Matthias Schaller

Person

Boxdrof, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for particles analysis in microstructure devices...
- Patent number 8,925,396
- Issue date Jan 6, 2015
- GLOBALFOUNDRIES Inc.
- Petra Hetzer
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for advanced process control in an etch system by...
- Patent number 8,888,947
- Issue date Nov 18, 2014
- Advanced Micro Devices, Inc.
- Matthias Schaller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device comprising self-aligned contact elements
- Patent number 8,835,245
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES Inc.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual contact metallization including electroless plating in a semic...
- Patent number 8,658,494
- Issue date Feb 25, 2014
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repair of damaged surface areas of sensitive low-K dielectrics of m...
- Patent number 8,575,041
- Issue date Nov 5, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Re-establishing surface characteristics of sensitive low-k dielectr...
- Patent number 8,440,579
- Issue date May 14, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for extracting samples after patterning of micros...
- Patent number 8,435,885
- Issue date May 7, 2013
- GLOBALFOUNDRIES, INC.
- Dmytro Chumakov
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for quantitative inline material characterization...
- Patent number 8,423,320
- Issue date Apr 16, 2013
- Advanced Micro Devices, Inc.
- Matthias Schaller
- G01 - MEASURING TESTING
Information Patent Grant
Establishing a hydrophobic surface of sensitive low-k dielectrics o...
- Patent number 8,399,358
- Issue date Mar 19, 2013
- GLOBALFOUNDRIES, INC.
- Daniel Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing erosion of a metal cap layer during via patterni...
- Patent number 8,338,293
- Issue date Dec 25, 2012
- Advanced Micro Devies, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivating exposed copper surfaces in a metallization l...
- Patent number 8,110,498
- Issue date Feb 7, 2012
- Advanced Micro Devices, Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for enhancing the fill capabilities in an electrochemical...
- Patent number 8,101,524
- Issue date Jan 24, 2012
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield plasma etch process for interlayer dielectrics
- Patent number 8,062,982
- Issue date Nov 22, 2011
- Advanced Micro Devices, Inc.
- Daniel Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing erosion of a metal cap layer during via patterni...
- Patent number 7,986,040
- Issue date Jul 26, 2011
- Advanced Micro Devices, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for patterning differently stressed layers formed above t...
- Patent number 7,883,629
- Issue date Feb 8, 2011
- GLOBALFOUNDRIES Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for enhancing process flexibility during the formation of...
- Patent number 7,763,547
- Issue date Jul 27, 2010
- GLOBALFOUNDRIES Inc.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming a dielectric etch stop layer above a structur...
- Patent number 7,763,532
- Issue date Jul 27, 2010
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for advanced process control in an etch system by...
- Patent number 7,704,889
- Issue date Apr 27, 2010
- Advanced Micro Devices, Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing etch-induced process uniformities by omitting d...
- Patent number 7,700,377
- Issue date Apr 20, 2010
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a contact structure with increased...
- Patent number 7,678,690
- Issue date Mar 16, 2010
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for increasing adhesion of metallization layers by provid...
- Patent number 7,611,991
- Issue date Nov 3, 2009
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain by forming a con...
- Patent number 7,608,501
- Issue date Oct 27, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization layer of a semiconductor device having differently th...
- Patent number 7,592,258
- Issue date Sep 22, 2009
- Advanced Micro Devices, Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing resist poisoning during patterning of silicon n...
- Patent number 7,550,396
- Issue date Jun 23, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical stress in different cha...
- Patent number 7,517,816
- Issue date Apr 14, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain by a contact etc...
- Patent number 7,482,219
- Issue date Jan 27, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of increasing the etch selectivity in a contact structure of...
- Patent number 7,416,973
- Issue date Aug 26, 2008
- Advanced Micro Devices, Inc.
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain in different cha...
- Patent number 7,396,718
- Issue date Jul 8, 2008
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for controlling mechanical stress in a channel region by...
- Patent number 7,314,793
- Issue date Jan 1, 2008
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for reducing etch damage during the formation of vias and...
- Patent number 7,309,654
- Issue date Dec 18, 2007
