHOD

MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...

PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD

BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE

MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...

CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE

APPARATUS FOR FORMING SOLDER DAM AND METHOD OF FORMING SOLDER DAM

APPARATUS FOR FORMING SOLDER DAM

METHOD OF FORMING SOLDER DAM

PRINTED WIRING BOARD

SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit board, method of forming wiring pattern, and method of manu...

Acoustic wave device and method of manufacturing the same

Electrically conductive paste and method of making the same

Product including conductor made of zinc or zinc aluminum alloy

Zinc-aluminum solder alloy