Matthew Kaufmann

Person

Morgan Hill, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost and high performance flip chip package
- Patent number 8,957,516
- Issue date Feb 17, 2015
- Broadcom Corporation
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package security tamper mesh
- Patent number 8,890,298
- Issue date Nov 18, 2014
- Broadcom Corporation
- Mark Buer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for reducing voltage drops in integrated circuits
- Patent number 8,749,011
- Issue date Jun 10, 2014
- Broadcom Corporation
- Matthew Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package technology for fan-out wafer-level packaging
- Patent number 8,643,164
- Issue date Feb 4, 2014
- Broadcom Corporation
- Matthew Vernon Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced bump pitch scaling
- Patent number 8,508,054
- Issue date Aug 13, 2013
- Broadcom Corporation
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package security tamper mesh
- Patent number 8,502,396
- Issue date Aug 6, 2013
- Broadcom Corporation
- Mark Buer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low cost lead frame package and method for forming same
- Patent number 8,269,321
- Issue date Sep 18, 2012
- Broadcom Corporation
- Ken Jian Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Larger than die size wafer-level redistribution packaging process
- Patent number 7,872,347
- Issue date Jan 18, 2011
- Broadcom Corporation
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly reliable low cost structure for wafer-level ball grid array...
- Patent number 7,834,449
- Issue date Nov 16, 2010
- Broadcom Corporation
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level flipchip package with IC circuit isolation
- Patent number 7,449,365
- Issue date Nov 11, 2008
- Broadcom Corporation
- Arya Reza Behzad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED PACKAGE SECURITY TAMPER MESH
- Publication number 20150137340
- Publication date May 21, 2015
- BROADCOM CORPORATION
- Mark BUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST AND HIGH PERFORMANCE FLIP CHIP PACKAGE
- Publication number 20140217573
- Publication date Aug 7, 2014
- BROADCOM CORPORATION
- Mengzhi PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package Security Tamper Mesh
- Publication number 20140035136
- Publication date Feb 6, 2014
- Mark BUER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low Cost and High Performance Flip Chip Package
- Publication number 20130187284
- Publication date Jul 25, 2013
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Bump Pitch Scaling
- Publication number 20120319269
- Publication date Dec 20, 2012
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Security Fence
- Publication number 20120256305
- Publication date Oct 11, 2012
- BROADCOM CORPORATION
- Matthew Kaufmann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE-ON-PACKAGE TECHNOLOGY FOR FAN-OUT WAFER-LEVEL PACKAGING
- Publication number 20100314739
- Publication date Dec 16, 2010
- BROADCOM CORPORATION
- Matthew Vernon Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS
- Publication number 20090230554
- Publication date Sep 17, 2009
- BROADCOM CORPORATION
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package Security Tamper Mesh
- Publication number 20090146270
- Publication date Jun 11, 2009
- BROADCOM CORPORATION
- Mark BUER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low cost lead frame package and method for forming same
- Publication number 20090057858
- Publication date Mar 5, 2009
- BROADCOM CORPORATION
- Ken Jian Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGER THAN DIE SIZE WAFER-LEVEL REDISTRIBUTION PACKAGING PROCESS
- Publication number 20090039508
- Publication date Feb 12, 2009
- BROADCOM CORPORATION
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES
- Publication number 20080315436
- Publication date Dec 25, 2008
- BROADCOM CORPORATION
- Stephen Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array...
- Publication number 20080265408
- Publication date Oct 30, 2008
- BROADCOM CORPORATION
- Matthew V. Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level flipchip package with IC circuit isolation
- Publication number 20070139068
- Publication date Jun 21, 2007
- Broadcom Corporation, a California Corporation
- Arya Reza Behzad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process with self-aligned A1-cap and the elimination of 2nd...
- Publication number 20070102815
- Publication date May 10, 2007
- Matthew Vernon Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for reducing voltage drops in integrated circuits
- Publication number 20060192297
- Publication date Aug 31, 2006
- Matthew Kaufmann
- H01 - BASIC ELECTRIC ELEMENTS

Matthew Kaufmann

Person

Patents Grantslast 30 patents

Low cost and high performance flip chip package

Embedded package security tamper mesh

System and method for reducing voltage drops in integrated circuits

Package-on-package technology for fan-out wafer-level packaging

Enhanced bump pitch scaling

Embedded package security tamper mesh

Low cost lead frame package and method for forming same

Larger than die size wafer-level redistribution packaging process

Highly reliable low cost structure for wafer-level ball grid array...

Wafer-level flipchip package with IC circuit isolation

Patents Applicationslast 30 patents

EMBEDDED PACKAGE SECURITY TAMPER MESH

LOW COST AND HIGH PERFORMANCE FLIP CHIP PACKAGE

Embedded Package Security Tamper Mesh

Low Cost and High Performance Flip Chip Package

Enhanced Bump Pitch Scaling

Integrated Circuit Package Security Fence

PACKAGE-ON-PACKAGE TECHNOLOGY FOR FAN-OUT WAFER-LEVEL PACKAGING

WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS

Embedded Package Security Tamper Mesh

Low cost lead frame package and method for forming same

LARGER THAN DIE SIZE WAFER-LEVEL REDISTRIBUTION PACKAGING PROCESS

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array...

Wafer-level flipchip package with IC circuit isolation

Bumping process with self-aligned A1-cap and the elimination of 2nd...

System and method for reducing voltage drops in integrated circuits