- Advanced Micro Devices, Inc.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Repair of Damaged Surface Areas of Sensitive Low-K Dielectrics of M...
- Publication number 20130072018
- Publication date Mar 21, 2013
- GLOBALFOUNDRIES INC.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING SELF-ALIGNED CONTACT ELEMENTS
- Publication number 20120211837
- Publication date Aug 23, 2012
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Extracting Samples After Patterning of Micros...
- Publication number 20120052601
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Dmytro Chumakov
- G01 - MEASURING TESTING
Information Patent Application
Re-Establishing Surface Characteristics of Sensitive Low-K Dielectr...
- Publication number 20120049383
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...
- Publication number 20120003832
- Publication date Jan 5, 2012
- Advanced Micro Devices, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CONTACT METALLIZATION INCLUDING ELECTROLESS PLATING IN A SEMIC...
- Publication number 20110049713
- Publication date Mar 3, 2011
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRICS O...
- Publication number 20100304566
- Publication date Dec 2, 2010
- Daniel Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RE-ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRIC...
- Publication number 20100301494
- Publication date Dec 2, 2010
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MATERIAL CHARACTERIZATION IN SEMICONDUCTOR PR...
- Publication number 20100243903
- Publication date Sep 30, 2010
- Torsten Fahr
- G01 - MEASURING TESTING
Information Patent Application
MATERIAL STRIPPING IN SEMICONDUCTOR DEVICES BY EVAPORATION
- Publication number 20100248498
- Publication date Sep 30, 2010
- Petra Hetzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PARTICLES ANALYSIS IN MICROSTRUCTURE DEVICES...
- Publication number 20100242631
- Publication date Sep 30, 2010
- Petra Hetzer
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR ADVANCED PROCESS CONTROL IN AN ETCH SYSTEM BY...
- Publication number 20100161103
- Publication date Jun 24, 2010
- Advanced Micro Devices, Inc.
- Matthias SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PASSIVATING EXPOSED COPPER SURFACES IN A METALLIZATION L...
- Publication number 20100081277
- Publication date Apr 1, 2010
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR QUANTITATIVE INLINE MATERIAL CHARACTERIZATION...
- Publication number 20090319196
- Publication date Dec 24, 2009
- Matthias Schaller
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...
- Publication number 20090273086
- Publication date Nov 5, 2009
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD PLASMA ETCH PROCESS FOR INTERLAYER DIELECTRICS
- Publication number 20080202685
- Publication date Aug 28, 2008
- Daniel Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR PATTERNING DIFFERENTLY STRESSED LAYERS FORMED ABOVE T...
- Publication number 20080206905
- Publication date Aug 28, 2008
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING ETCH-INDUCED PROCESS UNIFORMITIES BY OMITTING D...
- Publication number 20080182346
- Publication date Jul 31, 2008
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING RESIST POISONING DURING PATTERNING OF SILICON N...
- Publication number 20080081480
- Publication date Apr 3, 2008
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER OF A SEMICONDUCTOR DEVICE HAVING DIFFERENTLY TH...
- Publication number 20070278693
- Publication date Dec 6, 2007
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ADVANCED PROCESS CONTROL IN AN ETCH SYSTEM BY...
- Publication number 20070178699
- Publication date Aug 2, 2007
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INCREASING THE ETCH SELECTIVITY IN A CONTACT STRUCTURE OF...
- Publication number 20070178685
- Publication date Aug 2, 2007
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE WITH INCREASED...
- Publication number 20070152343
- Publication date Jul 5, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LA...
- Publication number 20070120264
- Publication date May 31, 2007
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR INCREASING ADHESION OF METALLIZATION LAYERS BY PROVID...
- Publication number 20070123009
- Publication date May 31, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY FORMING A CON...
- Publication number 20070077708
- Publication date Apr 5, 2007
- KAI FROHBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY A CONTACT ETC...
- Publication number 20070077741
- Publication date Apr 5, 2007
- KAI FROHBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR REDUCING ETCH DAMAGE DURING THE FORMATION OF VIAS AND...
- Publication number 20070004214
- Publication date Jan 4, 2007
- Matthias Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for enhancing process flexibility during the formation of...
- Publication number 20060172525
- Publication date Aug 3, 2006
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electrical connections in a semiconductor structure
- Publication number 20060141775
- Publication date Jun 29, 2006
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS

Matthias Schaller

Person

Patents Grantslast 30 patents

Method and system for particles analysis in microstructure devices...

