Matthew R. Walsh

Person

Sharpsville, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave communication package
- Patent number 7,855,685
- Issue date Dec 21, 2010
- Delphi Technologies, Inc.
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount connector
- Patent number 7,422,448
- Issue date Sep 9, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for manufacturing an overmolded electronic assembly
- Patent number 7,268,429
- Issue date Sep 11, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic module with form in-place pedestal
- Patent number 7,202,571
- Issue date Apr 10, 2007
- Delphi Technologies, Inc.
- Brian D. Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced electronic module with self-aligning heat sink
- Patent number 6,999,317
- Issue date Feb 14, 2006
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill process and material therefor
- Patent number 6,943,058
- Issue date Sep 13, 2005
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer-applied underfill process
- Patent number 6,916,684
- Issue date Jul 12, 2005
- Delphi Technologies, Inc.
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutli-chip module
- Patent number 6,833,628
- Issue date Dec 21, 2004
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive material with metallurgically-bonded conductive...
- Patent number 6,802,446
- Issue date Oct 12, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
No-flow underfill material and underfill method for flip chip devices
- Patent number 6,660,560
- Issue date Dec 9, 2003
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROWAVE CIRCUIT ASSEMBLY
- Publication number 20100200968
- Publication date Aug 12, 2010
- Delphi Technologies, Inc.
- GEORGE J. PURDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave communication package
- Publication number 20090085808
- Publication date Apr 2, 2009
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating and tuning Electromagnetic Bandgap structure an...
- Publication number 20070224737
- Publication date Sep 27, 2007
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount connector
- Publication number 20070026700
- Publication date Feb 1, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for manufacturing an overmolded electronic assembly
- Publication number 20060292751
- Publication date Dec 28, 2006
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM
- Publication number 20060273467
- Publication date Dec 7, 2006
- DELPHI TECHNOLOGIES, INC
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with integral thermal transient suppression
- Publication number 20060209516
- Publication date Sep 21, 2006
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with form in-place pedestal
- Publication number 20060033195
- Publication date Feb 16, 2006
- Brian D. Thompson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-chip module
- Publication number 20050093144
- Publication date May 5, 2005
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sinkable package
- Publication number 20050093181
- Publication date May 5, 2005
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced electronic module with self-aligning heat sink
- Publication number 20050036292
- Publication date Feb 17, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill process and material therefor
- Publication number 20040185602
- Publication date Sep 23, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer-applied underfill process
- Publication number 20040185601
- Publication date Sep 23, 2004
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE AND METHOD OF FORMING
- Publication number 20040113281
- Publication date Jun 17, 2004
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive adhesive material with metallurgically-bonded conductive...
- Publication number 20030146266
- Publication date Aug 7, 2003
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
No-flow underfill material and underfill method for flip chip devices
- Publication number 20030049411
- Publication date Mar 13, 2003
- DELPHI TECHNOLOGIES,INC
- Arun K. Chaudhuri
- B32 - LAYERED PRODUCTS

Matthew R. Walsh

Person

Patents Grantslast 30 patents

Microwave communication package

Surface mount connector

Technique for manufacturing an overmolded electronic assembly

Electronic module with form in-place pedestal

Thermally enhanced electronic module with self-aligning heat sink

No-flow underfill process and material therefor

Wafer-applied underfill process

Mutli-chip module

Conductive adhesive material with metallurgically-bonded conductive...

No-flow underfill material and underfill method for flip chip devices

Patents Applicationslast 30 patents

MICROWAVE CIRCUIT ASSEMBLY

Microwave communication package

Method for creating and tuning Electromagnetic Bandgap structure an...

Surface mount connector

Technique for manufacturing an overmolded electronic assembly

FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM

Electronic assembly with integral thermal transient suppression

Electronic module with form in-place pedestal

Multi-chip module

Heat sinkable package

Thermally enhanced electronic module with self-aligning heat sink

No-flow underfill process and material therefor

Wafer-applied underfill process

MULTI-CHIP MODULE AND METHOD OF FORMING

Conductive adhesive material with metallurgically-bonded conductive...

No-flow underfill material and underfill method for flip chip devices