Method and system for advanced process control in an etch system by...

Semiconductor device comprising self-aligned contact elements

Dual contact metallization including electroless plating in a semic...

Repair of damaged surface areas of sensitive low-K dielectrics of m...

Re-establishing surface characteristics of sensitive low-k dielectr...

Method and system for extracting samples after patterning of micros...

Method and system for quantitative inline material characterization...

Establishing a hydrophobic surface of sensitive low-k dielectrics o...

Method of reducing erosion of a metal cap layer during via patterni...

Method for passivating exposed copper surfaces in a metallization l...

Technique for enhancing the fill capabilities in an electrochemical...

High yield plasma etch process for interlayer dielectrics

Method of reducing erosion of a metal cap layer during via patterni...

Technique for patterning differently stressed layers formed above t...

Technique for enhancing process flexibility during the formation of...

Technique for forming a dielectric etch stop layer above a structur...

Method and system for advanced process control in an etch system by...

Method for reducing etch-induced process uniformities by omitting d...

Semiconductor device comprising a contact structure with increased...

Technique for increasing adhesion of metallization layers by provid...

Technique for creating different mechanical strain by forming a con...

Metallization layer of a semiconductor device having differently th...

Method for reducing resist poisoning during patterning of silicon n...

Technique for creating different mechanical stress in different cha...

Technique for creating different mechanical strain by a contact etc...

Method of increasing the etch selectivity in a contact structure of...

Technique for creating different mechanical strain in different cha...

Technique for controlling mechanical stress in a channel region by...

Technique for reducing etch damage during the formation of vias and...

Patents Applicationslast 30 patents

Repair of Damaged Surface Areas of Sensitive Low-K Dielectrics of M...

SEMICONDUCTOR DEVICE COMPRISING SELF-ALIGNED CONTACT ELEMENTS

Method and System for Extracting Samples After Patterning of Micros...

Re-Establishing Surface Characteristics of Sensitive Low-K Dielectr...

METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...

DUAL CONTACT METALLIZATION INCLUDING ELECTROLESS PLATING IN A SEMIC...

ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRICS O...

RE-ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRIC...

METHOD AND SYSTEM FOR MATERIAL CHARACTERIZATION IN SEMICONDUCTOR PR...

MATERIAL STRIPPING IN SEMICONDUCTOR DEVICES BY EVAPORATION

METHOD AND SYSTEM FOR PARTICLES ANALYSIS IN MICROSTRUCTURE DEVICES...

METHOD AND SYSTEM FOR ADVANCED PROCESS CONTROL IN AN ETCH SYSTEM BY...

METHOD FOR PASSIVATING EXPOSED COPPER SURFACES IN A METALLIZATION L...

METHOD AND SYSTEM FOR QUANTITATIVE INLINE MATERIAL CHARACTERIZATION...

METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...

HIGH YIELD PLASMA ETCH PROCESS FOR INTERLAYER DIELECTRICS

TECHNIQUE FOR PATTERNING DIFFERENTLY STRESSED LAYERS FORMED ABOVE T...

METHOD FOR REDUCING ETCH-INDUCED PROCESS UNIFORMITIES BY OMITTING D...

METHOD FOR REDUCING RESIST POISONING DURING PATTERNING OF SILICON N...

METALLIZATION LAYER OF A SEMICONDUCTOR DEVICE HAVING DIFFERENTLY TH...

METHOD AND SYSTEM FOR ADVANCED PROCESS CONTROL IN AN ETCH SYSTEM BY...

METHOD OF INCREASING THE ETCH SELECTIVITY IN A CONTACT STRUCTURE OF...

SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE WITH INCREASED...

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LA...

TECHNIQUE FOR INCREASING ADHESION OF METALLIZATION LAYERS BY PROVID...

TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY FORMING A CON...

TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY A CONTACT ETC...

TECHNIQUE FOR REDUCING ETCH DAMAGE DURING THE FORMATION OF VIAS AND...

Technique for enhancing process flexibility during the formation of...

Method of forming electrical connections in a semiconductor structure